公开(公告)号：US20230382722A1

公开(公告)日：2023-11-30

申请号：US18366201

申请日：2023-08-07

Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： Frank SENGER ,  Shanshan GU-STOPPEL ,  Erdem YARAR ,  Gunnar WILLE

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00317 ,  B81B7/0041 ,  B81C2203/0118 ,  B81C2201/0123 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/0163

Abstract: A method for encapsulating an MEMS structure in a stack structure includes providing a functional wafer structure including at least partly the MEMS structure. The method includes arranging the functional wafer structure and a glass wafer in the stack structure and along a stacking direction and is performed such that a cavity, in which at least part of the MEMS structure is arranged, is closed on one side along the stacking direction by the glass wafer and such that a spacing structure is arranged between the part of the MEMS structure and the glass wafer in the stack structure to provide a spacing between the part of the MEMS structure and the glass wafer along the stacking direction, such that the spacing structure encloses part of the cavity.

公开(公告)号：US11696507B2

公开(公告)日：2023-07-04

申请号：US16706567

申请日：2019-12-06

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Domenico Giusti ,  Carlo Luigi Prelini

IPC: H10N30/20 ,  B81B3/00

CPC classification number: H10N30/2042 ,  B81B3/0018 ,  B81B3/0072 ,  B81B2201/032

Abstract: A MEMS device having a body with a first and a second surface, a first portion and a second portion. The MEMS device further has a cavity extending in the body from the second surface; a deformable portion between the first surface and the cavity; and a piezoelectric actuator arranged on the first surface, on the deformable portion. The deformable portion has a first region with a first thickness and a second region with a second thickness greater than the first thickness. The second region is adjacent to the first region and to the first portion of the body.

公开(公告)号：US20190161338A1

公开(公告)日：2019-05-30

申请号：US16197810

申请日：2018-11-21

Applicant: STMicroelectronics S.r.l.

Inventor： Domenico GIUSTI ,  Carlo Luigi PRELINI

IPC: B81B3/00

CPC classification number: B81B3/0037 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  H01L41/0933 ,  H01L41/0953 ,  H04R17/00 ,  H04R2201/003 ,  H04R2217/00

Abstract: A micro-electro-mechanical actuator device includes a fixed structure and a mobile structure. The mobile structure includes a first deformable band, a second deformable band, and a third deformable band, both of which extend on opposite sides of the first deformable band, each of which carries a piezoelectric actuator. In a working condition, in which the second and third piezoelectrics are biased, the second and third deformable bands are subjected to a negative bending, while the first deformable band is subjected to a positive bending. There are thus generated two translations that add together, causing a displacement of the first deformable band greater than the one that may be obtained by a single membrane of an equal base area.

公开(公告)号：US20180216178A1

公开(公告)日：2018-08-02

申请号：US15886511

申请日：2018-02-01

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： Kim Yang LEE ,  Thomas Young CHANG ,  David S. KUO ,  ShuaiGang XIAO ,  Xiaomin YANG ,  Koichi WAGO

IPC: C12Q1/6869 ,  G01N27/327 ,  G01N27/447 ,  B81C1/00

CPC classification number: C12Q1/6869 ,  B01L3/502707 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/0896 ,  B81B2201/032 ,  B81B2201/058 ,  B81B2203/0109 ,  B81C1/00071 ,  G01N27/3278 ,  G01N27/447 ,  G01N27/44791 ,  C12Q2565/607 ,  C12Q2565/629

Abstract: A DNA sequencing device and related methods, wherein the device includes a substrate, a nanochannel formed in the substrate, a first electrode positioned on a first side of the nanochannel, and a second electrode. The second electrode is positioned on a second side of the nanochannel opposite the first electrode, and is spaced apart from the first electrode to form an electrode gap that is exposed in the nanochannel. At least a portion of first electrode is movable relative to the second electrode to decrease a size of the electrode gap.

公开(公告)号：US20180107854A1

公开(公告)日：2018-04-19

申请号：US15853396

申请日：2017-12-22

Applicant: INVENSENSE, INC.

Inventor： Julius Ming-Lin Tsai ,  Mike Daneman ,  Sanjiv Kapoor

IPC: G06K9/00 ,  B06B1/06 ,  B81B7/00 ,  B81C1/00 ,  G01H11/08

CPC classification number: G06K9/0002 ,  B06B1/0666 ,  B06B1/067 ,  B06B2201/70 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/015 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00301 ,  B81C2201/0105 ,  B81C2201/0109 ,  B81C2203/035 ,  B81C2203/036 ,  B81C2203/0792 ,  G01H11/08

Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

公开(公告)号：US20170327370A1

公开(公告)日：2017-11-16

申请号：US15367766

申请日：2016-12-02

Applicant: INVENSENSE, INC.

Inventor： Julius Ming-Lin Tsai ,  Michael J. Daneman

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B3/0029 ,  B81B2201/032 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00182 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0792

Abstract: A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a third surface bonded to the insulating layer and a fourth surface; a piezoelectric layer deposited over the fourth surface of the device layer; a metal conductivity layer disposed over the piezoelectric layer; a bond layer disposed over a portion of the metal conductivity layer; and a stand-off formed on the first silicon substrate; wherein the first silicon substrate is bonded to a second silicon substrate, comprising: a metal electrode configured to form an electrical connection between the metal conductivity layer formed on the first silicon substrate and the second silicon substrate.

公开(公告)号：US20170276929A1

公开(公告)日：2017-09-28

申请号：US15511040

申请日：2015-09-16

Applicant: President and Fellows of Harvard College

Inventor： Zhi Ern TEOH ,  Michael KARPELSON ,  Robert J. WOOD

IPC: G02B26/08 ,  H02K33/16 ,  B81C1/00 ,  B81B3/00 ,  H01L41/09

CPC classification number: G02B26/085 ,  B81B3/0051 ,  B81B2201/032 ,  B81B2201/047 ,  B81C1/00007 ,  G02B26/0858 ,  H01L41/0933 ,  H02K15/00 ,  H02K26/00 ,  H02K33/16 ,  H02K99/20

Abstract: A pop-up laminate structure includes rigid layers, at least one flexible layer, at least one optical component, and an actuator. At least one of the rigid layers defines gaps extending there through to form a plurality of rigid segments separated by the gaps in the rigid layer. The flexible layer is bonded to the rigid segments to form joints for folding. The optical component is mounted to a rigid layer and configured to generate, capture or alter a light beam. The actuator is mounted to at least one of the rigid layers and configured to displace at least one rigid segment that, in turn, displaces the optical component. At least some of the layers are bonded to adjacent layers only at selected locations forming islands of inter-layer bonds to allow expansion of the laminate into an expanded three-dimensional structure.

公开(公告)号：US09766450B2

公开(公告)日：2017-09-19

申请号：US14872682

申请日：2015-10-01

Applicant: Jun Nakagawa ,  Tsuyoshi Hashiguchi ,  Eri Watanabe ,  Goichi Akanuma ,  Tomofumi Kitazawa

Inventor： Jun Nakagawa ,  Tsuyoshi Hashiguchi ,  Eri Watanabe ,  Goichi Akanuma ,  Tomofumi Kitazawa

IPC: G02B26/08 ,  G02B26/10 ,  H04N9/31 ,  B81B3/00

CPC classification number: G02B26/101 ,  B81B3/0045 ,  B81B2201/032 ,  B81B2201/042 ,  G02B26/0858 ,  H04N9/3129

Abstract: A light deflector is provided including a mirror unit having a light reflection plane, a movable frame to support the mirror unit, a support frame disposed to surround the movable frame, a pair of serpentine beams each disposed between the movable frame and the support frame on both sides of the movable frame to form a turning shape, each of the serpentine beams having one end attached to the support frame, and another end attached to the movable frame, and a vibration damper provided on a portion that moves due to deformation of the serpentine beams caused by application of voltage being transferred.

公开(公告)号：US09676607B2

公开(公告)日：2017-06-13

申请号：US15098089

申请日：2016-04-13

Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.

Inventor： Matthieu Gaudet ,  Klaus Schimmanz ,  Michael Stolz ,  Sergiu Langa ,  Holger Conrad ,  Bert Kaiser

IPC: H01L29/84 ,  B81B3/00

CPC classification number: B81B3/0021 ,  B81B3/0094 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/0127

Abstract: Micromechanical devices include actively deflectable elements. The activation is performed by a layer stack which causes the deflection responsive to attractive forces acting upon the layers of the layer stack.

公开(公告)号：US09440844B2

公开(公告)日：2016-09-13

申请号：US13854834

申请日：2013-04-01

Applicant: Semiconductor Components Industries, LLC

Inventor： Kenneth Edward Salsman

IPC: G01J1/00 ,  B81B3/00 ,  G06F3/03 ,  H01L27/146 ,  H04N5/225 ,  H04N5/33 ,  H04N9/04 ,  G01J3/02 ,  G01J3/28

CPC classification number: B81B3/0029 ,  B81B2201/032 ,  G01J3/0229 ,  G01J3/2823 ,  G06F3/0304 ,  H01L27/14629 ,  H04N5/2258 ,  H04N5/332 ,  H04N9/045

Abstract: Imaging systems may include an image sensor and a microelectromechanical systems array. The microelectromechanical systems array may be mounted over the image sensor. The system may include an infrared lens that focuses infrared light onto a first surface of the microelectromechanical systems array and a visible light source that illuminates an opposing second surface of the microelectromechanical systems array. The image sensor may capture images of the opposing second surface of the microelectromechanical systems array. The system may include processing circuitry that generates infrared images of a scene using the captured images of the microelectromechanical systems array. Microelectromechanical systems elements in the microelectromechanical systems array may change position or shape in response to infrared light that is absorbed by the microelectromechanical systems elements. Each microelectromechanical systems element may include infrared absorbing material on a metal layer. The system may include optical elements that focus visible light onto the image sensor.

Abstract translation: 成像系统可以包括图像传感器和微机电系统阵列。 微机电系统阵列可以安装在图像传感器上。 该系统可以包括将红外光聚焦到微机电系统阵列的第一表面上的红外透镜和照亮微机电系统阵列的相对的第二表面的可见光源。 图像传感器可以捕获微机电系统阵列的相对的第二表面的图像。 该系统可以包括利用微机电系统阵列的捕获图像产生场景的红外图像的处理电路。 微机电系统阵列中的微电子机械系统元件可以响应于被微机电系统元件吸收的红外光而改变位置或形状。 每个微机电系统元件可以包括在金属层上的红外吸收材料。 该系统可以包括将可见光聚焦到图像传感器上的光学元件。