公开(公告)号：US09474602B2

公开(公告)日：2016-10-25

申请号：US14068284

申请日：2013-10-31

Applicant: WASEDA UNIVERSITY

Inventor： Mitsuo Umezu ,  Hitoshi Kasegawa

IPC: A61F2/24 ,  A61B17/32

CPC classification number: A61F2/2412 ,  A61B17/32 ,  A61F2/2415 ,  A61F2240/005 ,  A61F2250/0082

Abstract: An artificial mitral valve has a ring, an anterior cusp-side region, a posterior cusp-side region and a valve leaflet connected along an outer edge of the ring. The valve leaflet includes an anterior cusp forming member connected to the anterior cusp-side region and a posterior cusp forming member connected to the posterior cusp-side region. The anterior cusp forming member is provided with has an upper edge joined to the ring and a lower edge that forms a bifurcated portion. The upper edge is made up of a pair of right and left edges that incline inward and upward from the right and left sides, and a curved edge interposed between the inclined edges that curves along the anterior cusp-side region. The posterior cusp forming member has an upper edge joined to the ring and a lower edge that forms a bifurcated portion.

Abstract translation: 人造二尖瓣具有环，前尖部侧区域，后尖端侧区域和沿着环的外边缘连接的瓣膜小​​叶。 瓣叶包括连接到前尖部侧区域的前牙尖形成构件和连接到后尖端侧区域的后牙尖形成构件。 前牙尖形成构件具有连接到环的上边缘和形成分叉部分的下边缘。 上边缘由从左右侧向内和向上倾斜的一对左右边缘构成，并且设置在沿着前尖点侧区域弯曲的倾斜边缘之间的弯曲边缘。 后牙尖形成构件具有连接到环的上边缘和形成分叉部分的下边缘。

公开(公告)号：US20150363230A1

公开(公告)日：2015-12-17

申请号：US14761789

申请日：2014-01-15

Applicant: WASEDA UNIVERSITY

Inventor： Hironori Kasahara ,  Keiji Kimura ,  Akihiro Hayashi ,  Hiroki Mikami ,  Yohei Kanehagi ,  Dan Umeda ,  Mitsuo Sawada

IPC: G06F9/48 ,  G06F9/45

CPC classification number: G06F9/4881 ,  G06F8/456

Abstract: A method of extracting parallelism of an original program by a computer includes: a process of determining whether or not a plurality of macro tasks to be executed after a condition of one conditional branch included in the original program is satisfied are executable in parallel; and a process of copying the conditional branch regarding which the macro tasks are determined to be executable in parallel, to generate a plurality of conditional branches.

Abstract translation: 一种提取计算机原始程序的并行性的方法包括：执行在原始程序中包括的一个条件分支的条件被满足之后是否执行多个宏任务的处理，并行执行; 以及并行地确定宏任务被确定为可执行的条件分支的过程，以生成多个条件分支。

公开(公告)号：US20150351285A1

公开(公告)日：2015-12-03

申请号：US14612934

申请日：2015-02-03

Applicant: HUAWEI TECHNOLOGIES CO., LTD. ,  WASEDA UNIVERSITY

Inventor： Suguru NODA ,  Nuri NA ,  Mizuhisa NIHEI

IPC: H05K7/20 ,  C23C16/26 ,  C23C14/34 ,  C01B31/02

CPC classification number: H05K7/20509 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B2202/08 ,  C23C16/0272 ,  C23C16/26 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  Y10S977/722 ,  Y10S977/843 ,  Y10S977/902 ,  H01L2924/00

Abstract: A heat dissipation structure and a synthesizing method thereof are provided by the present disclosure. The method comprises: providing a metal foil; forming a deposition substrate on a first surface of the metal foil, wherein the deposition substrate includes a barrier layer disposed on the metal foil and a catalyst layer disposed on the barrier layer, such that catalyst in the catalyst layer is prevented from diffusing into the metal foil; and synthesizing a carbon nanotube array on the deposition substrate formed on the first surface. The method provided by the present disclosure can increase density of the CNTs in the heat dissipation structure.

Abstract translation: 散热结构及其合成方法由本发明提供。 该方法包括：提供金属箔; 在金属箔的第一表面上形成沉积衬底，其中沉积衬底包括设置在金属箔上的阻挡层和设置在阻挡层上的催化剂层，使得催化剂层中的催化剂不被扩散到金属中 挫败; 以及在形成在第一表面上的沉积基板上合成碳纳米管阵列。 通过本公开提供的方法可以增加散热结构中的CNT的密度。

公开(公告)号：US20150303533A1

公开(公告)日：2015-10-22

申请号：US14433447

申请日：2013-10-04

Applicant: WASEDA UNIVERSITY

Inventor： Tetsuya OSAKA ,  Toshiyuki MOMMA ,  Tokihiko YOKOSHIMA ,  Daikichi MUKOYAMA ,  Hiroki NARA

IPC: H01M10/48 ,  G01R31/36 ,  H01M10/0525

CPC classification number: H01M10/486 ,  G01R31/3651 ,  G01R31/3662 ,  G01R31/3675 ,  G01R31/3679 ,  H01M10/0525 ,  H01M10/4207 ,  H01M10/482

Abstract: A battery system includes: a secondary battery; a memory portion that stores information which includes a measurement frequency, a measurement temperature, and an initial limiting capacitance of one secondary battery; a temperature measuring section; a power supply section which applies an AC signal of 0.5 mHz to 10 mHz, to the secondary battery at 40° C. to 70° C.; a measuring portion which measures an impedance of the secondary battery by the AC signal; and a calculating portion that calculates the degree of degradation of the secondary battery.

Abstract translation: 电池系统包括：二次电池; 存储部，其存储包含一个二次电池的测量频率，测量温度和初始极限电容的信息; 温度测量部; 在40℃〜70℃下向二次电池施加0.5mHz〜10mHz的交流信号的电源部。 测量部分，其通过AC信号测量二次电池的阻抗; 以及计算部分，其计算二次电池的劣化程度。

公开(公告)号：US20150287992A1

公开(公告)日：2015-10-08

申请号：US14671416

申请日：2015-03-27

Applicant: WASEDA UNIVERSITY

Inventor： Tetsuya OSAKA ,  Toshiyuki MOMMA ,  Tokihiko YOKOSHIMA ,  Hiroki NARA

IPC: H01M4/62 ,  H01M10/052 ,  H01M4/58

CPC classification number: H01M4/62 ,  H01M4/13 ,  H01M4/366 ,  H01M4/38 ,  H01M10/052

Abstract: A lithium sulfur secondary battery includes a positive electrode containing a sulfur-based positive electrode active substance, an electrolytic solution, a negative electrode containing a negative electrode active substance that occludes and releases lithium, and a polymeric film that covers a surface of the positive electrode and allows lithium cations to pass but does not allow polysulfide anions to pass.

Abstract translation: 锂硫二次电池包括含有硫系正极活性物质的正极，电解液，含有阻塞并释放锂的负极活性物质的负极和覆盖正极的表面的聚合物膜 并允许锂阳离子通过，但不允许多硫化物阴离子通过。

公开(公告)号：US09059003B2

公开(公告)日：2015-06-16

申请号：US14364555

申请日：2013-02-22

Applicant: NIPPON MICROMETAL CORPORATION ,  WASEDA UNIVERSITY

Inventor： Kohei Tatsumi ,  Takashi Yamada ,  Daizo Oda

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/03444 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/04042 ,  H01L2224/05007 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/4312 ,  H01L2224/43125 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45005 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45672 ,  H01L2224/45684 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48818 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48869 ,  H01L2224/48871 ,  H01L2224/48872 ,  H01L2224/48884 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/20103 ,  H01L2924/351 ,  H01L2924/00015 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01202 ,  H01L2924/20107 ,  H01L2924/20106 ,  H01L2224/29099 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2924/01049

Abstract: It is an object of the present invention to provide a power semiconductor device, which is capable of being operable regardless of thermal stress generation, reducing a heat generation from wire, securing the reliability of bonding portion when the device is used for dealing with a large amount current and/or under a high temperature atmosphere, a method of manufacturing the device and a bonding wire. In a power semiconductor device in which a metal electrode (die electrode 3) on a power semiconductor die 2 and another metal electrode (connection electrode 4) are connected by metal wire 5 using wedge bonding connection, the metal wire is Ag or Ag alloy wire of which diameter is greater than 50 μm and not greater than 2 mm and the die 3 has thereon one or more metal and/or alloy layers, each of the layer(s) being 50 Å or more in thickness and a metal for the layer is selected from Ni, Cr, Cu, Pd, V, Ti, Pt, Zn, Ag, Au, W and Al.

Abstract translation: 本发明的目的是提供一种功率半导体器件，该功率半导体器件能够在不受热应力产生的情况下运行，从而减少线材的发热，确保当器件用于处理大的时候的接合部分的可靠性 量电流和/或在高温气氛下，制造该装置的方法和接合线。 在功率半导体器件中，功率半导体管芯2上的金属电极（管芯电极3）和另一个金属电极（连接电极4）通过金属线5使用楔形接合连接，金属线是Ag或Ag合金线 其直径大于50μm且不大于2mm，并且模具3上具有一个或多个金属和/或合金层，每个层的厚度均为50或更大，并且该层的金属 选自Ni，Cr，Cu，Pd，V，Ti，Pt，Zn，Ag，Au，W和Al。

公开(公告)号：US20150145953A1

公开(公告)日：2015-05-28

申请号：US14383776

申请日：2013-03-15

Applicant: WASEDA UNIVERSITY ,  KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION

Inventor： Masakatsu Fujie ,  Yo Kobayashi ,  Kazuya Kawamura ,  Hiroto Seno ,  Yuya Nishio ,  Makoto Hashizume ,  Satoshi Ieiri ,  Kazutaka Toyoda

IPC: A61B1/00 ,  G02B23/24 ,  G06T7/00 ,  A61B19/00

CPC classification number: A61B1/00009 ,  A61B1/0005 ,  A61B1/018 ,  A61B1/313 ,  A61B90/37 ,  A61B2034/2055 ,  A61B2090/365 ,  G02B23/2415 ,  G02B23/2484 ,  G06T7/33 ,  G06T2207/10012 ,  G06T2207/10016 ,  G06T2207/10021 ,  G06T2207/10028 ,  G06T2207/10048 ,  G06T2207/10068 ,  G06T2207/20221 ,  G06T2207/30004 ,  G06T2207/30208

Abstract: An image completion system includes a first endoscope for obtaining an operating field image, a second endoscope for imaging the object space in a line-of-sight direction different from that of the first endoscope to obtain a completing image, a first device for measuring separating distances between a reference point and a large number of set points that are set in the object space, a second device for measuring three-dimensional positions of the endoscopes, and an image processing device for obtaining, image information on cutoff regions in the object space that are hidden on the depth sides of surgical instruments by imaging the surgical instruments in the operating field image together with the object space, and for replacing image information on the surgical instruments S in the operating field image with the obtained image information or superimposing the obtained image information onto the image information on the surgical instruments.

Abstract translation: 图像完成系统包括用于获得操作场图像的第一内窥镜，用于在与第一内窥镜不同的视线方向成像物体空间以获得完成图像的第二内窥镜，用于测量分离的第一装置 在对象空间中设置的基准点与大量设定点之间的距离，用于测量内窥镜的三维位置的第二装置，以及用于获得对象空间中截止区域的图像信息的图像处理装置 通过将手术器械与对象空间一起成像在手术区域图像中，并将其与所获取的图像信息一起替换在操作区域图像中的外科器械S上的图像信息，或将所获得的图像信息叠加，从而隐藏在手术器械的深度侧上 图像信息到手术器械上的图像信息上。

公开(公告)号：US20150140293A1

公开(公告)日：2015-05-21

申请号：US14398616

申请日：2013-08-01

Applicant: Waseda University ,  Fuji Electric Co., Ltd.

Inventor： Yoshimichi Ohki ,  Yuichi Hirose ,  Genta Wada ,  Toshikatsu Tanaka ,  Kenji Okamoto

IPC: H05K1/05 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/056 ,  C09D7/67 ,  C09D7/68 ,  C09D7/69 ,  C09D163/00 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0769 ,  H05K2201/10106 ,  Y10T428/24893

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 μm with an average particle diameter (D50) of 500 nm to 20 μm, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract translation: 高导热性印刷电路板通过抑制铜离子的洗脱来防止电化学迁移。 印刷电路板是依次包括具有绝缘树脂层和铜箔层的金属基板的金属基印刷电路板。 在印刷电路板中，绝缘树脂层包含由平均粒径（D50）为1nm〜300nm的粒径为0.1nm〜600nm的无机粒子构成的第一无机填充材料和由 平均粒径（D50）为500nm〜20μm的粒径为100nm〜100μm的无机粒子，第一无机填充剂和第二无机填料均匀地分散在绝缘树脂层中。

公开(公告)号：US20150028218A1

公开(公告)日：2015-01-29

申请号：US14368444

申请日：2012-12-19

Applicant: WASEDA UNIVERSITY ,  FURUKAWA CO., LTD.

Inventor： Jun Kataoka ,  Aya Kishimoto ,  Kei Kamada

IPC: G01T1/202 ,  G01T1/29 ,  G01T1/164

CPC classification number: G01T1/202 ,  G01T1/1642 ,  G01T1/1644 ,  G01T1/2002 ,  G01T1/2008 ,  G01T1/2985

Abstract: A radiation detector (1) includes a three-dimensional stacked scintillator (12) that includes a plurality of scintillator blocks (13) arranged in a matrix in a three-dimensional manner so as to form a prism, in which interposed layers (15) which have a refractive index different from a refractive index of the scintillator blocks (13) and/or have a characteristic of absorbing or scattering some of light emitted by the scintillator blocks are disposed, out of boundary surfaces between the plurality of scintillator blocks (13), on the boundary surfaces extending in a direction perpendicular to a height direction H of the prism, and light blocking layers (14) which block transmission of light emitted by the scintillator are disposed on at least some of the boundary surfaces extending in a direction parallel to the height direction of the prism.

Abstract translation: 辐射检测器（1）包括三维堆叠闪烁器（12），其包括以三维方式排列成矩阵的多个闪烁器块（13），以形成棱镜，其中插入的层（15） 其具有与闪烁体块（13）的折射率不同的折射率和/或具有吸收或散射由闪烁体块发射的一些光的特性，在多个闪烁体块（13）之间的边界表面之外 ），在与棱镜的高度方向H垂直的方向上延伸的边界面上，阻挡透射由闪烁体发出的光的遮光层（14）设置在沿着方向 平行于棱镜的高度方向。

公开(公告)号：US20140372995A1

公开(公告)日：2014-12-18

申请号：US14302886

申请日：2014-06-12

Applicant: DENSO CORPORATION ,  WASEDA UNIVERSITY

Inventor： Hiroshi MORI ,  Mitsuhiro TANI ,  Hironori KASAHARA ,  Keiji KIMURA ,  Dan UMEDA ,  Akihiro HAYASHI ,  Hiroki MIKAMI ,  Yohei KANEHAGI

IPC: G06F9/45

CPC classification number: G06F8/45 ,  G06F8/452 ,  G06F8/456

Abstract: A parallelizing compile method includes, dividing a sequential program for an embedded system into multiple macro tasks, specifying (i) a starting end task and (ii) a termination end task, fusing (i) the starting end task, (ii) the termination end task, and (iii) a group of the multiple macro tasks, extracting a group of multiple new macro tasks from the multiple new macro tasks fused in the fusing based on a data dependency, performing a static scheduling assigning the multiple new macro tasks to the multiple processor units, so that the group of the multiple new macro tasks is parallelly executable by the multiple processor units, and generating a parallelizing program. In addition, a parallelizing compiler, a parallelizing compile apparatus and an onboard apparatus are provided.

Abstract translation: 并行化编译方法包括：将嵌入式系统的顺序程序划分为多个宏任务，指定（i）起始端任务和（ii）终止任务，融合（i）起始端任务，（ii）终止 结束任务，以及（iii）一组多个宏任务，从基于数据依赖关系的融合融合的多个新的宏任务提取一组多个新的宏任务，执行将多个新的宏任务分配给静态调度 多个处理器单元，使得多个新的宏任务的组可由多个处理器单元并行地执行，并且生成并行化程序。 此外，还提供并行编译器，并行化编译装置和车载装置。