公开(公告)号：US06913187B2

公开(公告)日：2005-07-05

申请号：US10609955

申请日：2003-06-30

Applicant: Lars-Anders Olofsson

Inventor： Lars-Anders Olofsson

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  B23K31/00 ,  B21D39/00 ,  B23K1/20 ,  B23K35/12

CPC classification number: H05K3/4046 ,  H05K1/0204 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10416

Abstract: A method of providing thermal vias in a printed circuit board that includes one or more layers of board material is disclosed. The vias provide for conducting heat from components mounted on the board. One or more holes (4) are provided in a printed circuit board that may include several metal layers. A metal ball (6) is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall (5) of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside (2) and bottom side (3) of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.

Abstract translation: 公开了一种在包括一层或多层板材的印刷电路板中提供热通孔的方法。 通孔提供从安装在电路板上的组件传导热量。 一个或多个孔（4）设置在可包括若干金属层的印刷电路板中。 将金属球（6）插入每个孔中并施加压力以使所述球变形，并将所得的块塞紧紧地固定在所述孔的壁（5）上。 固定在孔中的可能具有金属化内表面的变形的球或块被用来在印刷电路板的金属化顶部（2）和底侧（3）之间以及中间金属化层之间传导热和/或电 在多层板的情况下。

公开(公告)号：US20050115066A1

公开(公告)日：2005-06-02

申请号：US10992009

申请日：2004-11-19

Applicant: Mitsuru Honjo ,  Toshiki Naito

Inventor： Mitsuru Honjo ,  Toshiki Naito

IPC: H05K3/24 ,  H05K3/06 ,  H05K3/10 ,  H05K3/02

CPC classification number: H05K3/108 ,  H05K3/062 ,  H05K2201/0347 ,  H05K2203/0542 ,  H05K2203/0597 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A production method of a wired circuit board that can prevent corrosion of a first thin metal film inwardly of a conductor layer, which is due to the forming of an undercut portion caused by a skirt portion of a plating resist, to prevent the peeling of a wiring circuit pattern. An insulating base layer 1 is prepared, first, and, then, a first thin metal film 2 is formed on the insulating base layer 1. Then, a plating resist 3 is formed in a reversal pattern to a wiring circuit pattern 4 on the first thin metal film 2, and a conductor layer 6 is formed in the wiring circuit pattern 4 on the first thin metal film 2 exposed form the plating resist 3. Thereafter, the plating resist 3 is removed and, then, a second thin metal film 8 is formed on the conductor layer 6 and first thin metal film 2. Thereafter, the second thin metal film 8 is removed. Then, all portions of the first thin metal layer 2, except portions thereof where the conductor layer 6 is formed, are removed. The flexible wired circuit board is produced by the processes described above.

Abstract translation: 一种布线电路板的制造方法，其能够防止由电镀抗蚀剂的裙部形成的底切部形成导体层内部的第一薄金属膜的腐蚀，防止剥离 布线电路图案。 首先制备绝缘基底层1，然后在绝缘基底层1上形成第一薄金属膜2。 然后，以与第一薄金属膜2上的布线电路图案4相反的方式形成电镀抗蚀剂3，并且在布线电路图案4中形成导体层6，第一薄金属膜2暴露于镀层 抗拒3。 此后，除去电镀抗蚀剂3，然后在导体层6和第一薄金属膜2上形成第二薄金属膜8。 此后，去除第二薄金属膜8。 然后，除去第一薄金属层2的除了形成导体层6的部分之外的所有部分。 柔性布线电路板通过上述工艺制造。

公开(公告)号：US06882544B2

公开(公告)日：2005-04-19

申请号：US10602828

申请日：2003-06-25

Applicant: Hirofumi Nakamura ,  Satoshi Arai

Inventor： Hirofumi Nakamura ,  Satoshi Arai

IPC: H01G9/00 ,  H01G9/012 ,  H01G9/028 ,  H01G9/04 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H01L23/64 ,  H05K1/16 ,  H05K3/38 ,  H05K3/46 ,  H05K1/18

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/642 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K1/162 ,  H05K3/382 ,  H05K2201/0329 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2203/0315 ,  Y10T428/24917 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A thin type printed circuit board with an enclosed capacitor of a large capacitance. The printed circuit board includes metal sheet 11 having roughed surface presenting micro-irregularities, a dielectric film for capacitor 12 covering the surface of the metal sheet, and a first electrically conductive layer of electrically conductive resin 13 covering the surface of the dielectric film. A second electrically conductive layer 14 is provided on the surface of the first electrically conductive layer in a region of via for cathode side connection 18. The metal sheet and the first and second electrically conductive layers are encapsulated by resin 15. The via for cathode side connection 18, obtained on boring through the resin 15 until reaching the second electrically conductive layer 14, is coated with an electrode 20. A via for anode side connection 19 obtained on boring through the resin 15 is coated with an electrode 21 that is insulated from the second electrically conductive layer 13 by the resin 15.

Abstract translation: 一种具有大电容的封闭电容器的薄型印刷电路板。 印刷电路板包括具有粗糙表面呈现微小凹凸的金属片11，覆盖金属片表面的电容器12的电介质膜和覆盖电介质膜表面的导电树脂13的第一导电层。 第二导电层14设置在阴极侧连接件18的通路区域中的第一导电层的表面上。 金属片和第一和第二导电层被树脂15封装。 在通过树脂15钻孔直至到达第二导电层14时获得的用于阴极侧连接件18的通孔涂覆有电极20。 用于通过树脂15钻孔获得的用于阳极侧连接件19的通孔涂覆有通过树脂15与第二导电层13绝缘的电极21。

公开(公告)号：US06872894B2

公开(公告)日：2005-03-29

申请号：US10379575

申请日：2003-03-06

Applicant: James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich

Inventor： James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich

IPC: H05K3/32 ,  H05K3/46 ,  H05K1/16

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract translation: 信息处理系统（例如，计算机，服务器等）利用至少一个具有坚固结构并具有增强的操作能力的电路化基板组件。 衬底组件包括具有至少一个开口的衬底，其在接合之前基本上填充有导电膏。 一旦粘合，糊料也部分地位于另一个开口内，以提供与其的有效电连接。

公开(公告)号：US20050016765A1

公开(公告)日：2005-01-27

申请号：US10920185

申请日：2004-08-18

Applicant: Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K1/00 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K3/4635 ,  H05K1/0393 ,  H05K3/246 ,  H05K3/247 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/249996

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the cooper foil, resin film, and the adhesive layer, and filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

Abstract translation: 多层布线基板组件，多层布线基板组装部件及其制造方法。 多层布线基板组合体是将具有柔性树脂薄膜的多个多层布线基板组件与铜箔结合在一个表面上而形成的粘合剂层，并且在该镀铜树脂中开孔 通过铜箔，树脂膜和粘合剂层形成膜，并且用从粘合剂层突出并且横向延伸超过铜箔的开孔的导电膏填充通孔。

公开(公告)号：US20050000728A1

公开(公告)日：2005-01-06

申请号：US10879125

申请日：2004-06-30

Applicant: Koichi Tanaka

Inventor： Koichi Tanaka

IPC: H05K1/09 ,  H05K1/16 ,  H05K3/24

CPC classification number: H05K1/167 ,  H05K1/095 ,  H05K2201/0347 ,  H05K2201/09763 ,  H05K2203/1453 ,  H05K2203/171 ,  Y10T29/49098 ,  Y10T29/49099 ,  Y10T29/49155

Abstract: A wiring board provided with a resistor comprises: an insulating substrate having a surface; wiring patterns formed on the surface, the wiring patterns including first and second electrodes spaced from each other by a certain distance; a first resistor (horizontal type resistor) formed on the surface, the first resistor having respective ends connected with the first and second electrodes, respectively; the wiring patterns further including a third electrode, occupying a first plane area on the surface; a second resistor (vertical type resistor) formed on the third electrode; a fourth electrode formed on the second resistor; and the second resistor and the fourth electrode being located in a second plane area within the first plane area.

Abstract translation: 设置有电阻器的布线板包括：具有表面的绝缘基板; 布线图案形成在表面上，布线图案包括彼此隔开一定距离的第一和第二电极; 形成在所述表面上的第一电阻器（水平型电阻器），所述第一电阻器分别具有与所述第一和第二电极连接的端部; 所述布线图形还包括占据所述表面上的第一平面区域的第三电极; 形成在第三电极上的第二电阻器（垂直型电阻器） 形成在所述第二电阻器上的第四电极; 并且所述第二电阻器和所述第四电极位于所述第一平面区域内的第二平面区域中。

公开(公告)号：US20040222183A1

公开(公告)日：2004-11-11

申请号：US10845236

申请日：2004-05-14

Inventor： Urho A. Pietila

IPC: H01B013/00

CPC classification number: H05K3/102 ,  H05K3/105 ,  H05K3/106 ,  H05K3/12 ,  H05K2201/0347 ,  H05K2203/0525

Abstract: The present invention relates to a method of forming a conductive pattern in accordance with an object pattern onto a substrate. In the method, the pattern first defined as the numerical image values at its coordinate locations and then, using these numerical values, the final pattern is recorded with the help of reactive agents capable of undergoing a change of state. The state-changing reactive agents is applied onto each point of said substrate in an amount located and controlled by said numerical value of the respective point in the object pattern, whereupon each one of said amounts of said applied agents is subjected to a reaction causing a change of state. The invention can be implemented to product printed-circuit boards and similar conductive patterns.

Abstract translation: 本发明涉及根据目标图案在基板上形成导电图案的方法。 在该方法中，首先将图案定义为其坐标位置处的数值图像值，然后使用这些数值，借助于能够经历状态改变的反应剂来记录最终图案。 将状态变化的反应剂以所述对象图案中的各个点的数值位于和控制的量施加到所述基底的每个点上，由此所述量的所述涂覆剂的每一个都经受反应，导致 状态变化 本发明可以实现为产品印刷电路板和类似的导电图案。

公开(公告)号：US20040200061A1

公开(公告)日：2004-10-14

申请号：US10412794

申请日：2003-04-11

Inventor： James P. Coleman ,  Ian J. Forster ,  Scott Wayne Ferguson ,  Jaime C. Grunlan ,  Andrew W. Holman ,  Peikang Liu

IPC: H01R043/00

CPC classification number: H01L23/49855 ,  G06K19/07749 ,  H01L21/4846 ,  H01L24/95 ,  H01L2224/95085 ,  H05K1/095 ,  H05K1/165 ,  H05K3/205 ,  H05K3/32 ,  H05K3/386 ,  H05K2201/0347 ,  H05K2203/1469 ,  H05K2203/1545 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T156/1062

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract translation: 形成导电图案的方法包括选择性地电镀对应于图案的衬底的顶部部分，并且将导电图案与衬底分离。 电镀还可以包括将导电图案电连接到电气部件。 诸如包含碳颗粒的墨的导电油墨可以选择性地放置在导电基底上，以便于电镀所需图案和/或促进图案与基底的分离。 导电图案的示例是用于诸如标签或标签的射频识别（RFID）设备的天线。 可以电连接到天线的电气部件的一个例子是RFID带或芯片。

公开(公告)号：US20040182265A1

公开(公告)日：2004-09-23

申请号：US10787412

申请日：2004-02-27

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Hajime Saiki ,  Michitoshi Nakata

IPC: G03C005/18

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627 ,  H01L2924/00

Abstract: A wiring substrate, in which a wiring stacked portion including a conductor layer and a resin layer is stacked on a principal face of a core substrate including a substantially cylindrical through hole conductor in a through hole extending therethrough and a filling material filling the hollow portion of said through hole, comprising: a cover-shaped conductor portion covering an end face of said through hole just over a principal face of said core substrate and connected to said through hole conductor; and an initial conductor layer provided in said wiring stacked portion and across at least one of said resin layer from sad cover-shaped conductor layer, wherein a connection portion composed of via conductors buried in said resin layer brings said cover-shaped conductor portion and said internal conductor layer into conduction, and said via conductors composing said connection portion are provided not above said through hole.

Abstract translation: 一种布线基板，其中包括导体层和树脂层的布线层叠部分堆叠在包括基本上圆柱形的通孔导体的芯基板的主面上，所述芯基板在穿过其中的通孔中填充填充材料， 所述通孔包括：覆盖所述通孔的端面刚好在所述芯基板的主面上并连接到所述通孔导体的盖状导体部分; 以及初始导体层，其设置在所述布线堆叠部分中，并且穿过所述树脂层中的至少一个与所述树脂层的凹陷形导体层，其中由埋入所述树脂层中的通孔导体构成的连接部分将所述盖状导体部分和所述 内部导体层导通，并且构成所述连接部的所述通路导体不设置在所述通孔的上方。

公开(公告)号：US20040052478A1

公开(公告)日：2004-03-18

申请号：US10646773

申请日：2003-08-25

Applicant: The Furukawa Electric Co., Ltd.

Inventor： Masayuki Minamino ,  Takashi Koseki ,  Toru Fukushima

IPC: G02B006/36

CPC classification number: H05K1/0206 ,  G02B6/4201 ,  G02B6/4219 ,  G02B6/4256 ,  G02B6/4269 ,  H05K1/0204 ,  H05K3/301 ,  H05K3/306 ,  H05K3/4046 ,  H05K3/42 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/0979 ,  H05K2201/10393 ,  H05K2201/10416

Abstract: An improved optical module mounted body is disclosed. The optical module mounted body comprising: a mounting board having a mounting surface with a plurality of holes formed thereon; an optical module placed on the mounting surface; and a securing member configured to secure the optical module, the securing member including an upper portion, a plurality of legs extending from the upper portion and a plurality of engagement portions formed at ends of the plurality of legs, wherein the optical module is held between the mounting board and the securing member such that the upper portion of the securing member abuts on an upper surface of the optical module, and wherein the plurality of legs are inserted in the plurality of holes, the plurality of engagement portion engaging with the mounting board.

Abstract translation: 公开了一种改进的光学模块安装体。 所述光学模块安装体包括：安装板，具有安装表面，其上形成有多个孔; 放置在安装表面上的光学模块; 以及固定构件，其构造成固定所述光学模块，所述固定构件包括上部，从所述上部延伸的多个腿和形成在所述多个腿的端部的多个接合部，其中所述光学模块保持在 安装板和固定构件，使得固定构件的上部抵接在光学模块的上表面上，并且其中多个腿插入到多个孔中，多个接合部分与安装板接合 。