公开(公告)号：US20180135846A1

公开(公告)日：2018-05-17

申请号：US15569067

申请日：2016-04-27

Applicant: HANGZHOU HPWINNER OPTO CORPORATION

Inventor： Kai CHEN ,  Jianming HUANG

IPC: F21V25/12 ,  F21V5/04 ,  H05K1/18 ,  F21V29/76 ,  F21V19/00 ,  F21V17/10 ,  F21V17/16 ,  F21V31/00

CPC classification number: F21V25/12 ,  F21V5/007 ,  F21V5/048 ,  F21V17/101 ,  F21V17/16 ,  F21V19/003 ,  F21V29/763 ,  F21V29/767 ,  F21V31/005 ,  F21W2131/107 ,  F21Y2105/10 ,  F21Y2113/10 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/62 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/281 ,  H05K2201/012 ,  H05K2201/066 ,  H05K2201/10106

Abstract: An LED module with high flame retardant grade includes a base, lens group, flame retardant film and at least one LED luminary unit. The flame retardant film is provided on a first side of the base with at least one hole on the flame retardant film. The LED luminary unit is provided on the first side of the base and passes through the hole with the lens group being covered onto the first side of the base. A first closed space is formed between the lens group and base. The flame retardant film can effectively cut off circuit sparks generated by a circuit layer or by a PCB board on the base, effectively reducing security risks. The module has a high flame retardant grade after being provided with the flame retardant film and the LED module has a simple structure and is easy to process and implement.

公开(公告)号：US09963590B2

公开(公告)日：2018-05-08

申请号：US15027374

申请日：2014-06-10

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Jiang You

IPC: C08L63/00 ,  C08G59/50 ,  C08J5/24 ,  C08L79/02 ,  H05K1/03 ,  B32B27/38 ,  B32B27/42 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/00 ,  C08L63/04 ,  C08G14/06 ,  C08L61/06 ,  C08L61/34 ,  C08G59/32 ,  C08G59/62 ,  C08G59/68

CPC classification number: C08L63/00 ,  B32B27/38 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/714 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/3218 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/02 ,  C08J2379/04 ,  C08J2461/06 ,  C08J2463/00 ,  C08J2479/02 ,  C08J2479/04 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K5/49 ,  C08L61/04 ,  C08L61/06 ,  C08L61/34 ,  C08L63/04 ,  C08L79/02 ,  C08L79/04 ,  C08L79/06 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/015

Abstract: The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

公开(公告)号：US20180072884A1

公开(公告)日：2018-03-15

申请号：US15813165

申请日：2017-11-15

Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.

Inventor： Rongtao WANG ,  Yu-Te Lin ,  Wenjun Tian ,  Ziqian Ma ,  Wenfeng LV ,  Ningning Jia

IPC: C08L63/00 ,  H05K1/09 ,  C08G59/62 ,  C08G59/56 ,  C08G59/24 ,  C08G59/50 ,  C08J5/24 ,  H05K1/03 ,  B32B5/02 ,  B32B15/14 ,  C08G59/54 ,  B32B15/20 ,  B32B15/092 ,  C08L79/04

CPC classification number: C08L63/00 ,  B32B5/02 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/245 ,  C08G59/50 ,  C08G59/504 ,  C08G59/54 ,  C08G59/56 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/10 ,  C08J2471/10 ,  C08J2479/02 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/03 ,  H05K1/0353 ,  H05K1/09 ,  H05K2201/012 ,  C08L79/04

Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

公开(公告)号：US09902851B2

公开(公告)日：2018-02-27

申请号：US14435585

申请日：2013-10-18

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Hiroshi Takahashi ,  Tomo Chiba ,  Nobuyoshi Ohnishi ,  Katsuya Tomizawa ,  Keisuke Takada ,  Eisuke Shiga ,  Takaaki Ogashiwa

IPC: C08L63/00 ,  C08G59/62 ,  H05K1/03 ,  C08J5/24 ,  C08K3/34 ,  C08K3/36 ,  B32B15/092 ,  B32B27/06 ,  B32B27/28 ,  B32B27/38 ,  B32B5/02 ,  B32B15/14 ,  C08L83/06 ,  C08G77/04 ,  C08G77/14

CPC classification number: C08L63/00 ,  B32B5/024 ,  B32B15/092 ,  B32B15/14 ,  B32B27/06 ,  B32B27/28 ,  B32B27/283 ,  B32B27/38 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2457/08 ,  C08G59/621 ,  C08G77/045 ,  C08G77/14 ,  C08J5/24 ,  C08J2363/00 ,  C08J2365/00 ,  C08J2383/06 ,  C08J2463/00 ,  C08J2479/04 ,  C08J2483/06 ,  C08K3/013 ,  C08K3/34 ,  C08K3/36 ,  C08L71/126 ,  C08L83/06 ,  C08L2201/08 ,  C08L2203/20 ,  C08L2205/03 ,  C08L2205/035 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08K3/0033

Abstract: A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

公开(公告)号：US09902825B2

公开(公告)日：2018-02-27

申请号：US15363395

申请日：2016-11-29

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yoshihiro Kato ,  Takaaki Ogashiwa ,  Hiroshi Takahashi ,  Tetsuro Miyahira

IPC: C08J5/24 ,  H05K1/03 ,  C08K3/00 ,  B32B5/26 ,  B32B15/14 ,  C08K3/26 ,  B32B15/092

CPC classification number: C08J5/24 ,  B32B5/26 ,  B32B15/092 ,  B32B15/14 ,  B32B2262/10 ,  B32B2307/3065 ,  B32B2307/58 ,  B32B2307/734 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2363/04 ,  C08K3/105 ,  C08K3/26 ,  C08K2003/267 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L63/00

Abstract: A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO3·yMg(OH)2·zH2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet.

公开(公告)号：US20180050515A1

公开(公告)日：2018-02-22

申请号：US15563185

申请日：2015-09-21

Applicant: Shengyi Technology Co., Ltd.

Inventor： Cheng LUO ,  Guofang TANG

IPC: B32B15/08 ,  B32B15/092 ,  B32B27/38 ,  C08G65/48 ,  C08L63/00 ,  C08G59/42 ,  C08J5/24 ,  C08J5/04 ,  H05K1/03

CPC classification number: B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B27/28 ,  B32B27/38 ,  B32B2307/3065 ,  B32B2457/00 ,  C08G59/4269 ,  C08G65/48 ,  C08G65/485 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2463/00 ,  C08J2471/12 ,  C08L47/00 ,  C08L61/14 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  C08L79/08 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/012

Abstract: The present invention provides an active ester, a thermosetting resin composition, a prepreg and a laminated board containing same. The active ester is a PPO main chain-containing double-ended polyfunctional active ester, and the thermosetting resin composition comprises epoxy resin and the PPO main chain-containing double-ended polyfunctional active ester. The prepreg, laminated board and copper-clad plate prepared from the thermosetting resin composition containing the PPO main chain-containing double-ended polyfunctional active ester have excellent dielectric properties, damp-heat resistance, heat resistance, extremely low water absorption and high bending strength.

公开(公告)号：US09890276B2

公开(公告)日：2018-02-13

申请号：US13809893

申请日：2010-07-14

Applicant: Ming-She Su

Inventor： Ming-She Su

IPC: C08L47/00 ,  H05K3/02 ,  H05K1/03 ,  H05K3/44 ,  C08L71/12

CPC classification number: C08L47/00 ,  C08K3/016 ,  C08K3/36 ,  C08L9/00 ,  C08L71/126 ,  H05K1/0313 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/44 ,  H05K2201/012

Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making the circuit substrate of a high-frequency electronic equipment.

公开(公告)号：US09850375B2

公开(公告)日：2017-12-26

申请号：US14411166

申请日：2013-08-23

Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD

Inventor： Rongtao Wang ,  Yu-Te Lin ,  Wenjun Tian ,  Ziqian Ma ,  Wenfeng Lv ,  Ningning Jia

IPC: C08L63/00 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B5/02 ,  B32B15/08 ,  B32B37/06 ,  B32B37/12 ,  C08G59/50 ,  C08G59/54 ,  C08G59/56 ,  C08G59/62 ,  C08L79/02 ,  C08J5/24 ,  H05K1/03 ,  H05K1/09 ,  C09D163/00 ,  C09D179/02 ,  C08K3/32 ,  C08K5/03 ,  C08K5/3415 ,  C08K5/3492 ,  C08K5/49 ,  C08G59/24

CPC classification number: C08L63/00 ,  B32B5/02 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/245 ,  C08G59/50 ,  C08G59/504 ,  C08G59/54 ,  C08G59/56 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/10 ,  C08J2471/10 ,  C08J2479/02 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/03 ,  H05K1/0353 ,  H05K1/09 ,  H05K2201/012 ,  C08L79/04

Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

公开(公告)号：US09839119B2

公开(公告)日：2017-12-05

申请号：US14405533

申请日：2014-10-08

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomoaki Sawada ,  Shingo Yoshioka ,  Takatoshi Abe

IPC: G06F3/041 ,  H01B1/24 ,  H01L31/0224 ,  H05K1/02 ,  H05K1/03 ,  C08J5/18 ,  C08K7/02 ,  C08L101/00 ,  H01B1/02 ,  C08J7/04 ,  C09D105/16 ,  B32B5/02 ,  C09D163/00 ,  B32B15/092 ,  B32B15/08 ,  B32B3/12 ,  B32B3/26

CPC classification number: H05K1/0271 ,  B32B3/12 ,  B32B3/266 ,  B32B5/02 ,  B32B15/08 ,  B32B15/092 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2363/00 ,  C08J5/18 ,  C08J7/047 ,  C08J2300/21 ,  C08J2367/02 ,  C08J2400/21 ,  C08J2463/00 ,  C08K7/02 ,  C08L101/00 ,  C09D105/16 ,  C09D163/00 ,  G06F3/041 ,  H01B1/02 ,  H01B1/24 ,  H01L31/022466 ,  H01L31/022491 ,  H05K1/0213 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/012 ,  H05K2201/0323 ,  H05K2201/0326 ,  Y10T428/24331 ,  Y10T428/24917 ,  C08L63/00

Abstract: The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate (alpha), as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.

公开(公告)号：US20170342185A1

公开(公告)日：2017-11-30

申请号：US15588782

申请日：2017-05-08

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH

IPC: C08F230/02 ,  C08F232/08 ,  H05K1/09 ,  H05K3/02

CPC classification number: C08F230/02 ,  C08F232/08 ,  H05K1/0326 ,  H05K1/034 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0158

Abstract: The present invention provides a novel phosphorus-containing olefin polymer that comprises cycloolefin as a first component and a vinyl phosphorus-containing compound as a second component. The present invention further provides a method for producing such phosphorus-containing olefin polymer and a composition and an article comprising the same.