公开(公告)号：US6154364A

公开(公告)日：2000-11-28

申请号：US197093

申请日：1998-11-19

Applicant: Troy M. Girrens ,  Robert Gordon Fessenden ,  Dianne K. Ruch ,  Thomas P. Douglas ,  Timothy J. Guse ,  Billy R. Colwell ,  Sidney T. Faulkner

Inventor： Troy M. Girrens ,  Robert Gordon Fessenden ,  Dianne K. Ruch ,  Thomas P. Douglas ,  Timothy J. Guse ,  Billy R. Colwell ,  Sidney T. Faulkner

IPC: H01L23/36 ,  H05K3/34 ,  H05K3/40 ,  H05K7/20

CPC classification number: H01L23/36 ,  H05K3/341 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2203/0545 ,  H05K3/3426 ,  H05K3/3484 ,  H05K3/4015 ,  Y02P70/613

Abstract: A process and circuit board assembly by which a single soldering operation produces a multicomponent stack capable of dissipating heat from a power IC chip (12) mounted to a substrate (10). The circuit board assembly generally includes a number of conductors (16) on the substrate (10), with the conductors (16) being spaced apart and substantially parallel to each other. A heat spreader (14) is soldered to at least some of the conductors (16), and the chip (12) is soldered to the heat spreader (14). With this structure, heat is conducted from the chip (12) through the heat spreader (14) and conductors (16) to the substrate (10). To maintain proper orientation of the components (12, 14, 16) relative to each other during a single soldering operation, the components (12, 14, 16) are equipped with complementary features.

Abstract translation: 一种工艺和电路板组件，其中单个焊接操作产生能够从安装到衬底（10）的功率IC芯片（12）散热的多组件堆叠。 电路板组件通常在衬底（10）上包括多个导体（16），其中导体（16）彼此间隔开并且基本上彼此平行。 散热器（14）被焊接到至少一些导体（16），并且芯片（12）被焊接到散热器（14）。 利用这种结构，热量从芯片（12）通过散热器（14）和导体（16）传导到衬底（10）。 为了在单次焊接操作期间保持部件（12,14,16）相对于彼此的适当取向，部件（12,14,16）配备有互补特征。

公开(公告)号：US5816868A

公开(公告)日：1998-10-06

申请号：US600112

申请日：1996-02-12

Applicant: Janos Legrady ,  Ronald M. Fredriks

Inventor： Janos Legrady ,  Ronald M. Fredriks

IPC: H01R4/02 ,  H01R12/57 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01R12/57 ,  H05K3/3426 ,  H01R4/02 ,  H05K2201/1084 ,  H05K2201/10916 ,  Y02P70/613 ,  Y10S439/94

Abstract: One and two piece surface mount pin constructions include excess solder receiving channels. In the one piece construction an elongate channel is provided through a tubular pin which is flared or swaged at the lower end to form a base. In the two piece construction a solid pin is provided at a lower end with a uniform cross section in the form of a regular polygon, such as a square, hexagon or octagon. The resulting edges are press-fit against an internal surface of a sleeve which is also swaged at a lower end to form a base. The spaces between the sleeve and the flat or convex surfaces on the captured end of the pin provide the solder-receiving channels. A bead or shoulder on the pins can provide a stop for a vacuum nozzle. When a flared upper lip is used for this purpose it can also serve as a reservoir or well to receive excess solder beyond the amount that can be received in the channels.

Abstract translation: 一个和两个表面安装针结构包括多余的焊料接收通道。 在单件式结构中，通过管状销提供细长通道，管状销在下端开口或模锻以形成底座。 在两件式的构造中，实心销设置在下端，其形状为均匀的横截面，如正方形，六边形或八边形。 所得到的边缘压合在套筒的内表面上，套筒的内表面也在下端锻造以形成底座。 套筒与捕获端的平面或凸面之间的空间提供焊料接收通道。 销上的珠或肩可以为真空喷嘴提供停止。 当为此目的使用扩口式上唇时，它也可用作储存器或井，以接收超过可在通道中接收的量的多余焊料。

公开(公告)号：US5788544A

公开(公告)日：1998-08-04

申请号：US709282

申请日：1996-09-06

Applicant: Karl-Gerd Drekmeier ,  Gerhard Winter

Inventor： Karl-Gerd Drekmeier ,  Gerhard Winter

IPC: H01R12/57 ,  H01R43/02 ,  H01R43/16 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34 ,  H01R9/24

CPC classification number: H01R12/57 ,  H01R43/0263 ,  H05K3/3426 ,  H05K1/0271 ,  H05K2201/10757 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A multi-pole, variable SMD terminal arrangement mountable on a circuit substrate has a stamped metallic element with at least three terminal poles connected with one another by means of a common connecting strip that can be removed after the soldering, the terminal poles having variably formed contact areas on the substrate side that are respectively deflected on one side from the plane of the connecting strip in basically z-shaped fashion, so that the contact areas deflected towards opposite sides form a support base for the terminal arrangement during assembly and soldering. The contact areas comprise end areas that form a contact plane that is coplanar to the substrate during assembly and soldering.

Abstract translation: 安装在电路基板上的多极可变SMD端子布置具有冲压的金属元件，其具有至少三个端子极，其通过可在焊接之后被去除的公共连接条彼此连接，端子极可变地形成 基板侧的接触区域分别以基本上z形的方式从连接条的平面偏转在一侧，使得朝向相对侧偏转的接触区域在组装和焊接期间形成用于端子装置的支撑基座。 接触区域包括在组装和焊接期间形成与基底共面的接触平面的端部区域。

公开(公告)号：US5531860A

公开(公告)日：1996-07-02

申请号：US434110

申请日：1995-05-04

Applicant: Tung L. Li

Inventor： Tung L. Li

IPC: H01L23/495 ,  H05K3/34 ,  B44C1/22

CPC classification number: H05K3/3426 ,  H01L23/49548 ,  H01L2924/0002 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T29/49121

Abstract: A lead frame for used in a surface mount package is provided leads which are each notched at the tip of the lead to reduce the exposed area of based metal and to increase the area on which solder wetting can take place when bonded to conductive traces of a printed circuit board. In one embodiment, the thickness of the tip of the lead is reduced to further the area over which soldering wetting takes place. In that embodiment, the exposed base metal area is reduced by 85 per cent.

Abstract translation: 用于表面安装封装的引线框架提供了引线，其在引线的尖端处切口以减少基底金属的暴露面积并且增加当焊接到导电迹线上时可发生焊料润湿的区域 印刷电路板。 在一个实施例中，引线的尖端的厚度减小到进一步发生焊接润湿的区域。 在该实施例中，暴露的贱金属面积减少了85％。

公开(公告)号：US4858073A

公开(公告)日：1989-08-15

申请号：US170546

申请日：1988-03-21

Applicant: Vernon C. Gregory

Inventor： Vernon C. Gregory

IPC: H01L23/14 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K3/0061 ,  H01L23/142 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/189 ,  H01L2224/32225 ,  H01L2924/13033 ,  H01L2924/3011 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/066 ,  H05K2201/09018 ,  H05K2201/1034 ,  H05K2201/10689 ,  H05K2201/1084 ,  H05K2201/2036 ,  H05K2203/0369 ,  H05K2203/1115 ,  H05K2203/175 ,  H05K2203/302 ,  H05K3/3405 ,  H05K3/341

Abstract: A semiconductor fabrication having thermal characteristics comparable to hybrid ceramic packages comprises a flexible copper foil printed circuit on a thin polyimide film layer thermally laminated to a metal surface, such as aluminum, with a high temperature thermal plastic, such as polyetherimide. A semiconductor die is attached to a relatively thick metal heat spreader which in turn is attached to at least a portion of the copper foil. The resultant structure is a semiconductor package which has a thermal performance comparable to that of typical hybrid ceramic packages.

Abstract translation: 具有与混合陶瓷封装相当的热特性的半导体制造包括在热层压到例如铝的金属表面上的薄聚酰亚胺膜层上的柔性铜箔印刷电路与诸如聚醚酰亚胺的高温热塑性塑料。 半导体管芯附着在较厚的金属散热器上，该散热器又连接至铜箔的至少一部分。 所得结构是具有与典型的混合陶瓷封装相当的热性能的半导体封装。

公开(公告)号：US11674977B2

公开(公告)日：2023-06-13

申请号：US17682769

申请日：2022-02-28

Applicant: JF MICROTECHNOLOGY SDN. BHD

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee ,  Grace Ann Nee Yee

IPC: H05K1/02 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/0466 ,  G01R1/0735 ,  G01R1/07364 ,  H05K1/0268 ,  H05K1/0283 ,  H05K1/0296 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10704 ,  H05K2201/10795

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

公开(公告)号：US09888596B2

公开(公告)日：2018-02-06

申请号：US15163093

申请日：2016-05-24

Applicant: Denso Corporation

Inventor： Taijirou Momose

IPC: H05K7/14 ,  H05K5/02 ,  B60L11/18 ,  H05K1/14 ,  H05K3/36 ,  H05K3/34

CPC classification number: H05K5/0239 ,  B60L11/18 ,  H05K1/144 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1432 ,  H05K2201/042 ,  H05K2201/09127 ,  H05K2201/10318 ,  H05K2201/10833 ,  H05K2201/1084

Abstract: A power converter includes a case body provided with a device main body part having a power conversion part accommodated therein, a lid member covering an aperture of the case body, a first substrate fixed to the case body, a second substrate fixed to the lid member, the first substrate and the second substrate being fixed therein and a connection member electrically connecting the first substrate and the second substrate.

公开(公告)号：US08884167B2

公开(公告)日：2014-11-11

申请号：US13346085

申请日：2012-01-09

Applicant: Kazuya Miyasaka ,  Kouji Kobayashi ,  Akihito Fukuzawa

Inventor： Kazuya Miyasaka ,  Kouji Kobayashi ,  Akihito Fukuzawa

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion in a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board.

Abstract translation: 印刷电路板单元包括：印刷电路板，包括具有彼此相对的第一和第二内表面的通孔; 终端销，其包括插入到所述通孔中的插入部; 焊料填充到通孔中，并且将印刷电路板与端子销接合，其中插入部分包括抵靠第一内表面的基部，以及突出部分，包括：从基部突出到第二内部的突出表面 表面并邻接第二内表面; 以及位于所述突起表面的后侧并与所述第一内表面间隔开的凹部表面，并且所述突出部分在所述印刷电路板的厚度方向上的长度大于所述印刷电路板的厚度。

公开(公告)号：US08497429B2

公开(公告)日：2013-07-30

申请号：US12727146

申请日：2010-03-18

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01B5/00 ,  H05K1/11 ,  H01R12/00 ,  H01R4/18 ,  H01R4/02

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

公开(公告)号：US08309865B2

公开(公告)日：2012-11-13

申请号：US12617016

申请日：2009-11-12

Applicant: Akihito Maegawa ,  Shinyu Nagashima

Inventor： Akihito Maegawa ,  Shinyu Nagashima

IPC: H01L23/28

CPC classification number: H05K3/325 ,  F16H61/0006 ,  H05K3/202 ,  H05K5/0034 ,  H05K5/0082 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10401 ,  H05K2201/1084 ,  Y10T428/31678

Abstract: A sensor unit 10 is provided with a metal plate 20 and a resin molded article 30 is formed integral to the metal plate 20. Busbars 50 are arranged in the resin molded article 30 and include exposed end portions 52 exposed from the resin molded article 30. Connecting portions 52A are provided at the leading ends of the exposed end portions 52 and are riveted to an oil temperature sensor 41 on the metal plate 20. Opposite lateral sides of the exposed end portions 52 are partly in contact with the resin molded article 30.

Abstract translation: 传感器单元10设置有金属板20，并且树脂模制品30与金属板20一体形成。在树脂模制品30中布置有母线50，并且包括从树脂模制品30露出的暴露端部52。 连接部分52A设置在暴露端部52的前端，并铆接在金属板20上的油温传感器41上。露出端部52的相对侧面部分地与树脂模塑制品30接触。