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    Reducing acoustic coupling to microphone on printed circuit board
    103.
    发明申请
    Reducing acoustic coupling to microphone on printed circuit board 有权
    降低印刷电路板上与麦克风的声耦合

    公开(公告)号：US20080260181A1

    公开(公告)日：2008-10-23

    申请号：US11787657

    申请日：2007-04-17

    Applicant: James Samuel Bowen

    Inventor： James Samuel Bowen

    IPC: H04R3/00

    CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10083 ,  H05K2201/2045

    Abstract: A mobile computing device comprises a printed circuit board, a processing circuit, a surface mount microphone, and a vibration attenuation portion. The processing circuit is disposed on a first portion of the printed circuit board. The surface mount microphone is disposed on a second portion of the printed circuit board. The vibration attenuation portion of the board is configured to attenuate vibrations from the first to the second portion of the printed circuit board.

    Abstract translation: 移动计算设备包括印刷电路板，处理电路，表面安装麦克风和振动衰减部分。 处理电路设置在印刷电路板的第一部分上。 表面贴装麦克风设置在印刷电路板的第二部分上。 板的振动衰减部分构造成衰减从印刷电路板的第一部分到第二部分的振动。

    SYSTEM AND METHOD OF PROVIDING STRUCTURAL SUPPORT TO PRINTED WIRING ASSEMBLY COMPONENTS
    104.
    发明申请
    SYSTEM AND METHOD OF PROVIDING STRUCTURAL SUPPORT TO PRINTED WIRING ASSEMBLY COMPONENTS 审中-公开
    向印刷装配组件提供结构支持的系统和方法

    公开(公告)号：US20080000675A1

    公开(公告)日：2008-01-03

    申请号：US11428053

    申请日：2006-06-30

    Applicant: John Fredy Arroyave ,  Michael James Gillespie

    Inventor： John Fredy Arroyave ,  Michael James Gillespie

    IPC: H05K1/16

    CPC classification number: H05K3/301 ,  H05K2201/10689 ,  H05K2201/2045 ,  H05K2203/304

    Abstract: A printed wiring assembly is provided. The printed wiring assembly comprises a printed wiring board, at least one surface mounted component coupled to a surface of the printed wiring board, and at least one support device coupled to the printed wiring board and to the at least one surface mounted component, wherein the at least on surface mounted component is adapted to limit movement of the at least one surface mounted component when the assembly is subject to vibration environments.

    Abstract translation: 提供印刷线路组件。 印刷线路组件包括印刷线路板，耦合到印刷线路板的表面的至少一个表面安装部件，以及耦合到印刷线路板和至少一个表面安装部件的至少一个支撑装置，其中， 至少在表面安装的部件上适合于当组件经受振动环境时，限制所述至少一个表面安装部件的移动。

    Electric circuit device and related manufacturing method
    105.
    发明申请
    Electric circuit device and related manufacturing method 有权
    电路装置及相关制造方法

    公开(公告)号：US20070278623A1

    公开(公告)日：2007-12-06

    申请号：US11806675

    申请日：2007-06-01

    Applicant: Tohru Nomura

    Inventor： Tohru Nomura

    IPC: H01L29/40

    CPC classification number: H05K3/284 ,  H01L23/24 ,  H01L23/3135 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K2201/0162 ,  H05K2201/10015 ,  H05K2201/10272 ,  H05K2201/2045 ,  H05K2203/1322 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: An electric circuit device and related manufacturing method are disclosed as having a case incorporating therein a substrate on which electric circuit elements are mounted. A sealant is filled in the case to cover the electric circuit elements and the substrate and is composed of a lower layer gel and an upper layer gel formed in a two-layer structure. The upper layer gel has a penetration equal to or less than 90 and the lower layer gel has a penetration greater than that of the upper layer gel to allow the upper layer gel to suppress vibration of a surface of the lower gel for thereby suppressing the deformation of the lower layer gel even in the presence of a tendency causing the electric circuit elements or the substrate to vibrate, preventing a degraded function in insulation, waterproof and vibrational relaxation of the lower layer gel.

    Abstract translation: 公开了一种电路装置及相关的制造方法，其具有其中安装有电路元件的基板的壳体。 在壳体中填充密封剂以覆盖电路元件和基板，并且由下层凝胶和形成为两层结构的上层凝胶组成。 上层凝胶具有等于或小于90的渗透性，并且下层凝胶的穿透力大于上层凝胶的渗透，以允许上层凝胶抑制下凝胶表面的振动，从而抑制变形 即使存在导致电路元件或基板振动的趋势，防止下层凝胶的绝缘，防水和振动松弛的功能降低。

    Method and apparatus for an electronic equipment rack
    107.
    发明申请
    Method and apparatus for an electronic equipment rack 有权
    电子设备机架的方法和装置

    公开(公告)号：US20070151779A1

    公开(公告)日：2007-07-05

    申请号：US11321970

    申请日：2005-12-29

    Applicant: Jody Robbins ,  William Woodbury ,  Richard Chaput

    Inventor： Jody Robbins ,  William Woodbury ,  Richard Chaput

    IPC: B60K1/00

    CPC classification number: H05K5/0208 ,  G06F1/16 ,  H05K7/18 ,  H05K2201/2045

    Abstract: A method and apparatus for an electronic equipment rack that provides mobility through directional self-propulsion and multi-axis suspension. The electronic equipment rack further provides self-powered operation and environmental control with wireless access, while protecting against unauthorized access, electromagnetic interference (EMI), and dust contamination. An alternate embodiment provides a non-mobile electronic equipment rack with multi-axis suspension, while optionally providing wireless access and protection against unauthorized access and the environment.

    Abstract translation: 一种用于通过定向自推进和多轴悬架提供移动性的电子设备机架的方法和装置。 电子设备机架进一步提供自供电操作和无线接入环境控制，同时防止未经授权的访问，电磁干扰（EMI）和灰尘污染。 另一实施例提供具有多轴悬架的非移动电子设备机架，同时可选地提供无线访问和防止未经授权的访问和环境。

    Non-rigid conductor link measurement sensor and method for the production thereof
    108.
    发明申请
    Non-rigid conductor link measurement sensor and method for the production thereof 有权
    非刚性导体连接测量传感器及其制造方法

    公开(公告)号：US20060276063A1

    公开(公告)日：2006-12-07

    申请号：US10571933

    申请日：2004-10-27

    Applicant: Philippe Guichard ,  Jean-Louis Le Corre ,  Jean-Marie Odermath ,  Jerome Inglese

    Inventor： Philippe Guichard ,  Jean-Louis Le Corre ,  Jean-Marie Odermath ,  Jerome Inglese

    IPC: H01R12/00

    CPC classification number: G01P1/023 ,  H01L2224/48091 ,  H01L2924/00011 ,  H05K1/0271 ,  H05K3/308 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/01034

    Abstract: The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell per se is mounted in a package that furthermore comprises a printed circuit board carrying the electronic processing circuits associated with the microsensor cell. In order to establish a non-rigid electrical connection between a conductive terminal of the board and a connection pin of the cell , a narrow strip-shaped conductive connection cut by chemical machining from a thin and flexible metal sheet (CuBe) is soldered. The strip comprises at least one circle-arc segment (51) extending over one half-turn or three-fourths of a turn. Its resilience permits very low stiffness in all directions and therefore prevents any transmission of vibrations or shocks to the cell. The manufacture of the connections may be collective for all the connections of a sensor and for successive sensors manufactured serially. Application to accelerometers subjected to large shock and vibration stresses.

    Abstract translation: 本发明涉及包括诸如微加速度计的机电微传感器单元的电子传感器，并且更具体地涉及微传感器单元本身安装在包装中的方式，该包装还包括承载电子处理电路的印刷电路板 与微传感器电池相关联。 为了在电路板的导电端子和电池的连接销之间建立非刚性的电连接，焊接由薄而柔性的金属板（CuBe）通过化学加工切割的狭窄的带状导电连接。 该条包括至少一个圆弧段（51），其延伸超过一半圈或四分之三圈。 其弹性允许在所有方向上具有非常低的刚度，并且因此防止振动或冲击传播到电池。 对于传感器的所有连接和连续制造的连续传感器，连接的制造可以是集体的。 应用于受到大冲击和振动应力的加速度计。

    Dynamic isolating mount for processor packages
    110.
    发明授权
    Dynamic isolating mount for processor packages 有权
    用于处理器封装的动态隔离安装

    公开(公告)号：US06920052B2

    公开(公告)日：2005-07-19

    申请号：US10672676

    申请日：2003-09-26

    Applicant: Daniel L. Callahan ,  Raymond J. Iannuzzelli

    Inventor： Daniel L. Callahan ,  Raymond J. Iannuzzelli

    IPC: H01L23/00 ,  H01L23/40 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K7/20 ,  H05K7/00 ,  H05K7/12

    CPC classification number: H01L23/562 ,  H01L23/4006 ,  H01L23/49827 ,  H01L2224/16 ,  H05K1/0271 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613

    Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

    Abstract translation: 本发明涉及防止/最小化处理器的陶瓷体中的开裂的方法和装置。 防止/最小化破裂的能力可以确保成功运行，并大大提高处理器的使用寿命。 本发明公开了一种用于将微处理器与印刷电路板保持在期望的关系的装置，同时限制了冲击和向处理器的振动运动的传播，包括印刷线路板，处理器和压缩在 印刷线路板和处理器，其中处理器将动态隔离安装座维持在压缩状态，使得动态隔离安装座承载在印刷线路板上。

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