公开(公告)号：US5637832A

公开(公告)日：1997-06-10

申请号：US586193

申请日：1996-01-11

Applicant: Paul A. Danner

Inventor： Paul A. Danner

IPC: H01L21/48 ,  H05K1/03 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K3/3452 ,  H01L21/4853 ,  H05K1/0306 ,  H05K2201/017 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/063 ,  H05K2203/066 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: A method for manufacturing an electronic module comprising a substrate carrying circuitry and one or more integrated circuits and having an array of closely spaced solder balls electrically connected with terminals of the circuitry to connect the module to an array of terminals, as on printed circuit board. The array of solder balls is fabricated on the substrate by preparing the substrate to include an array of terminal pads, perforating a sheet of dielectric tape to create precise and uniform holes, and thereafter fusing the tape onto the substrate so that the holes are aligned over the substrate's terminal pads. Solder balls are then placed in the holes and heated to reflow them, so that part of the solder fills a volume defined by the holes in the dielectric tape and bonds to the terminal pads on the substrate, while the solder balls remain generally spherical above the dielectric tape. The module can then be connected to an array of terminal pads on a circuit board by positioning the ball grid array on the circuit board and again reflowing the solder balls so that they bond with the terminal pads on the circuit board.

Abstract translation: 一种用于制造电子模块的方法，包括基板承载电路和一个或多个集成电路，并且具有与电路的端子电连接的紧密间隔的焊球阵列，以将模块连接到端子阵列上，如印刷电路板。 焊料阵列通过制备衬底以制成衬底以包括端子焊盘阵列，穿孔介质胶带以产生精确均匀的孔，然后将带固定在衬底上，使得孔对准在衬底上 衬底的端子焊盘。 然后将焊球放置在孔中并加热以回流它们，使得焊料的一部分填充由电介质带中的孔限定的体积并且结合到衬底上的端子焊盘，同时焊球保持大致为球形以上 介质胶带。 然后可以通过将球栅阵列定位在电路板上并再次回流焊球，使得该模块与电路板上的端子焊盘阵列连接，使得它们与电路板上的端子焊盘接合。

公开(公告)号：US5442852A

公开(公告)日：1995-08-22

申请号：US143186

申请日：1993-10-26

Applicant: Paul A. Danner

Inventor： Paul A. Danner

IPC: H01L21/48 ,  H05K1/03 ,  H05K3/34 ,  H01R4/02

CPC classification number: H05K3/3452 ,  H01L21/4853 ,  H05K1/0306 ,  H05K2201/017 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/063 ,  H05K2203/066 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: A method for manufacturing an electronic module comprising a substrate carrying circuitry and one or more integrated circuits and having an array of closely spaced solder balls electrically connected with terminals of the circuitry to connect the module to an array of terminals, as on printed circuit board. The array of solder balls is fabricated on the substrate by preparing the substrate to include an array of terminal pads, perforating a sheet of dielectric tape to create precise and uniform holes, and thereafter fusing the tape onto the substrate so that the holes are aligned over the substrate's terminal pads. Solder balls are then placed in the holes and heated to reflow them, so that part of the solder fills a volume defined by the holes in the dielectric tape and bonds to the terminal pads on the substrate, while the solder balls remain generally spherical above the dielectric tape. The module can then be connected to an array of terminal pads on a circuit board by positioning the ball grid array on the circuit board and again reflowing the solder balls so that they bond with the terminal pads on the circuit board.

Abstract translation: 一种用于制造电子模块的方法，包括基板承载电路和一个或多个集成电路，并且具有与电路的端子电连接的紧密间隔的焊球阵列，以将模块连接到端子阵列上，如印刷电路板。 焊料阵列通过制备衬底以制成衬底以包括端子焊盘阵列，穿孔介质胶带以产生精确均匀的孔，然后将带固定在衬底上，使得孔对准在衬底上 衬底的端子焊盘。 然后将焊球放置在孔中并加热以回流它们，使得焊料的一部分填充由电介质带中的孔限定的体积并且结合到衬底上的端子焊盘，同时焊球保持大致为球形以上 介质胶带。 然后可以通过将球栅阵列定位在电路板上并再次回流焊球，使得该模块与电路板上的端子焊盘阵列连接，使得它们与电路板上的端子焊盘接合。

公开(公告)号：US5051381A

公开(公告)日：1991-09-24

申请号：US515414

申请日：1990-04-27

Applicant: Masahiko Ohji ,  Norikazu Fukushima

Inventor： Masahiko Ohji ,  Norikazu Fukushima

IPC: C03C3/066 ,  C03C8/04 ,  C03C8/16 ,  C03C8/24 ,  H05K3/28

CPC classification number: C03C8/04 ,  C03C3/066 ,  C03C8/16 ,  C03C8/24 ,  H05K3/285 ,  H05K2201/017

Abstract: A powdery coating glass material essentially consists of V.sub.2 O.sub.5 5-35 wt. %, ZnO 33-60 wt. %, B.sub.2 O.sub.3 3-25 wt. %, SiO.sub.2 1-15 wt. %, Al.sub.2 O.sub.3 0-5 wt. %, and at least one element 2-20 wt. % selected from the group consisting of MgO, CaO, SrO, and BaO, which coating glass material has a softening point of 600.degree. C. or less. A coating glass composition is prepared by the above powdery coating glass material or a coating glass paste for use in a thick-film technique which contains the above powdery coating glass material. The prepared coating glass composition has a thermal expansion coefficient ranging from 55.times.10.sup.-7 /.degree.C. to 75.times.10.sup.-7 /.degree.C.

Abstract translation: 粉末涂料玻璃材料基本上由V2O5 5-35wt。 ％，ZnO 33-60wt。 ％，B2O3 3-25wt。 ％，SiO 2 1-15wt。 ％，Al2O3 0-5wt。 ％，和至少一种元素2-20wt。 ％，选自MgO，CaO，SrO和BaO，该涂层玻璃材料的软化点为600℃以下。 通过上述粉末涂料玻璃材料或用于含有上述粉末涂料玻璃材料的厚膜技术的涂料玻璃浆料制备涂料玻璃组合物。 制备的涂层玻璃组合物的热膨胀系数为55×10 -7 /℃至75×10 -7 /℃。

公开(公告)号：US4906311A

公开(公告)日：1990-03-06

申请号：US172014

申请日：1988-03-23

Applicant: I. Macit Gurol

Inventor： I. Macit Gurol

IPC: H01C13/02 ,  H01C17/242 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01C13/02 ,  H01C17/242 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/017 ,  Y10T156/1089 ,  Y10T156/1093

Abstract: A cermic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

Abstract translation: 皮质基材支持由玻璃密封玻璃密封玻璃密封在陶瓷基片上的玻璃玻璃覆盖物密封的薄膜电子电路。 将玻璃状密封玻璃在包含粘合剂材料和液化器的组合物中筛选到玻璃状玻璃覆盖物上。 电子电路在完成了倾向于影响电阻元件的电阻率的那些工艺步骤之后，通过引导通过玻璃玻璃覆盖物的激光束被修整为最终工艺步骤之一; 工艺步骤如组件的高温烘烤和焊接。

公开(公告)号：US4725480A

公开(公告)日：1988-02-16

申请号：US779643

申请日：1985-09-24

Applicant: I. Macit Gurol

Inventor： I. Macit Gurol

IPC: H01L23/02 ,  H01C13/02 ,  H01C17/242 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K1/16 ,  B32B3/00 ,  B32B9/00

CPC classification number: H01L23/3121 ,  H01C13/02 ,  H01C17/242 ,  H01L23/295 ,  H01L23/3142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/017 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A ceramic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

Abstract translation: 陶瓷基板通过热熔玻璃密封玻璃支撑由密封在陶瓷基片上的玻璃玻璃覆盖物密封地封闭的薄膜或厚膜电子电路。 将玻璃状密封玻璃在包含粘合剂材料和液化器的组合物中筛选到玻璃状玻璃覆盖物上。 电子电路在完成了倾向于影响电阻元件的电阻率的那些工艺步骤之后，通过引导通过玻璃玻璃覆盖物的激光束被修整为最终工艺步骤之一; 工艺步骤如组件的高温烘烤和焊接。

公开(公告)号：US4562513A

公开(公告)日：1985-12-31

申请号：US707987

申请日：1985-03-04

Applicant: Anthony F. Arnold ,  Arnold F. Schmeckenbecher

Inventor： Anthony F. Arnold ,  Arnold F. Schmeckenbecher

IPC: H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/28 ,  H05K1/14

CPC classification number: H05K3/1258 ,  H01L21/486 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K3/107 ,  H05K3/28

Abstract: A process for forming a high density solder pad and fan-out metallurgy system in a ceramic substrate wherein a pattern of indented lines is formed in the surface of a green ceramic substrate, the lines filled with a conductive metal paste, a layer of dielectric green ceramic material deposited over at least a portion of the area of the pattern of indented lines, and sintering the resultant substrate.

公开(公告)号：US4377642A

公开(公告)日：1983-03-22

申请号：US280920

申请日：1981-07-06

Applicant: Ashok N. Prabhu ,  Kenneth W. Hang

Inventor： Ashok N. Prabhu ,  Kenneth W. Hang

IPC: C03C1/10 ,  C03C3/074 ,  C03C8/10 ,  C03C8/16 ,  C03C8/24 ,  H01B3/00 ,  H01B3/08 ,  H01L27/01 ,  H05K3/28 ,  H05K3/46

CPC classification number: C03C8/245 ,  H01L27/013 ,  H05K3/285 ,  H05K2201/017 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: Improved thick-film overglaze inks useful in constructing multilayer integrated circuits on circuit boards, particularly porcelain-coated metal circuit boards, are provided. The subject inks comprise: a glass consisting of lead oxide, a modifier component consisting of the oxides of cadmium, zinc, barium and antimony and a glass-forming component consisting of aluminum oxide, boron trioxide and silicon dioxide; a suitable organic vehicle and, if desired, a colorant oxide.

Abstract translation: 提供了可用于在电路板，特别是陶瓷金属电路板上构建多层集成电路的改进的厚膜釉面油墨。 主题油墨包括：由氧化铅组成的玻璃，由镉，锌，钡和锑的氧化物组成的改性剂组分和由氧化铝，三氧化硼和二氧化硅组成的玻璃形成组分; 合适的有机载体，如果需要，可以使用着色剂氧化物。

公开(公告)号：US20240040695A1

公开(公告)日：2024-02-01

申请号：US18486635

申请日：2023-10-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomoya OOSHIMA ,  Yuuta HOSHINO ,  Koichi YAMADA ,  Miki SASAKI ,  Hironobu KUBOTA

IPC: H05K1/03 ,  H05K3/10

CPC classification number: H05K1/0306 ,  H05K3/102 ,  H05K2201/09381 ,  H05K2201/017

Abstract: An electronic component that includes: an element body; and an insulating film covering an outer surface of the element body. The insulating film has a mix layer and a glass layer. The mix layer has a first glass and powder particles. The glass layer contains a second glass and has a smaller content percentage of the powder particles than the mix layer. The mix layer is on a side of the insulating film closer to the element body when viewed from the glass layer.

公开(公告)号：US20190035993A1

公开(公告)日：2019-01-31

申请号：US16135317

申请日：2018-09-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  B32B15/08 ,  B32B27/28 ,  H01L33/48 ,  H01L33/58 ,  B32B7/12 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US10008452B2

公开(公告)日：2018-06-26

申请号：US15469964

申请日：2017-03-27

Applicant: INTEL CORPORATION

Inventor： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

IPC: H01L29/40 ,  H01L23/538 ,  H01L23/15 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  H01L21/683

CPC classification number: H01L23/5386 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/08238 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/017 ,  H05K2203/1469 ,  Y10T156/1057 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.