公开(公告)号：US20060024862A1

公开(公告)日：2006-02-02

申请号：US11179431

申请日：2005-07-11

Applicant: Sadamichi Takakusaki ,  Yusuke Igarashi ,  Motoichi Nezu ,  Takaya Kusabe

Inventor： Sadamichi Takakusaki ,  Yusuke Igarashi ,  Motoichi Nezu ,  Takaya Kusabe

IPC: H01L21/50

CPC classification number: H05K3/4647 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0265 ,  H05K1/185 ,  H05K1/187 ,  H05K3/06 ,  H05K3/20 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09736 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.

Abstract translation: 提供一种制造高可靠性电路装置的方法，其实现更小，更薄和更轻的构造。 在根据本发明的电路装置的制造方法中，在支撑基板的顶表面上形成包含电路装置的树脂密封体之后，树脂密封体与支撑基板分离。 因此，可以制造没有基板的电路装置，并且实现了具有改善的散热的更薄更轻的电路装置。 此外，由于可以在支撑基板上进行密封树脂的密封，所以可以防止由密封树脂和导电图案之间以及密封树脂和电路部件之间的热膨胀系数的差异引起的翘曲。 因此，可以防止导电图案从基板剥落，并且导电图案与金属细线之间的接触不良，从而制造高可靠性的电路装置。

公开(公告)号：US20050258526A1

公开(公告)日：2005-11-24

申请号：US11168549

申请日：2005-06-29

Applicant: Takashi Noguchi

Inventor： Takashi Noguchi

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H01L23/58 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H01L23/495

CPC classification number: H01L22/32 ,  H01L23/498 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3651 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/0394 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/10666 ,  H05K2203/0195 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A substrate 1 has formed therein through-holes 7 lined on the internal walls with a wiring layer 9, and solder balls 6 are fusion-bonded to the substrate 1 in such a manner as to cover the through-holes 7. In the mounting process or in the repair process, heating probes 41 are passed through the through-holes 7 and thrust into the solder balls 6 to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls 6 can be heated, thereby averting adverse effects on the IC chip 3. In the repair process, the solder balls 6 can be restored to an initial condition free of intermetallic compounds.

Abstract translation: 一种可以降低故障发生率的半导体器件的安装方法，可以容易地修复有缺陷的焊点的半导体器件的修复方法以及使这些方法可行的半导体器件。 衬底1上形成有布线层9内衬在内壁上的通孔7，并且焊球6以覆盖通孔7的方式熔合到衬底1上。在安装过程中 或者在维修过程中，加热用探针41穿过通孔7并推入焊球6，从而熔化焊球，并将加热探针从焊球中拉出以使焊球冷却。 在这些处理中，仅可以加热焊球6，从而避免对IC芯片3的不利影响。在修复过程中，焊球6可以恢复到没有金属间化合物的初始条件。

公开(公告)号：US20050253235A1

公开(公告)日：2005-11-17

申请号：US11116046

申请日：2005-04-27

Applicant: Kazumi Hara

Inventor： Kazumi Hara

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/02 ,  H01L23/31 ,  H01L29/06 ,  H05K1/02

CPC classification number: H01L23/562 ,  H01L23/3171 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K2201/0166 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/09736 ,  H05K2201/09909 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A semiconductor chip is provided that is highly packageable and particularly well suited for mounting on a circuit board having a curved surface. The semiconductor chip comprises a warpage control film that controls the warpage of a substrate.

Abstract translation: 提供了一种高度可封装的半导体芯片，特别适用于安装在具有曲面的电路板上。 半导体芯片包括控制基板翘曲的翘曲控制膜。

公开(公告)号：US20050199610A1

公开(公告)日：2005-09-15

申请号：US10797259

申请日：2004-03-10

Applicant: Kevin Ptasienski ,  James McMillin ,  Thomas Nagl ,  Rolando Juliano

Inventor： Kevin Ptasienski ,  James McMillin ,  Thomas Nagl ,  Rolando Juliano

IPC: H05B3/26 ,  H05B3/28 ,  H05K1/02 ,  H05K1/16 ,  H05K3/12 ,  H05B3/18

CPC classification number: H05B3/20 ,  H05B3/26 ,  H05B3/28 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/037 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/167 ,  H05K3/1241 ,  H05K2201/09736 ,  H05K2203/0126 ,  Y10T29/49099

Abstract: A layered heater is provided with a resistive layer having a resistive circuit pattern, the resistive circuit pattern defining a length and a thickness, wherein the thickness varies along the length of the resistive circuit pattern for a variable watt density. The present invention also provides layered heaters having a resistive circuit pattern with a variable thickness along with a variable width and/or spacing of the resistive circuit pattern in order to produce a variable watt density. Methods are also provided wherein the variable thickness is achieved by varying a dispensing rate of a conductive ink used to form the resistive circuit pattern, varying the feed rate of a target surface relative to the dispensing of the ink, and overwriting a volume of conductive ink on top of a previously formed trace of the resistive circuit pattern.

Abstract translation: 层状加热器设置有具有电阻电路图案的电阻层，电阻电路图形限定长度和厚度，其中厚度随着电阻电路图案的长度变化，用于可变瓦特密度。 本发明还提供了具有可变厚度的电阻电路图案以及电阻电路图案的可变宽度和/或间隔以便产生可变瓦特密度的分层加热器。 还提供了方法，其中可变厚度通过改变用于形成电阻电路图案的导电油墨的分配速率来实现，改变目标表面相对于油墨分配的进给速率，并且覆盖一定体积的导电油墨 在先前形成的电阻电路图案的迹线之上。

公开(公告)号：US20050176177A1

公开(公告)日：2005-08-11

申请号：US10503804

申请日：2005-04-18

Applicant: Ron Zohar ,  Jacob Mozel ,  Ran Vilk

Inventor： Ron Zohar ,  Jacob Mozel ,  Ran Vilk

IPC: C08F2/48 ,  H05K3/00 ,  H05K3/28 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/0091 ,  H05K3/28 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/081 ,  H05K2203/1509

Abstract: A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board having elevated pads defining pad edges, the method including flooding the printed circuit board with ink such that the ink advances to the pad edges and is stopped thereby and thereat, without climbing onto the elevated pads.

Abstract translation: 一种用于根据焊接掩模图案将油墨施加到具有限定焊盘边缘的凸起焊盘的印刷电路板的方法和装置，所述方法包括用油墨浸渍印刷电路板，使得油墨前进到焊盘边缘并由此停止， 在那里，没有爬上升高的垫。

公开(公告)号：US20050161832A1

公开(公告)日：2005-07-28

申请号：US11019639

申请日：2004-12-23

Applicant: Takayuki Saeki

Inventor： Takayuki Saeki

IPC: H05B33/02 ,  G02F1/1333 ,  G09F9/00 ,  H01L21/4763 ,  H01L23/48 ,  H01L51/50 ,  H05B33/14 ,  H05B33/26 ,  H05K1/00 ,  H05K1/02

CPC classification number: H05K1/028 ,  G02F2001/133302 ,  H05K1/0289 ,  H05K2201/0391 ,  H05K2201/09727 ,  H05K2201/09736 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A circuit substrate is described where the circuit substrate has a first wiring group extending in a first direction and a second wiring group extending in a second direction substantially orthogonal to the first direction. The first wiring group of the circuit substrate is stronger than the second wiring group, and the second wiring group bends more easily than the first wiring group, which results in directional flexibility of said circuit substrate.

Abstract translation: 描述电路基板，其中电路基板具有沿第一方向延伸的第一布线组和沿与第一方向大致正交的第二方向延伸的第二布线组。 电路基板的第一布线组比第二布线组强，第二布线组比第一布线组更容易弯曲，这导致所述电路基板的定向灵活性。

公开(公告)号：US20050140434A1

公开(公告)日：2005-06-30

申请号：US11010327

申请日：2004-12-14

Applicant: Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

Inventor： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

IPC: H01L23/12 ,  H03F3/195 ,  H03F3/60 ,  H03G3/30 ,  H05K1/02 ,  H05K1/16 ,  H05K3/24 ,  H05K3/46 ,  H03F1/00

CPC classification number: H05K1/0265 ,  H01L2924/1423 ,  H03F3/195 ,  H03F2200/294 ,  H05K1/165 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0542

Abstract: An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.

Abstract translation: 本发明的电感器元件电路板包括多个导电层，以及在一个或多个导电层中具有电感器功能（电感器导体段）的导体，其中电感器导体段的至少一部分变厚 而不是设置在电路板内的其它导线。 电感器导体段的至少一部分延伸穿过设置在导电层之间的绝缘层，或者嵌入在绝缘层中，其中电感器导体段的一部分具有绝缘层的厚度的一半或更多的厚度 。 本发明的功率放大器模块包括多层电路板，在多层电路板中制造的半导体放大器和耦合到半导体放大器的输出的阻抗匹配电路。 阻抗匹配电路具有由电感器导体段形成的部分。

公开(公告)号：US06902869B2

公开(公告)日：2005-06-07

申请号：US10664996

申请日：2003-09-17

Applicant: Bernd Karl-Heinz Appelt ,  James Russell Bupp ,  Donald Seton Farquhar ,  Ross William Keesler ,  Michael Joseph Klodowski ,  Andrew Michael Seman ,  Gary Lee Schild

Inventor： Bernd Karl-Heinz Appelt ,  James Russell Bupp ,  Donald Seton Farquhar ,  Ross William Keesler ,  Michael Joseph Klodowski ,  Andrew Michael Seman ,  Gary Lee Schild

IPC: H05K3/06 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/02 ,  H05K3/10

CPC classification number: H05K3/4007 ,  H05K3/06 ,  H05K3/20 ,  H05K3/427 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4647 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1572 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps; etching the metal layer exposed by said development to form said plurality of conductive bumps; removing said first photoresist; applying a second photoresist onto the metal layer; exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.

Abstract translation: 一种形成多个固体导电凸块的方法，用于将电路板的两个导电层与基本上共面的上表面互连。 该方法包括以下步骤：将连续的均质金属层施加到电介质基底上，施加第一光致抗蚀剂并暴露和显影所述第一光致抗蚀剂以限定导电凸块的图案; 蚀刻由所述显影暴露的金属层以形成所述多个导电凸块; 去除所述第一光致抗蚀剂; 在所述金属层上施加第二光致抗蚀剂; 曝光和显影所述第二光致抗蚀剂以限定导电凸块和电路线的图案; 蚀刻由所述显影曝光的金属层，以在所述金属层中形成电路线图案; 并除去所述第二光致抗蚀剂。 本发明的方法还提供制造用于向面板提供刚性的多层电路板和金属边框。

公开(公告)号：US06896393B2

公开(公告)日：2005-05-24

申请号：US10422629

申请日：2003-04-23

Applicant: Isao Makuta

Inventor： Isao Makuta

IPC: H01L33/56 ,  H01L33/64 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  F21V29/00

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0209 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/4015 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10598 ,  H05K2201/10636 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014

Abstract: By use of a simple structure, also without enlarging thickness and size too much, provided is a light emitting module which can improve heat dissipation of a light emitting component. On a surface of a wiring substrate, a pair of lands face to each other, and two wiring line is connected to the land, respectively. A mounting side outside electrode of a light emitting component is connected to a lead frame to which a light emitting element is die-bonded, and a non-mounting side outside electrode is connected to a lead frame which is connected to the light emitting element through a bonding wire. And, the mounting side outside electrode is bonded to the land by solder, and the non-mounting side outside electrode is bonded to the land by solder and thereby, the light emitting component is mounted on the wiring substrate. A line width of the wiring line at a side to which the mounting side outside electrode of the light emitting component is soldered is made to be larger than a line width of the wiring line at a side to which the non-mounting side outside electrode is soldered.

Abstract translation: 通过使用简单的结构，也不会太大地增加厚度和尺寸，提供了可以改善发光部件的散热的发光模块。 在布线基板的表面上，一对台面彼此面对，并且两个布线分别连接到台面。 发光部件的安装侧外部电极与发光元件被芯片接合的引线框架连接，非安装侧外部电极与引导框架连接，引线框架通过 接合线。 并且，通过焊料将安装侧外侧电极接合到焊盘，通过焊料将非安装侧外部电极接合到焊盘，由此将发光部件安装在布线基板上。 将发光部件的安装侧外部电极焊接的一侧的布线的线宽设定为大于非安装侧外部电极侧的布线的线宽 焊接。

公开(公告)号：US06872896B1

公开(公告)日：2005-03-29

申请号：US10241745

申请日：2002-09-11

Applicant: Steven R. Young ,  Fredrick V. Hayen ,  Joshua J. Harmala

Inventor： Steven R. Young ,  Fredrick V. Hayen ,  Joshua J. Harmala

IPC: G11B5/48 ,  H01H1/12 ,  H01H15/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05

CPC classification number: G11B5/455 ,  G11B5/40 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0393 ,  H05K1/056 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2203/175

Abstract: Structure for forming a switchable shunt for a suspension assembly having conductive, insulating and metal base layers. The shunt includes a bridge in the conductive layer with either a continuous connection or small gap between ends of the bridge. The continuous connection of the bridge is severed either by temporarily moving the lands out of their original plane by stretching and rupturing the bridge or by shearing the continuous connection of the bridge. For the sheared or gapped bridge, at least one end of the bridge is moved out of the plane, compressed and elongated. When released, the separated ends of the bridge overlap and contact each other to form a normally-closed switch. To subsequently open the switchable shunt, at least one of the lands is moved out of plane to physically and electrically open the connection between the separated and overlapped ends of the bridge.

Abstract translation: 用于形成具有导电，绝缘和金属基底层的悬挂组件的可切换分流器的结构。 分流器包括在导电层中的桥，其中桥与连接端之间具有连续连接或小间隙。 桥的连续连接通过暂时地将平台从其原始平面移动，通过拉伸和破裂桥梁或者通过剪切桥的连续连接来切断。 对于剪切或有间隙的桥梁，桥梁的至少一端移出平面，压缩并伸长。 当释放时，桥的分离端重叠并彼此接触以形成常闭开关。 为了随后打开可切换分路，至少一个平台被移出平面以物理上和电气地打开桥的分离和重叠的端部之间的连接。