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    Ablative process for printed circuit board technology
    101.
    发明授权
    Ablative process for printed circuit board technology 失效
    印刷电路板技术的烧蚀工艺

    公开(公告)号：US5472828A

    公开(公告)日：1995-12-05

    申请号：US193660

    申请日：1994-02-07

    Applicant: Rickey D. Akins ,  John Walvoord

    Inventor： Rickey D. Akins ,  John Walvoord

    IPC: B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  G03F7/20 ,  G03F7/24 ,  H01Q1/42 ,  H01Q15/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06

    CPC classification number: H01Q15/0013 ,  B23K26/032 ,  B23K26/066 ,  G03F7/2053 ,  G03F7/24 ,  H01Q1/425 ,  H05K3/027 ,  H05K2201/09018 ,  H05K2201/09963 ,  H05K2203/056 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/061 ,  Y10S430/146

    Abstract: In a method for fabricating a printed circuit board on a doubly contoured or hemispherical substrate such as a radome, a coherent light source is used to form a plurality of elements of a predetermined pattern on the surface of the substrate. The substrate includes a bottom layer and a metallized layer. At least a first element of the pattern is formed by ablating the element into a resist coating or ablating the element into the metallized layer with the coherent light source. The coherent light source preferably includes an excimer laser. The substrate is then displaced relative to the coherent light source until all the elements of the predetermined pattern are formed over the entire surface of the substrate. When the pattern is ablated into the resist material, an etching technique is used to remove portions of the metallized layer from the substrate.

    Abstract translation: 在用于在诸如天线罩的双轮廓或半球形基板上制造印刷电路板的方法中，使用相干光源在基板的表面上形成预定图案的多个元件。 衬底包括底层和金属化层。 通过将元件烧蚀成抗蚀剂涂层或用相干光源将元件烧蚀到金属化层中来形成图案的至少第一元件。 相干光源优选地包括准分子激光器。 然后将衬底相对于相干光源移位，直到预定图案的所有元件形成在衬底的整个表面上。 当图案被烧蚀到抗蚀剂材料中时，使用蚀刻技术从基底去除金属化层的部分。

    Conformal photolithographic method and mask for manufacturing parts with patterned curved surfaces
    103.
    发明授权
    Conformal photolithographic method and mask for manufacturing parts with patterned curved surfaces 失效
    用于制造具有图案化曲面的零件的保形光刻方法和掩模

    公开(公告)号：US5395718A

    公开(公告)日：1995-03-07

    申请号：US978322

    申请日：1992-11-18

    Applicant: David G. Jensen ,  Daniel R. Tichenor

    Inventor： David G. Jensen ,  Daniel R. Tichenor

    IPC: G03F1/68 ,  G03F7/00 ,  G03F7/24 ,  H01Q1/42 ,  H01Q15/00 ,  H01Q15/14 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  G03F9/00

    CPC classification number: H05K3/0082 ,  G03F1/68 ,  G03F7/00 ,  G03F7/24 ,  H01Q1/422 ,  H01Q1/425 ,  H01Q15/0013 ,  H01Q15/141 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K3/0002 ,  H05K3/0032 ,  H05K3/064 ,  H05K3/067

    Abstract: Parts having complexly curved, frequency selective surfaces can be manufactured with a high degree of precision using a three-dimensional conformal mask. The mask has a transparent substrate and a patterned opaque layer on the substrate. The layer may be patterned by laser ablation. Alternatively, the patterning of the opaque layer can be accomplished by applying a layer of photosensitive material over the opaque layer and then defining temporary and permanent areas thereof. The temporary areas of the photosensitive layer and the opaque layer are removed sequentially to define the transparent portions of the mask. Parts are made by intimately mating the mask and a part body to which a layer of metal and a layer of photosensitive material have been applied, and exposing the part to radiation through the mask. The exposed part is then chemically developed, the layer of metal is etched, and the remainder of the layer of photosensitive material is removed to complete the patterning of the part body surface. The mask is preferably made using a high precision laser etch system to sharply define the transparent portions of the mask and maximize the precision of the patterning on the subsequently made parts.

    Abstract translation: 可以使用三维适形掩模以高精度制造具有复弯曲频率选择性表面的部件。 掩模在基底上具有透明基底和图案化不透明层。 该层可以通过激光烧蚀来图案化。 或者，不透明层的图案化可以通过在不透明层上施加一层感光材料，然后限定其临时和永久的区域来实现。 依次除去感光层和不透明层的临时区域以限定掩模的透明部分。 部件通过将掩模和已经施加有金属层和感光材料层的部件体紧密地配合并且将部件暴露于通过掩模的辐射而制成。 然后将暴露的部分化学显影，蚀刻金属层，除去感光材料层的其余部分以完成部件体表面的图案化。 该掩模优选地使用高精度激光蚀刻系统来制造，以锐利地限定掩模的透明部分，并使后续制造的部件上的图案化的精度最大化。

    Three-dimensional circuit component assembly and method corresponding thereto
    106.
    发明授权
    Three-dimensional circuit component assembly and method corresponding thereto 失效
    三维电路部件装配及对应的方法

    公开(公告)号：US4833568A

    公开(公告)日：1989-05-23

    申请号：US150227

    申请日：1988-01-29

    Applicant: G. Mark Berhold

    Inventor： G. Mark Berhold

    IPC: H01R12/24 ,  H01L23/52 ,  H01L25/00 ,  H01R12/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K7/02

    CPC classification number: H05K1/189 ,  H05K7/023 ,  H05K2201/046 ,  H05K2201/09018 ,  H05K2201/09418 ,  H05K2201/10515 ,  H05K3/3447

    Abstract: A plurality of plate-like circuit component carrier packages having the same size and shape are stacked adjacent one to another with the flat faces thereof in contact to form a carrier package assembly in the form of a prismatic or cylindrically solid. Each carrier package houses one or more electrical circuit components and is provided at portions of the flat faces thereof with electrical contacts which cooperate with similarly located contacts on the flat faces of adjacent carrier packages to electrically interconnect the circuit components. The electrical contacts may take the form of a cooperating system of pins and apertures, serving also to align adjacent carrier packages. The carrier package assembly is useable in cooperation with a flexible, printed circuit board having on one side thereof an array of contact sites selectively interconnected by printed routing traces. Electrical contacts on the peripheral surfaces of the carrier packages are coupled with the circuit components housed therein and engage the contact sites on the circuit board when it is wrapped around the carrier package assembly. The ends of the carrier package assembly are fitted with connector blocks of a convenient shape which serve to support the carrier package assembly and to interconnect the electrical components therein with others exterior thereto. Several types of circuit boards and a variety of carrier package shapes are disclosed.

    Abstract translation: 具有相同尺寸和形状的多个板状电路部件载体封装彼此相邻堆叠，其平坦表面接触形成棱柱形或圆柱形固体形式的载体封装组件。 每个载体封装容纳一个或多个电路部件，并且在其平坦表面的部分处设置有电触点，电触点与相邻载体封装的平坦表面上类似定位的触点配合以电连接电路部件。 电触点可以采取销和孔的配合系统的形式，也用于对准相邻的载体封装。 载体封装组件可与柔性印刷电路板协同工作，该电路板的一侧上具有通过印刷布线迹线选择性互连的接触位置阵列。 载体封装的外围表面上的电触点与容纳在其中的电路部件耦合，并且当电路板缠绕在载体封装组件上时与电路板上的接触部位接合。 载体包装组件的端部装配有方便形状的连接器块，其用于支撑载体包装组件并将其中的电气部件与外部的电气部件互连。 公开了几种类型的电路板和各种载体封装形状。

    Smart ring and methods for manufacturing
    109.
    发明授权
    Smart ring and methods for manufacturing 有权

    公开(公告)号：US12052816B1

    公开(公告)日：2024-07-30

    申请号：US17326201

    申请日：2021-05-20

    Applicant: Ouraring Inc.

    Inventor： Denis Mars ,  Simon Ratner ,  Curt C. von Badinski

    IPC: H05K1/18 ,  G06F1/16 ,  H05K1/02 ,  H05K3/28 ,  H05K3/36

    CPC classification number: H05K1/0271 ,  G06F1/163 ,  H05K3/284 ,  H05K3/36 ,  H05K2201/09018 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151

    Abstract: A method for fabricating a smart ring includes receiving a printed circuit board having a processor, a memory, a temperature sensor, a wireless transceiver and a perturbation sensor, receiving a power source with a first radius of curvature within a range of 7 mm to 15 mm, coupling the printed circuit board and the power source together to form a first assembly with the first radius of curvature, encapsulating the first assembly to form a second assembly with a second radius of curvature wherein the first radius is larger than the second radius, and wherein the second assembly includes a plurality of physical anchors, determining a first ring size from a plurality of ring sizes, and coupling a band to the second assembly via the plurality of physical anchors to form an enclosed circle-like shape in response to the first ring size, wherein the band is characterized by the second radius.

    Electronic device comprising array antenna
    110.
    发明授权
    Electronic device comprising array antenna 有权

    公开(公告)号：US11929546B2

    公开(公告)日：2024-03-12

    申请号：US17259445

    申请日：2019-07-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaehyung Kim ,  Jinkyu Bang ,  Jaebong Chun

    IPC: H05K1/14 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q9/16 ,  H05K5/00 ,  H05K5/02 ,  H04B1/40

    CPC classification number: H01Q1/243 ,  H01Q9/0407 ,  H01Q9/16 ,  H05K1/142 ,  H05K5/0017 ,  H05K5/0226 ,  H04B1/40 ,  H05K2201/09018 ,  H05K2201/10098 ,  H05K2201/10128

    Abstract: An electronic device comprising an array antenna according to various embodiments of the present invention may comprise: a housing comprising a first plate, a second plate facing away from the first plate, and a side member surrounding the space between the first plate and the second plate; a display visible through a part of the first plate; a first printed circuit board comprising a first surface facing the side member, a second surface facing away from the first surface, a first edge adjacent close to the first plate, and a second edge closer to the second plate than the first edge, the first printed circuit board comprising one or more conductive plates on the first surface; a second printed circuit board extending from the first edge so as to bend at an obtuse angle with regard to the first surface, the second printed circuit board comprising one or more first conductive patterns; a third printed circuit board extending from the second edge so as to bend at an obtuse angle with regard to the first surface, the third printed circuit board comprising one or more second conductive patterns; and a wireless communication circuit electrically connected to the conductive plates, the first conductive patterns, and the second conductive patterns and configured to transmit and/or receive signals. Various other embodiments may be possible.

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