Abstract:
An electrodeless lamp includes a bulbous lamp envelope enclosing an inert gas and a vaporizable metal fill, the lamp envelope having a reentrant cavity and an envelope bottom, an electromagnetic coupler positioned within the reentrant cavity, and a thermal shield positioned in proximity to the envelope bottom and configured to increase the temperature of the envelope bottom. By increasing the temperature of the envelope bottom, a cold spot is prevented. As a result, light output at low temperatures is comparable to light output at room temperature.
Abstract:
In a field emitter (100) including a substrate (110), the substrate (110) has a substantially non-conductive top substrate surface (112). A conductive cathode member (130) is disposed on the top substrate surface (112) and has a top cathode surface (132). A conductive gate member (120) is disposed on the top substrate surface (112) and is substantially coplanar with the cathode member (130). An emitter structure (140) extends away from the top cathode surface (132). The gate member (120) is spaced apart from the cathode member (130) at a distance so that when a predetermined potential is applied between the cathode member (130) and gate member (120), the emitter structure (140) will emit electrons.
Abstract:
A short arc discharge lamp has improved starting properties in which there is no danger of damaging the arc tube that surrounds a discharge space and in which the radiant light from the arc tube is not adversely shielded. This is achieved by providing the short arc discharge lamp with a first electrode having an electrical potential and to which a high voltage is applied, and a second electrode opposite the first at a in spaced relationship. Additionally, in the discharge space, there is positioned at least one conductive component with a tip projecting into the discharge space. The conductive component has an electrical potential which is identical to the electrical potential of the first electrode and has a tip spaced a distance from the second electrode which is greater than the distance between the first and the second electrode.
Abstract:
To provide an electron source to be used for a surface analyzer such as a scanning or transmission electron microscope or an Auger electron spectroscope, or an electron beam lithography machine, particularly for a semiconductor wafer inspection apparatus such as a scanning electron microscope to be used at a low acceleration with an electron beam acceleration voltage of up to 1 kV, CD SEM or DR SEM. An electron source wherein a barium supplying source consisting of a complex oxide comprising barium oxide and an oxide of metal other than barium, is provided at a portion of a single crystal needle of tungsten or molybdenum.
Abstract:
An improved process for growing carbon nanotubes includes steps of providing a glass substrate that has a porous surface, depositing a catalyst into the pores on the porous surface, and growing carbon nanotubes on the substrate. Desirably, the carbon nanotubes are grown using a chemical vapor deposition technique in which the direction of flow of a carbon precursor gas (and any optional diluent gases) is aligned with the desired direction of growth propagation. The techniques of the invention provide a field emission device having more uniformly aligned carbon nanotubes and/or more uniformly sized carbon nanotubes.
Abstract:
A method is provided for electroforming metal integrated circuit structures. The method comprises: forming an opening such as a via or line through an interlevel insulator, exposing a substrate surface; forming a base layer overlying the interlevel insulator and substrate surface; forming a strike layer overlying the base layer; forming a top layer overlying the strike layer; selectively etching to remove the top layer overlying the substrate surface, exposing a strike layer surface; and, electroforming a metal structure overlying the strike layer surface. The electroformed metal structure is deposited using an electroplating or electroless deposition process. Typically, the metal is Cu, Au, Ir, Ru, Rh, Pd, Os, Pt, or Ag. The base, strike, and top layers can be deposited using physical vapor deposition (PVD), evaporation, reactive sputtering, or metal organic chemical vapor deposition (MOCVD).
Abstract:
Described herein is a resistor layer for use in field emission display devices and the like, and its method of manufacture. The resistor layer is an amorphous silicon layer doped with nitrogen and phosphorus. Nitrogen concentration in the resistor layer is preferably between about 5 and 15 atomic percent. The presence of nitrogen and phosphorus in the silicon prevents diffusion of Si atoms into metal conductive layers such as aluminum, even up to diffusion and packaging temperatures. The nitrogen and phosphorus also prevent defects from forming at the boundary between the resistor layer and metal conductor. This leads to better control over shorting and improved resistivity in the resistor.
Abstract:
Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.
Abstract:
A plasma display device including a plasma display panel for displaying images, a chassis base coupled to the plasma display panel, a reinforcing member coupled to the chassis base, and a supporting member coupled to the reinforcing member.
Abstract:
A field emission device and a field emission display (FED) using the same and a method of making the field emission device. The FED includes a glass substrate, a layer of a material formed on the glass substrate and having a concave portion, a cathode electrode formed on the material layer and also having a concave portion, electron emitters formed on the concave portion of the cathode electrode, a gate insulating layer formed on the cathode electrode and having a cavity communicating with the concave portion, and a gate electrode formed on the gate insulating layer and having a gate aperture aligned with the cavity.