公开(公告)号：US4710854A

公开(公告)日：1987-12-01

申请号：US24894

申请日：1987-03-10

Applicant: Minoru Yamada ,  Motoyo Wajima ,  Akira Masaki ,  Akio Takahashi ,  Keiichirou Nakanishi ,  Katuo Sugawara

Inventor： Minoru Yamada ,  Motoyo Wajima ,  Akira Masaki ,  Akio Takahashi ,  Keiichirou Nakanishi ,  Katuo Sugawara

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K1/14

CPC classification number: H05K3/4626 ,  H05K1/024 ,  H05K1/0237 ,  H05K1/0346 ,  H05K1/115 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0191 ,  H05K2201/09327 ,  H05K2201/09536 ,  H05K3/4623

Abstract: A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).

Abstract translation: 多层布线板结构包括在每个导体层之间交错的多个导体层和绝缘层。 导体层包括功率（或接地）线层和信号线层，并且在由信号线层插入的功率（接地）线层之间使用具有较低相对介电常数的一种类型的绝缘层和具有较高相对介电常数的另一种类型的绝缘层 （s）。

公开(公告)号：US4382236A

公开(公告)日：1983-05-03

申请号：US253734

申请日：1981-04-13

Applicant: Hirosuke Suzuki

Inventor： Hirosuke Suzuki

IPC: H01B7/08 ,  H01P3/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/28

CPC classification number: H01P3/085 ,  H01B7/0838 ,  H05K3/28 ,  H05K1/024 ,  H05K1/034 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09672 ,  Y10T428/24917

Abstract: A new strip line cable is provided comprising a dielectric in tape form made of a porous, crystalline polymer and one or more pairs of electrical conductors, each pair of conductors having one conductor located on one side of said tape and the other conductor located on the opposite side of said tape and in substantially parallel relationship to the first conductor of the pair, the pairs of conductors being arranged in substantially parallel transverse relationship across said tape, and insulating layers made of a suitable non-porous plastic material placed over the conductors to affix them to said dielectric tape and encapsulate the cable assembly. The preferred tape dielectric is expanded, porous polytetrafluoroethylene.

Abstract translation: 提供了一种新的带状线电缆，其包括由多孔结晶聚合物和一对或多对电导体制成的带状电介质，每对导体具有位于所述带的一侧上的一个导体， 所述带的相对侧并且与所述一对的第一导体基本上平行，所述导线对以跨过所述带的大致平行的横向关系布置，并且由合适的无孔塑料材料制成的绝缘层放置在导体上 将它们固定到所述电介质胶带并封装电缆组件。 优选的带状电介质是膨胀的多孔聚四氟乙烯。

公开(公告)号：US3972755A

公开(公告)日：1976-08-03

申请号：US518314

申请日：1974-10-29

Applicant: Charles C. Misfeldt

Inventor： Charles C. Misfeldt

IPC: H01P11/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  C23F1/02 ,  B29D3/00 ,  C09J5/00

CPC classification number: H05K3/4614 ,  H01P11/003 ,  H05K3/107 ,  H05K3/386 ,  H05K1/0237 ,  H05K1/036 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/0715 ,  H05K2203/0278 ,  H05K3/06

Abstract: A method and apparatus is disclosed for bonding of dielectric circuit boa for microwave use, the bonding together of several circuit boards to form subassemblies and the bonding of subassemblies together. The finished circuit may include a bonded-in ground plate of copper wire cloth or the like and may include through-plate holes. The technique includes the build-up of thin films to provide strength, toughness and dimensional accuracy. Orthogonal positioning of directional stresses and cooling under pressure have a stabilizing effect. The bonding of copper or other conductive sheet or foil to the substrate is done without the use of a copper oxide or other coating and using only heat and pressure. An etched circuit in the copper sheet or foil, for example, is made flush with the finished surface of the board in the process. A normal bonding cycle comprises (1) loading the parts to be bonded in a confining mold, (2) placing a conforming mold plate within the mold and closing the parts in a press, (3) pressing for a predetermined time at a predetermined elevated temperature and (4) shock cooling the material before removing pressure from the mold.

Abstract translation: 公开了用于结合微波用介质电路板的方法和装置，将几个电路板结合在一起以形成子组件并将子组件结合在一起。 完成的电路可以包括铜线布等的接合接地板，并且可以包括穿孔孔。 该技术包括建立薄膜以提供强度，韧性和尺寸精度。 定向应力的正交定位和压力下的冷却具有稳定的作用。 在不使用氧化铜或其它涂层并且仅使用热和压力的情况下，将铜或其它导电片或箔与基底的结合完成。 例如，铜片或箔片中的蚀刻电路在该过程中与板的成品表面齐平。 正常的结合循环包括（1）将待粘合的部件装载在限定模具中，（2）将合适的模板放置在模具内并在压力机中关闭零件，（3）在预定的高度压制预定时间 温度和（4）冲击冷却材料，然后从模具中取出压力。

公开(公告)号：US3791909A

公开(公告)日：1974-02-12

申请号：US3791909D

申请日：1972-01-12

Applicant: CIRCUIT MATERIALS DIVISION DOD

Inventor： MCKEE I

IPC: B32B27/00 ,  H05K1/00 ,  H05K1/03 ,  C09J5/02 ,  B32B31/12

CPC classification number: B32B27/08 ,  B32B27/00 ,  B32B27/281 ,  B32B27/322 ,  B32B2309/022 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0154 ,  Y10T428/3154 ,  Y10T428/31721

Abstract: A process of laminating a polyimide film and a film of a completely fluorinated ethylene-propylene copolymer, the later film having one surface rendered cementable, by bringing together one surface of said polyimide film and said cementable surface of said fluorinated ethylene-propylene film under pressure and with the application of heat.

Abstract translation: 将聚酰亚胺膜和完全氟化的乙烯 - 丙烯共聚物的膜层压的方法，将具有一个表面的后期膜粘合，通过将所述聚酰亚胺膜的一个表面和所述氟化乙烯 - 丙烯膜的所述可粘合表面在压力下 并应用热量。

公开(公告)号：US3215574A

公开(公告)日：1965-11-02

申请号：US26766463

申请日：1963-03-25

Applicant: HUGHES AIRCRAFT CO

Inventor： KORB ROBERT W

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/281 ,  B29C70/58 ,  H05K1/034 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/385 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2203/0315 ,  Y10T29/49124

公开(公告)号：US3136680A

公开(公告)日：1964-06-09

申请号：US4981460

申请日：1960-08-15

Applicant: DU PONT

Inventor： JEROME HOCHBERG

IPC: B29C70/00 ,  B32B15/08 ,  C23C28/02 ,  H05K1/03 ,  H05K3/38

CPC classification number: H05K3/384 ,  B29C70/00 ,  B29K2309/08 ,  B32B15/08 ,  C23C28/023 ,  H05K1/034 ,  H05K1/036 ,  H05K3/382 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T428/31544 ,  Y10T428/31699 ,  Y10T442/3423

公开(公告)号：US3107197A

公开(公告)日：1963-10-15

申请号：US66384157

申请日：1957-06-05

Applicant: INT RESISTANCE CO

Inventor： STEIN SIDNEY J ,  ALLEN LOUIS B

IPC: B29C63/48 ,  B32B15/08 ,  B32B27/00 ,  C23C22/63 ,  H01B1/00 ,  H01B3/00 ,  H01B3/30 ,  H01B7/28 ,  H01G2/12 ,  H01G4/228 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38

CPC classification number: H01G4/228 ,  B29C63/48 ,  B32B15/08 ,  B32B27/00 ,  C23C22/63 ,  H01B1/00 ,  H01B3/004 ,  H01B3/308 ,  H01B7/28 ,  H01G2/12 ,  H05K1/034 ,  H05K3/281 ,  H05K3/382 ,  H05K3/385 ,  H05K2201/015 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10T428/31544

公开(公告)号：US3086071A

公开(公告)日：1963-04-16

申请号：US83756659

申请日：1959-08-28

Applicant: HUGHES AIRCRAFT CO

Inventor： PRESTON DANIEL S

IPC: H01B7/08 ,  H01B7/28 ,  H01B7/29 ,  H05K1/03 ,  H05K3/38

CPC classification number: H01B7/08 ,  H01B7/2806 ,  H01B7/29 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/385 ,  H05K2201/015 ,  H05K2203/0315

公开(公告)号：US2885601A

公开(公告)日：1959-05-05

申请号：US43295154

申请日：1954-05-28

Applicant: RCA CORP

Inventor： LEOPOLD PESSEL

IPC: H05K3/28 ,  H05K3/34 ,  H05K3/38

CPC classification number: H05K3/281 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/386 ,  H05K2201/015 ,  H05K2203/0191 ,  H05K2203/0577 ,  Y10T29/49144

公开(公告)号：US20240284599A1

公开(公告)日：2024-08-22

申请号：US18617514

申请日：2024-03-26

Applicant: LongKai LI

Inventor： LongKai LI

IPC: H05K3/00 ,  H05K1/05

CPC classification number: H05K3/0011 ,  H05K1/056 ,  H05K2201/0112 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2203/1581

Abstract: The present invention discloses a method for preparing a novel material layer structure of a circuit board, comprising the steps of: (1) combining a film with a copper layer to form an FCCL single-sided board; (2) applying a semi-cured functional material layer on a back side of the film of the FCCL single-sided board, wherein the semi-cured functional material layer is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, an LDK high-frequency functional adhesive, a copper ion migration resistant adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive to form a novel material layer structure for a circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the circuit board has high-frequency characteristics and/or copper ion migration resistance, and can be used as an integral structure. In the circuit board manufacturing process, it can be manufactured as the circuit board manufacturing material to be different circuit board structures, which brings great convenience for subsequent circuit board manufacturing and simplifies the manufacturing process.