公开(公告)号：US07497366B2

公开(公告)日：2009-03-03

申请号：US11758752

申请日：2007-06-06

Applicant: S. Jay Chey ,  Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： S. Jay Chey ,  Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: B23K31/02

CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

Abstract: A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.

Abstract translation: 提供了一种系统和方法，用于将导电接合材料注射到真空室内的模具中的多个空腔中。 模具和填充头位于真空室内，其中模具包括多个空腔。 在真空室内产生真空，从而从腔室和空腔中除去空气。 可选地，当填充头与模具基本接触时，将旋转运动提供给模具和填充头中的至少一个。 当在真空室中保持真空时，导电接合材料被迫从灌装头朝向模具，并进入至少一个空腔中。

公开(公告)号：US20090004840A1

公开(公告)日：2009-01-01

申请号：US11769389

申请日：2007-06-27

Applicant: Matthew J. Farinelli ,  Steven Cordes ,  Donna S. Nielsen ,  Samuel Roy McKnight ,  Jay S. Chey ,  Peter A. Gruber ,  Joanna Rosner

Inventor： Matthew J. Farinelli ,  Steven Cordes ,  Donna S. Nielsen ,  Samuel Roy McKnight ,  Jay S. Chey ,  Peter A. Gruber ,  Joanna Rosner

IPC: H01L21/441 ,  H01B13/00

CPC classification number: H05K3/3457 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1308 ,  H01L2224/13147 ,  H01L2224/13171 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/00

Abstract: A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed.

Abstract translation: 一种制造焊料转移模具的方法包括用掩蔽剂掩蔽衬底。 将图案转移到基板掩模。 蚀刻掩蔽的基板直到形成第一体积的空腔。 选择性地涂覆第一体积的空腔。 蚀刻掩蔽的基板直到形成第二体积的空腔。

公开(公告)号：US20080285136A1

公开(公告)日：2008-11-20

申请号：US12140676

申请日：2008-06-17

Applicant: Lawrence Jacobowitz ,  Stephen L. Buchwalter ,  Casimer DeCusatis ,  Peter A. Gruber ,  Da-Yuan Shih

Inventor： Lawrence Jacobowitz ,  Stephen L. Buchwalter ,  Casimer DeCusatis ,  Peter A. Gruber ,  Da-Yuan Shih

IPC: G02B27/10

CPC classification number: H01L27/14685 ,  B29D11/00365 ,  B29D11/00461 ,  B82Y30/00 ,  G02B3/0018 ,  G02B3/0056 ,  G02F1/137 ,  G02F1/29 ,  H01L27/14627 ,  H01L31/02327 ,  H01L33/58

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

Abstract translation: 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。

公开(公告)号：US20080251281A1

公开(公告)日：2008-10-16

申请号：US11733840

申请日：2007-04-11

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H05K1/03 ,  H01K3/10

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电气结构和成型方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US07399421B2

公开(公告)日：2008-07-15

申请号：US11195147

申请日：2005-08-02

Applicant: Lawrence Jacobowitz ,  Stephen L. Buchwalter ,  Casimer DeCusatis ,  Peter A. Gruber ,  Da-Yuan Shih

Inventor： Lawrence Jacobowitz ,  Stephen L. Buchwalter ,  Casimer DeCusatis ,  Peter A. Gruber ,  Da-Yuan Shih

IPC: B29D11/00

CPC classification number: H01L27/14685 ,  B29D11/00365 ,  B29D11/00461 ,  B82Y30/00 ,  G02B3/0018 ,  G02B3/0056 ,  G02F1/137 ,  G02F1/29 ,  H01L27/14627 ,  H01L31/02327 ,  H01L33/58

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

Abstract translation: 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。

公开(公告)号：US20080014406A1

公开(公告)日：2008-01-17

申请号：US11484124

申请日：2006-07-11

Applicant: S. Jay Chey ,  Peter A. Gruber

Inventor： S. Jay Chey ,  Peter A. Gruber

IPC: C23C16/00 ,  B32B3/10

CPC classification number: B23K3/0638 ,  B23K2101/40 ,  Y10T428/24273

Abstract: An injection molded soldering head includes a substrate that is flexible (compliant) and stable at high temperature. The substrate includes an aperture therethrough for holding and dispensing solder onto a mold and a low friction coating on the bottom side of the substrate to provide a lower friction surface for the head.

Abstract translation: 注射成型的焊接头包括柔性（柔顺）并在高温下稳定的基底。 衬底包括穿过其中的孔，用于将焊料保持和分配到模具上，并且在衬底的底侧上具有低摩擦涂层，以为头部提供较低的摩擦表面。

公开(公告)号：US06708873B2

公开(公告)日：2004-03-23

申请号：US10191378

申请日：2002-07-08

Applicant: Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

Inventor： Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

IPC: B23K3102

CPC classification number: H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  H01L2924/00

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e., at least 5:1 to be filled with an electrically conductive material such as a solder or a conductive polymer such that vias or interconnects can be formed in electronic substrates. The present invention apparatus and method can be advantageously used in fabricating substrates for display panels by forming conductive vias and interconnects for placing a voltage potential on pixel display elements formed on the display panels.

Abstract translation: 公开了一种用于填充电子基板中的高纵横比孔的装置和方法，其可以有利地用于填充具有大于5:1的纵横比的孔。 在装置中，填充板和真空板与连接装置结合使用，使得在两个板之间形成间隙以容纳配备有高纵横比通孔的电子基板。 填充板配备有注入槽，而真空板配备有真空槽，使得当基板夹在其中时，通孔可以从空气排出并同时从液体的底侧和顶侧注入液体 底物。 本发明的新型设备和方法允许填充具有小直径，即小至10um，高纵横比（即至少5:1）的通孔，以填充诸如焊料的导电材料 或导电聚合物，使得可以在电子基板中形成通孔或互连。 本发明的装置和方法可以有利地用于制造用于显示面板的基板，通过形成用于在形成在显示面板上的像素显示元件上放置电压电位的导电通孔和互连。

公开(公告)号：US06461136B1

公开(公告)日：2002-10-08

申请号：US09383325

申请日：1999-08-26

Applicant: Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

Inventor： Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

IPC: H05K310

CPC classification number: H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  H01L2924/00

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e., at least 5:1 to be filled with an electrically conductive material such as a solder or a conductive polymer such that vias or interconnects can be formed in electronic substrates. The present invention apparatus and method can be advantageously used in fabricating substrates for display panels by forming conductive vias and interconnects for placing a voltage potential on pixel display elements formed on the display panels.

Abstract translation: 公开了一种用于填充电子基板中的高纵横比孔的装置和方法，其可以有利地用于填充具有大于5:1的纵横比的孔。 在装置中，填充板和真空板与连接装置结合使用，使得在两个板之间形成间隙以容纳配备有高纵横比通孔的电子基板。 填充板配备有注入槽，而真空板配备有真空槽，使得当基板夹在其中时，通孔可以从空气排出并同时从液体的底侧和顶侧注入液体 底物。 本发明的新型设备和方法允许填充具有小直径，即小至10um，高纵横比（即至少5:1）的通孔，以填充诸如焊料的导电材料 或导电聚合物，使得可以在电子基板中形成通孔或互连。 本发明的装置和方法可以有利地用于制造用于显示面板的基板，通过形成用于在形成在显示面板上的像素显示元件上放置电压电位的导电通孔和互连。

公开(公告)号：US5388635A

公开(公告)日：1995-02-14

申请号：US883051

申请日：1992-05-08

Applicant: Peter A. Gruber ,  Arthur R. Zingher

Inventor： Peter A. Gruber ,  Arthur R. Zingher

IPC: F28F3/12 ,  F28F27/02 ,  H01L23/433 ,  H01L23/473 ,  F28F7/00

CPC classification number: F28F9/0278 ,  F28F3/12 ,  H01L23/433 ,  H01L23/473 ,  F28D2021/0029 ,  F28F2210/02 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: A cooling hat for transferring heat from a surface or plurality of heat generating components to a flowing fluid includes a coldsheet, a plurality of manifold layers and springs. The coldsheet is typically a medium-thin metal sheet usually with fine fins or grooves to readily transfer heat to a coolant. Each manifold layer is typically molded rubber with conduits for coolant supply and return. The conduits form a branched hierarchy. The fluid flow is highly parallel and streamlined which achieves ample flow with small hydraulic differential pressure. Springs gently urge the cooling hat against the thermal joints hence against the components. The hat can bend slightly to conform to a curved surface. Typically some compliance is provided by the hat, and other compliance is provided by a thermal joint between each component and the coldsheet. The system is highly self-aligned for counteracting variations.

Abstract translation: 用于将热量从表面或多个发热部件传递到流动流体的冷却帽包括冷片，多个歧管层和弹簧。 冷片通常是中等厚度的金属片，通常具有细的翅片或凹槽，以便将热量传递给冷却剂。 每个歧管层通常是具有用于冷却剂供应和返回的导管的模制橡胶。 导管形成分支层级。 流体流动是高度平行和流线型的，其具有小的液压差压的充足的流量。 弹簧轻轻地将冷却帽推向热接头，从而抵抗部件。 帽子可以稍微弯曲以符合曲面。 通常，帽子提供一些柔顺性，并且通过每个部件和冷片之间的热接头来提供其它柔顺性。 该系统高度自我对齐以抵消变化。

公开(公告)号：US09082754B2

公开(公告)日：2015-07-14

申请号：US13565982

申请日：2012-08-03

Applicant: Peter A. Gruber ,  Jae-Woong Nah

Inventor： Peter A. Gruber ,  Jae-Woong Nah

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/00 ,  B23K3/06 ,  H01L23/498 ,  H01L21/48 ,  B23K1/00 ,  B23K26/38 ,  B23K26/40

CPC classification number: H01L23/48 ,  B23K1/0016 ,  B23K3/0607 ,  B23K3/0623 ,  B23K26/384 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  H01L21/4853 ,  H01L23/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11436 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13551 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A method and system of producing metal cored solder structures on a substrate which includes: providing a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface; positioning a carrier beneath the bottom of the decal, the carrier having cavities located in alignment with the apertures of the decal; positioning the decal on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities; positioning a plurality of metal elements in the feature cavities; filling the feature cavities with molten solder and cooling the solder; separating the decal from the carrier to partially expose metal core solder contacts; positioning the metal core solder contacts on receiving elements of a substrate; and exposing the metal core solder contacts on the substrate.

Abstract translation: 一种在衬底上制造金属芯焊料结构的方法和系统，包括：提供具有多个孔的贴花，所述孔从顶表面到底表面渐缩; 将载体定位在贴花底部的下方，载体具有与贴花的孔对准的空腔; 将贴花定位在具有贴花底表面的载体上，与载体顶表面接触以形成由贴花孔和载体空腔限定的特征空腔; 将多个金属元件定位在特征腔中; 用熔融焊料填充特征腔并冷却焊料; 将贴花从载体分离以部分地暴露金属芯焊料触点; 将金属芯焊料触点定位在基板的接收元件上; 并将金属芯焊料触点暴露在基板上。