公开(公告)号：US20150114696A1

公开(公告)日：2015-04-30

申请号：US14525062

申请日：2014-10-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Ho Hong ,  Keun Yong Lee ,  Sung Han Kim ,  Sa Yong Lee ,  Sang Hyun Shin

IPC: H05K1/18 ,  H01G4/12 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00 ,  H05K3/44 ,  H01G4/30 ,  H05K1/03

CPC classification number: H05K1/186 ,  H01G2/02 ,  H01G2/10 ,  H01G4/224 ,  H01G4/30 ,  H05K1/182 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/007 ,  H05K3/4602 ,  H05K3/4605 ,  H05K2201/0116 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/0278 ,  H05K2203/1147 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49163

Abstract: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having external electrodes formed on both surfaces thereof.

Abstract translation: 这里公开了核心基板及其制造方法。 根据本发明的优选实施例，芯基板包括：形成有空隙的多孔支架; 形成为填充多孔支架的空隙的绝缘材料; 以及嵌入到多孔支架中的电子装置和绝缘材料，并且在其两个表面上形成有外部电极。

公开(公告)号：US20150102494A1

公开(公告)日：2015-04-16

申请号：US14219042

申请日：2014-03-19

Applicant: Wistron Corporation

Inventor： Hui-Ying Chou ,  Lee-Chieh Kang

IPC: H01L23/00 ,  H01L23/13

CPC classification number: H01L24/81 ,  H01L23/13 ,  H01L23/528 ,  H01L23/53204 ,  H05K3/0005 ,  H05K3/3442 ,  H05K3/4007 ,  H05K2201/0969 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract translation: 提供了一种形成对应于SMT部件的焊盘的空隙的方法。 该方法包括以下步骤：将一个或多个条件参数输入到搜索单元。 参考条件参数，搜索单元搜索所有的焊盘，以获得预选的焊盘组。 提供判断单元以确定预先选择的焊盘组中的每个焊盘是否满足预定的处理要求以生成要处理的焊盘组。 执行单元参照要处理的一组焊盘的角坐标来执行空隙形成步骤，以便在与焊盘的角部相对应的接触表面的部分处形成至少一个空隙。 在一个实施例中，相应地在接触表面处形成与被处理组的每个焊盘的各个角相关的四个空隙。

公开(公告)号：US20150098202A1

公开(公告)日：2015-04-09

申请号：US14269074

申请日：2014-05-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa LEE ,  Hai Joon LEE ,  Eun Hyuk CHAE ,  Bae Gen LEE ,  Jin Man JUNG

IPC: H05K1/02 ,  H05K1/03 ,  H01G4/12 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H05K1/185 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer ceramic electronic component embedded in a board may include: a ceramic body including dielectric layers; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body; and first and second external electrodes formed on both end portions of the ceramic body, respectively. The first external electrode may include a first base electrode and a first terminal electrode, the second external electrode may include a second base electrode and a second terminal electrode, 400 nm≦Ra≦600 nm may be satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm may be satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′.

Abstract translation: 嵌入板中的多层陶瓷电子部件可以包括：包括电介质层的陶瓷体; 多个第一和第二内部电极通过陶瓷体的两个端面交替地暴露; 以及分别形成在陶瓷体的两端部的第一外部电极和第二外部电极。 第一外部电极可以包括第一基极电极和第一端子电极，第二外部电极可以包括第二基极和第二端子电极，当第一外部电极的区域中的表面粗糙度为400nm时，可以满足Ra＆ 第一和第二端子电极中的50μm×50μm的面积被定义为Ra，当在第一和第二端子电极中的10μm×10μm的区域中的表面粗糙度时，可以满足130nm＆nlE; Ra'＆nlE; 400nm 被定义为Ra'。

公开(公告)号：US20150060122A1

公开(公告)日：2015-03-05

申请号：US14135560

申请日：2013-12-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo LEE ,  Jin Man JUNG

IPC: H05K1/18 ,  H01G4/008 ,  H01G4/30

CPC classification number: H05K1/185 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0231 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≦BWmax−BWmin≦100 μm is satisfied.

Abstract translation: 提供了一种嵌入板中的多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 第一和第二内部电极; 以及分别形成在陶瓷体的第一和第二侧面上的第一外部电极和第二外部电极，其中第一外部电极包括形成在第一电极层上的第一电极层和第一金属层，第二外部电极包括第二电极 层和形成在第二电极层上的第二金属层，第一和第二外部电极形成为延伸到陶瓷体的第一主表面，并且当第一和第二外部电极的第一和第二外部电极的最大宽度和最小宽度 形成在第一主表面上的第二外部电极分别被定义为BWmax和BWmin，满足0≤n1E; BWmax-BWmin＆nlE;满足100μm。

公开(公告)号：US20150026972A1

公开(公告)日：2015-01-29

申请号：US14332652

申请日：2014-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto OGAWA ,  Takashi WATANABE ,  Junya SHIMAKAWA ,  Mitsuhide KATO

IPC: H05K3/30

CPC classification number: H05K3/0052 ,  H01G2/065 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

Abstract translation: 一种电子部件的制造方法，其特征在于，具有基板型端子和与所述基板型端子连接的装置，所述基板型端子包括基板主体，所述基板主体具有彼此相对的第一和第二主要表面;以及电极，被配置为在所述第一 主要表面，其中所述装置设置在所述第一主表面上，包括在所述基板的所述第一和第二主表面中的一个的基板中形成凹槽，使得所述基板被划分为所述基板型端子，所述凹槽各自具有 深度小于基板的厚度，从与基板主体的主表面相反的另一主表面切割基板，使得凹槽在其厚度方向上穿过基板，并将该装置安装在每个第一主表面上 。

公开(公告)号：US08942003B2

公开(公告)日：2015-01-27

申请号：US13766809

申请日：2013-02-14

Applicant: Takahiro Sahara ,  Atsushi Kobayashi ,  Kiyoshi Takeuchi ,  Masahiko Igaue

Inventor： Takahiro Sahara ,  Atsushi Kobayashi ,  Kiyoshi Takeuchi ,  Masahiko Igaue

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/40

CPC classification number: H05K1/183 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K1/0306 ,  H05K3/284 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2203/049 ,  H05K2203/061 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.

Abstract translation: 多层印刷电路板包括多个绝缘层; 位于相应的相邻绝缘层之间的多个布线层; 以及多个层间连接导体，用于通过绝缘层电连接布线层; 其中通过一个或多个所述绝缘层形成空腔以插入第一电/电子部件，并且为所述绝缘层限定用于嵌入第二电/电子部件的区域。

公开(公告)号：US20150022982A1

公开(公告)日：2015-01-22

申请号：US14510219

申请日：2014-10-09

Applicant: IBIDEN CO., LTD.

Inventor： Yukinobu MIKADO ,  Shunsuke Sakai ,  Takashi Kariya ,  Toshiki Furutani

IPC: H05K1/18 ,  H05K1/11 ,  H01G2/06 ,  H05K3/32

CPC classification number: H05K1/185 ,  H01G2/06 ,  H05K1/0207 ,  H05K1/115 ,  H05K3/30 ,  H05K3/32 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.

Abstract translation: 布线板包括具有开口部分的基板，位于基板的开口部分中的电子部件，并且包括第一和第二电子部件，以及形成在基板和第一和第二部件上的绝缘层。 第一部件具有在第一部件的侧面具有侧部的第一电极和第二电极，第二部件具有第一部件和第二电极，第一部件的第一电极和第二电极具有在第二部件的侧面上的侧面部分，第一部件的第一电极和第一部件的第一电极 第二部件被设定为具有大致相同的电位，并且第一部件和第二部件位于基板的开口部分中，使得第一部件的第一电极的侧部位于第二部件的侧部 第二部件的第一电极。

公开(公告)号：US20140355162A1

公开(公告)日：2014-12-04

申请号：US14290026

申请日：2014-05-29

Applicant: MAGNA ELECTRONICS INC.

Inventor： Ralf Biegert

IPC: F02P19/02 ,  H02H5/04 ,  F02B3/06

CPC classification number: F02P19/027 ,  B23K1/018 ,  F02B3/06 ,  H01H9/167 ,  H01H37/761 ,  H01H2037/762 ,  H01H2037/763 ,  H02H5/047 ,  H05K13/0486 ,  H05K2201/10636

Abstract: A control device suitable for use in a vehicle includes a circuit board and a spring element. The circuit board includes a circuit element electrically connected thereat. The spring element is engaged with the circuit element and biased or urged towards the circuit element to exert a force at the circuit element in a direction generally parallel to a surface of the circuit board. The circuit element is electrically connected at the circuit board via a solder joint. When a temperature at the solder joint exceeds a threshold temperature, the spring element moves the circuit element along the surface of the circuit board to break the electrical connection at the solder joint.

Abstract translation: 适用于车辆的控制装置包括电路板和弹簧元件。 电路板包括与其电连接的电路元件。 弹簧元件与电路元件接合并被偏压或被推向电路元件，以在电路元件上大致平行于电路板的表面的方向施加力。 电路元件通过焊接点电连接在电路板上。 当焊点处的温度超过阈值温度时，弹簧元件沿着电路板的表面移动电路元件以破坏焊点处的电连接。

公开(公告)号：US20140318842A1

公开(公告)日：2014-10-30

申请号：US13952573

申请日：2013-07-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Woo HAN ,  Dae Bok OH ,  Jae Yeol CHOI ,  Sang Huk KIM

IPC: H01G4/30 ,  H05K1/18 ,  H01G2/06

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic component includes: a ceramic body including dielectric layers stacked therein and satisfying T(thickness)/W(width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body, having the dielectric layer disposed therebetween, and alternately exposed through end surfaces of the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to upper and lower main surfaces of the ceramic body wherein, when a height of the ceramic body is defined as a, and a distance from an upper end of the first or second external electrode formed on the upper main surface of the ceramic body to a lower end of the first or second external electrode formed on the lower main surface of the ceramic body is defined as b, 0.990≦a/b

Abstract translation: 提供了一种多层陶瓷电子部件，包括：陶瓷体，其包含堆叠在其中且满足T（厚度）/ W（宽度）> 1.0的电介质层; 第一和第二内部电极，其设置在陶瓷体中彼此面对，其间具有介电层，并且通过陶瓷体的端面交替暴露; 以及第一外部电极和第二外部电极，其从陶瓷体的端面延伸到陶瓷体的上部和下部主表面，其中当陶瓷体的高度被限定为a，并且距离第一或 形成在陶瓷体的上主表面上的形成在陶瓷体的下主表面上的第一或第二外部电极的下端的第二外部电极被定义为b，0.990＆nlE; a / b <1。

公开(公告)号：US20140312539A1

公开(公告)日：2014-10-23

申请号：US14320765

申请日：2014-07-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiko OKADA ,  Osamu CHIKAGAWA ,  Hidekiyo TAKAOKA ,  Shodo TAKEI

IPC: H05K3/46

CPC classification number: H05K3/4629 ,  H01G2/02 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/186 ,  H05K3/4611 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49155

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract translation: 另外，在芯片型陶瓷部件的陶瓷多层基板中，即使在陶瓷多层基板的表面上安装有芯片型陶瓷部件，也可以将芯片型陶瓷部件与内部导体或表面 陶瓷多层基板的电极大大改善和增加。 陶瓷多层基板包括层叠有多个陶瓷层的陶瓷层叠体，设置在陶瓷层叠体中的内部导体，设置在陶瓷层叠体的上表面的表面电极以及与该陶瓷层叠体接合的芯片型陶瓷构件 内部导体或表面电极通过外部电极。 内部导体或表面电极通过连接电极接合到外部电极，连接电极与内部导体，表面电极和外部电极中的任一个形成固溶体。