公开(公告)号：US20080291654A1

公开(公告)日：2008-11-27

申请号：US11943421

申请日：2007-11-20

Applicant: Kuo-Hsien Liao ,  Kuan-Hsing Li ,  Jia-Yang Chen

Inventor： Kuo-Hsien Liao ,  Kuan-Hsing Li ,  Jia-Yang Chen

IPC: H05K9/00

CPC classification number: H05K1/141 ,  H05K3/3405 ,  H05K3/3442 ,  H05K7/20409 ,  H05K9/002 ,  H05K2201/09145 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/2018

Abstract: A wireless communication module assembly includes a main board having a top surface on which a plurality of grounding pads are provided, a circuit board unit, and a metal cap. The circuit board unit has a bottom surface electrically mounted on the top surface of the main board, a top surface with a plurality of grounding pads, and a plurality of notches corresponding to the grounding pads of the main board. The metal cap covers the circuit board unit and has first mounting legs respectively and electrically connected with the grounding pads of the circuit board unit, and second mounting legs respectively passing through the notches of the circuit board unit and electrically connected with the grounding pads of the main board.

Abstract translation: 无线通信模块组件包括具有顶表面的主板，其上设置有多个接地焊盘，电路板单元和金属盖。 电路板单元具有电气安装在主板的顶表面上的底表面，具有多个接地焊盘的顶表面和对应于主板的接地焊盘的多个凹口。 金属盖覆盖电路板单元，并具有分别与电路板单元的接地焊盘电连接的第一安装支脚和分别穿过电路板单元的凹口并与电路板单元的接地焊盘电连接的第二安装腿 主板

公开(公告)号：US20080278217A1

公开(公告)日：2008-11-13

申请号：US11745220

申请日：2007-05-07

Applicant: Johannes Hankhofer ,  Manfred Mengel ,  Stephan Schaecher

Inventor： Johannes Hankhofer ,  Manfred Mengel ,  Stephan Schaecher

IPC: H05K10/00

CPC classification number: H05K5/0208 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0275 ,  H05K1/0293 ,  H05K1/181 ,  H05K3/308 ,  H05K2201/09645 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10371 ,  H05K2201/1059 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A system comprising a circuit board and an integrated circuit device mounted on the circuit board by means of an external contact, and comprising an anti-tamper device being connectable to the external contact to switch the integrated circuit device into a safe mode upon application of a predetermined electrical state at the external contact is described.

Abstract translation: 一种系统，包括电路板和通过外部接触件安装在电路板上的集成电路装置，并且包括可连接到外部触点的防篡改装置，以在应用一个外部触点时将集成电路装置切换到安全模式 描述外部接触处的预定电气状态。

公开(公告)号：US20080119014A1

公开(公告)日：2008-05-22

申请号：US11749981

申请日：2007-05-17

Applicant: KEAN SEONG HOOI

Inventor： KEAN SEONG HOOI

IPC: H01L21/52

CPC classification number: H01L23/552 ,  H01L23/16 ,  H01L23/562 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K3/301 ,  H05K2201/10371 ,  H05K2201/10393 ,  H05K2201/10734 ,  H05K2203/1105 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method (200) is provided for reducing stresses applied to one or more bonded interconnects (106) of a substrate (103) and a PCB (Printed Circuit Board) (104). The method comprises the steps of coupling (204) a compound (108) on a top surface of the substrate, wherein the compound has the property of expanding when a heat profile is applied thereto, coupling (206) a cover (102) to the PCB that overhangs at least a portion of the compound, and applying (208) the heat profile to the compound and optionally the cover and/or PCB. More than one apparatus implementing the method is also included.

Abstract translation: 提供了一种方法（200），用于减小施加到衬底（103）和PCB（印刷电路板）（104）的一个或多个键合互连（106）的应力。 该方法包括以下步骤：将化合物（108）偶联在基材的顶表面上，其中当加热分布被施加到其上时，该化合物具有膨胀的性质，将盖（206）与盖 PCB，其突出至少一部分化合物，并且将热分布施加（208）到化合物和任选的盖和/或PCB。 还包括实现该方法的多个装置。

公开(公告)号：US20080102663A1

公开(公告)日：2008-05-01

申请号：US11671707

申请日：2007-02-06

Applicant: Shuhei Sakai

Inventor： Shuhei Sakai

IPC: H01R13/648

CPC classification number: H01R12/7011 ,  H01R12/58 ,  H01R12/712 ,  H01R13/6594 ,  H05K1/0243 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2203/0195 ,  H05K2203/1446

Abstract: A shield plate arranged between a connector and a circuit board for covering and shielding parts of metal pins sticking out from the circuit board when a connector provided with a board mounting surface having a plurality of metal pins and a connector connection surface is mounted at an end of the circuit board, provided with an connector-engagement part, a shield part of the metal pins, a mounting part having press-fit pins for insertion, and support parts of the press-fit pins and flexible parts at a part between the shield part and the mounting part, the press-fit pins becoming vertical to the circuit board in the state with the engagement part engaged with the connector and the free end parts of the press-fit pins provisionally inserted into the engagement holes, thereby enabling the press-fit pins to be press-fit into the engagement holes all at once by a pushing action of the support parts.

Abstract translation: 一种屏蔽板，其布置在连接器和电路板之间，用于在设置有具有多个金属销和连接器连接表面的板安装表面的连接器安装在端部的情况下覆盖和屏蔽从电路板伸出的金属销的部分 设置有连接器接合部分，金属销的屏蔽部分，具有用于插入的压配销的安装部分，并且在屏蔽件之间的部分处支撑压配合销和柔性部件的部分 部分和安装部分，压配合销在接合部与连接器接合的状态下变得垂直于电路板，并且压配合销的自由端临时插入到接合孔中，从而使得压配合 - 通过支撑部件的推动动作一次压配合到接合孔中。

公开(公告)号：US07362586B2

公开(公告)日：2008-04-22

申请号：US11049429

申请日：2005-02-02

Applicant: Yoshiyuki Mashimo ,  Masao Uno ,  Toru Yaoeda

Inventor： Yoshiyuki Mashimo ,  Masao Uno ,  Toru Yaoeda

IPC: H05K7/02

CPC classification number: H05K9/0028 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10371 ,  Y10T29/49126

Abstract: Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each including a pair of opposed first side surfaces with catching grooves and a pair of second side surfaces without catching grooves when it is divided. The shielding cases are mounted on the motherboard such that the intervals A between the second surfaces of two adjacent shielding cases are equal to or less than the widths B of cutting allowances for cutting the motherboard. The motherboard is cut from the opposite side of a surface of the motherboard on which the shielding cases are mounted at predetermined positions where the second side surfaces are formed on each substrate. In this manner, the motherboard is divided into electronic components with shielding cases.

Abstract translation: 屏蔽壳各自包括一对相对的第一表面，其具有从其突出的捕获件和一对第二表面，而没有捕获件。 主板形成基板，每个基板包括一对具有捕获槽的相对的第一侧表面和一对第二侧表面，当分割时不具有捕获槽。 屏蔽壳体安装在母板上，使得两个相邻屏蔽壳体的第二表面之间的间隔A等于或小于用于切割母板的切割余量的宽度B. 主板从母板的表面的相对侧被切割，其中屏蔽壳安装在每个基板上形成第二侧表面的预定位置处。 以这种方式，主板被分成具有屏蔽壳的电子部件。

公开(公告)号：US20070246749A1

公开(公告)日：2007-10-25

申请号：US11410425

申请日：2006-04-25

Applicant: Wen-Hung Huang ,  Ming-Chu Kuo ,  Hsien Lin

Inventor： Wen-Hung Huang ,  Ming-Chu Kuo ,  Hsien Lin

IPC: H01L29/80

CPC classification number: H05K1/18 ,  H01L2924/0002 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10371 ,  Y10T29/4902 ,  H01L2924/00

Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.

Abstract translation: 为了提高具有能够辐射能量的暴露表面的功率器件的效率，在暴露表面和导电层之间设置屏蔽层。 屏蔽层使能量的至少一部分被引导回功率器件，从而基本上防止能量在导电层中引起涡流。 导电层由金属箔制成，以符合电磁能量泄漏规定。

公开(公告)号：US20070215382A1

公开(公告)日：2007-09-20

申请号：US11714394

申请日：2007-03-05

Applicant: Masaki Yamamoto

Inventor： Masaki Yamamoto

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K3/3405 ,  H05K3/4015 ,  H05K9/0039 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: A coupling structure between a circuit board and a frame member according to the present invention includes: the frame member made of a metal material; and the circuit board set in the frame member and having a land portion soldered to the frame member, in which a solder reinforcing member that is put on the land portion and is solderable is provided at a corner formed by the frame member and the circuit board, and the frame member, the land portion, and the solder reinforcing member are soldered at the corner.

Abstract translation: 根据本发明的电路板和框架构件之间的联接结构包括：由金属材料制成的框架构件; 并且电路板设置在框架构件中，并且具有焊接到框架构件的焊盘部分，其中放置在焊盘部分上并且可焊接的焊料加强构件设置在由框架构件和电路板形成的拐角处 并且框架部件，焊盘部分和焊料加强部件在角部焊接。

公开(公告)号：US07269033B2

公开(公告)日：2007-09-11

申请号：US10522090

申请日：2003-06-18

Applicant: Reinhold Berberich

Inventor： Reinhold Berberich

IPC: H05K9/00

CPC classification number: H04B15/02 ,  H01R13/6466 ,  H01R13/6581 ,  H01R13/6625 ,  H01R13/6658 ,  H01R13/719 ,  H05K1/0216 ,  H05K1/0298 ,  H05K1/162 ,  H05K9/0066 ,  H05K2201/09672 ,  H05K2201/10189 ,  H05K2201/10371

Abstract: A suppressor device for an electronic device comprising a plug-in device, comprising at least one plug element, which is arranged on a electrically conducting housing of the electronic device. A printed circuit board is arranged in the housing and bears an electronic circuit leading to the plug element. A capacitor is connected to the plug element and to the potential of the housing. The capacitor is arranged on the printed circuit board which protrudes from the inner part of the housing through an opening with a part thereof and which is also extends from the inner part of the housing to the outer side of the housing. The plug element is conductively connected to the capacitor and the circuit on the part of the printed circuit board located on the outer part of the housing.

Abstract translation: 一种用于电子设备的抑制器件，包括插入式设备，其包括布置在电子设备的导电壳体上的至少一个插头元件。 印刷电路板布置在壳体中并具有通向插塞元件的电子电路。 电容器连接到插头元件和壳体的电位。 电容器布置在印刷电路板上，该印刷电路板通过具有其一部分的开口从壳体的内部突出并且还从壳体的内部延伸到外壳的外侧。 插头元件导电地连接到位于壳体外部的印刷电路板上的电容器和电路。

公开(公告)号：US07186928B2

公开(公告)日：2007-03-06

申请号：US10522686

申请日：2003-08-01

Applicant: Hideo Kikuchi ,  Junichi Sasaki

Inventor： Hideo Kikuchi ,  Junichi Sasaki

IPC: H05K9/00

CPC classification number: H01L24/81 ,  H01C1/06 ,  H01G2/22 ,  H01G4/228 ,  H01L23/552 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/17515 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/81201 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2224/92225 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15192 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/181 ,  H05K2201/10371 ,  H05K2201/10734 ,  H01L2224/81801 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/05599

Abstract: In a shielding configuration of a chip part, a shielding effect and a cooling effect are sufficiently obtained at the same time. In an electronic device including a chip part to be disclosed, a shielding conductor includes a ceiling plate section covering the chip part and side plate sections which are formed to be united with the ceiling plate section and to be at a position lower than the ceiling plate section and which are arranged on both sides in a horizontal direction of the chip part, and openings are formed in both side ends in a front-rear direction of the shielding conductor to open both sides in a front-rear direction of the chip part, and the side plate sections of the shielding conductor are electrically connected via a plurality of shielding bumps in the front-rear direction to a ground layer pattern of a mounting substrate.

Abstract translation: 在芯片部件的屏蔽结构中，同时充分获得屏蔽效果和冷却效果。 在包括要公开的芯片部件的电子设备中，屏蔽导体包括覆盖芯片部分的顶板部分和形成为与顶板部分结合并且处于比顶板的下方的位置的侧板部分 并且在芯片部分的水平方向上布置在两侧，并且在屏蔽导体的前后方向的两个侧端形成开口，以在芯片部分的前后方向上打开两侧， 并且屏蔽导体的侧板部分经由多个前后方向的屏蔽凸块电连接到安装基板的接地层图案。

公开(公告)号：US20070040735A1

公开(公告)日：2007-02-22

申请号：US10555651

申请日：2005-03-24

Applicant: Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

Inventor： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

IPC: G01S7/28

CPC classification number: H05K1/167 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/183 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A multilayer dielectric substrate includes a first signal via, a second signal via, an internal-layer signal line, an internal-layer ground conductor, and ground vias. The first signal via is connected to a bias-and-control-signal terminal of a high-frequency semiconductor, and is arranged within a region corresponding to the electromagnetic shielding members. The second signal via is arranged outside the region, and is connected to an external terminal for a bias and control signal. The internal-layer signal line connects between the first and the second signal vias. The internal-layer ground conductor is arranged around the first and the second signal vias and the internal-layer signal line. The ground vias are arranged around the first and the second signal vias and the internal-layer signal line, on the internal-layer ground conductor. A resistance film is provided on at least one of an upper surface and a lower surface of the internal-layer signal line.

Abstract translation: 多层介质基板包括第一信号通孔，第二信号通孔，内层信号线，内层接地导体和接地通孔。 第一信号通孔连接到高频半导体的偏置和控制信号端子，并且被布置在对应于电磁屏蔽构件的区域内。 第二信号通孔布置在区域外部，并且连接到用于偏置和控制信号的外部端子。 内层信号线连接在第一和第二信号通孔之间。 内层接地导体围绕第一和第二信号通孔和内层信号线布置。 接地通孔围绕第一和第二信号通孔和内层信号线布置在内层接地导体上。 电阻膜设置在内层信号线的上表面和下表面中的至少一个上。