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公开(公告)号：US09692009B2
公开(公告)日：2017-06-27
申请号：US14417169
申请日：2013-07-18
Applicant: OSRAM OLED GmbH
Inventor： Erwin Lang , Thilo Reusch , Philipp Schwamb
CPC classification number: H01L51/5253 , B81C1/00269 , B81C2201/0197 , B81C2203/0118 , B81C2203/031 , C23C16/45529 , H01L23/564 , H01L51/448 , H01L51/524 , H01L2924/0002 , H05K5/065 , Y02E10/549 , Y02P70/521 , Y10T428/13 , H01L2924/00
Abstract: An apparatus may include a first support covered with at least one ALD precursor and/or at least one MLD precursor, and a second support covered with at least one ALD precursor and/or at least one MLD precursor which is/are complementary to the ALD precursor and/or MLD precursor of the first support. The first support is at least partly joined to the second support by an atomic bond between the ALD precursor of the first support and the ALD precursor of the second support or between the MLD precursor of the first support and the MLD precursor of the second support in such a way that an ALD layer or an MLD layer is formed.
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公开(公告)号：US20170166437A1
公开(公告)日：2017-06-15
申请号：US15443922
申请日：2017-02-27
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein
CPC classification number: B81B3/0021 , B81B3/0059 , B81B2203/0127 , B81B2203/0136 , B81B2203/0307 , B81C1/00158 , B81C2201/0197 , H01L29/84 , H02N1/008 , H02N2/02 , H04R1/04 , H04R1/06 , H04R19/005 , H04R19/04 , H04R31/003 , H04R2201/003 , H04R2207/021 , H04R2231/003 , H04R2410/03
Abstract: According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure including a second plurality of electrostatic comb fingers interdigitated with a first subset of the first plurality of electrostatic comb fingers, and a second anchor structure including a third plurality of electrostatic comb fingers interdigitated with a second subset of the first plurality of electrostatic comb fingers. The second plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a first direction and the third plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a second direction, where the first direction is different from the second direction.
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公开(公告)号：US20170159194A1
公开(公告)日：2017-06-08
申请号：US15438074
申请日：2017-02-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Peter Mardilovich , Qingqiao Wei , Irina Nikolaevna Milonova , Anthony M. Fuller
CPC classification number: C25D1/006 , B81C1/00031 , B81C2201/013 , B81C2201/0197 , C25D11/045 , C25D11/08 , C25D11/10 , C25D11/12 , C25D11/24 , C25D11/26
Abstract: In an example of a method for making a nano-structure, an aluminum layer is partially anodized to form a porous anodic alumina structure. The aluminum layer is positioned on an oxidizable material layer. The porous anodic alumina structure is exposed to partial anisotropic etching to form tracks within the porous anodic alumina structure. A remaining portion of the aluminum layer is further anodized to form paths where the tracks are formed. The oxidizable material layer is anodized to from an oxide, where the oxide grows through the paths formed within the porous anodic alumina structure to form a set of super nano-pillars.
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公开(公告)号：US20160304335A1
公开(公告)日：2016-10-20
申请号：US15098353
申请日：2016-04-14
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
CPC classification number: B81B7/0067 , B81B2201/0264 , B81B2201/047 , B81B2207/115 , B81C1/00317 , B81C3/001 , B81C2201/013 , B81C2201/0197 , B81C2203/031 , H01L24/00 , H04R19/02
Abstract: A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.
Abstract translation: 具有图案化电介质阻挡层和可氧化金属层的第一富离子电介质基片阳极结合到第二富离子电介质基片上。 为了结合基板，可氧化的金属层被氧化。 电介质阻挡层可以抑制这些离子迁移到粘结线，否则可能会损害粘结强度。 因此，当接合两个基板时，在晶片之间保持牢固的结合。
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公开(公告)号：US20160154020A1
公开(公告)日：2016-06-02
申请号：US14518712
申请日：2014-10-20
Applicant: lnSighTech, LLC
Inventor： Biao Zhang , Tao Ju
IPC: G01P15/105 , G01R33/09
CPC classification number: G01P15/105 , B81B5/00 , B81C1/00357 , B81C3/001 , B81C2201/0197 , B81C2203/038 , G01C19/56 , G01C19/5712 , G01C19/5776 , G01P15/125 , G01R33/091 , G01R33/093 , G01R33/098
Abstract: A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism and a magnetic source that is formed at the proof-mass, wherein the magnetic sensing mechanism comprises an integrated pickup coil of a fluxgate. A magnetic shield is provided in the vicinity of the magnetic source.
Abstract translation: 本文公开了一种MEMS陀螺仪，其中所述MEMS陀螺仪包括磁感测机构和形成于所述质量块的磁源，其中所述磁感测机构包括磁通门的集成拾取线圈。 在磁源附近设有磁屏蔽。
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Patent Agency Ranking
公开(公告)号：US20150108004A1
公开(公告)日：2015-04-23
申请号：US14587883
申请日：2014-12-31
Applicant: University of Southern California
Inventor： Adam L. Cohen
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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107.发明申请公开(公告)号：US20140231263A1
公开(公告)日：2014-08-21
申请号：US14191061
申请日：2014-02-26
Applicant: MICROFABRICA INC.
Inventor： Uri Frodis , Adam L. Cohen , Michael S. Lockard
IPC: C25D5/48
CPC classification number: C25D5/48 , B33Y10/00 , B81C1/00492 , B81C99/0065 , B81C2201/0104 , B81C2201/0197 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/10 , C25D21/12 , H01L21/2885 , H01L21/76885 , Y10T156/1052
Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.
Abstract translation: 本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。 一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。
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公开(公告)号：US20140026660A1
公开(公告)日：2014-01-30
申请号：US13936144
申请日：2013-07-06
Applicant: Biao Zhang , Tao Ju
Inventor： Biao Zhang , Tao Ju
IPC: G01C19/56
CPC classification number: G01P15/105 , B81B5/00 , B81C1/00357 , B81C3/001 , B81C2201/0197 , B81C2203/038 , G01C19/56 , G01C19/5712 , G01C19/5776 , G01P15/125 , G01R33/091 , G01R33/093 , G01R33/098
Abstract: A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism and a magnetic source that is associated with the proof-mass. The magnetic sensing mechanism comprises multiple magnetic field sensors that are designated for sensing the magnetic field from a magnetic source so as to mitigate the problems caused by fabrication.
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公开(公告)号：US20140026659A1
公开(公告)日：2014-01-30
申请号：US13935558
申请日：2013-07-05
Applicant: BIAO ZHANG , TAO JU
Inventor： BIAO ZHANG , TAO JU
IPC: G01C19/56
CPC classification number: G01P15/105 , B81B5/00 , B81C1/00357 , B81C3/001 , B81C2201/0197 , B81C2203/038 , G01C19/56 , G01C19/5712 , G01C19/5776 , G01P15/125 , G01R33/091 , G01R33/093 , G01R33/098
Abstract: A method of using a MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism. A magnetic field is generated by a magnetic source, and is detected by a magnetic sensor. The magnetic field varies at the location of the magnetic sensor; and the variation of the magnetic field is associated with the movement of the proof-mass of the MEMS gyroscope. By detecting the variation of the magnetic field, the movement and thus the target angular velocity can be measured.
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公开(公告)号：US08551315B2
公开(公告)日：2013-10-08
申请号：US13441573
申请日：2012-04-06
Applicant: Adam L. Cohen
Inventor： Adam L. Cohen
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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