公开(公告)号：US20170298218A1

公开(公告)日：2017-10-19

申请号：US15318787

申请日：2016-09-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui LI ,  Kehong FANG ,  Yongjing XU

IPC: C08L63/00 ,  C08G59/50 ,  C08G59/62 ,  C08J5/04 ,  C08G59/42 ,  H01B3/40 ,  C08L63/08 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/04 ,  B32B15/06 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B25/02 ,  B32B25/042 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/281 ,  B32B27/285 ,  B32B27/302 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2250/05 ,  B32B2255/02 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/0214 ,  B32B2264/0257 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/12 ,  B32B2270/00 ,  B32B2307/204 ,  B32B2307/21 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/4026 ,  B32B2307/724 ,  B32B2307/748 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/40 ,  C08G59/42 ,  C08G59/4238 ,  C08G59/4284 ,  C08G59/5046 ,  C08G59/621 ,  C08G73/0233 ,  C08G73/06 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/08 ,  C08K3/01 ,  C08K5/0025 ,  C08K13/02 ,  C08L35/06 ,  C08L61/34 ,  C08L63/08 ,  C08L79/04 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/05 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0242

Abstract: The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

公开(公告)号：US20170290141A1

公开(公告)日：2017-10-05

申请号：US15629504

申请日：2017-06-21

Applicant: Kaneka Corporation

Inventor： Masayoshi Kido ,  Yoshihide Sekito

IPC: H05K1/03 ,  C09D5/33 ,  G03F7/027 ,  H05K1/02

CPC classification number: H05K1/0216 ,  C09D5/004 ,  G03F7/027 ,  H05K1/028 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/2054

Abstract: The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

公开(公告)号：US20170287589A1

公开(公告)日：2017-10-05

申请号：US15620028

申请日：2017-06-12

Applicant: Arlon LLC

Inventor： Daniel Chang ,  Sam Najjar

IPC: H01B3/40 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01B3/40 ,  C08J5/24 ,  C08J2379/04 ,  C08K3/36 ,  C08K5/523 ,  C08L79/04 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/249955 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31931 ,  Y10T442/20 ,  Y10T442/2475

Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

公开(公告)号：US20170267807A1

公开(公告)日：2017-09-21

申请号：US15071733

申请日：2016-03-16

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Yeong-Tong HWANG ,  Chen-Hua WU ,  Jaou-Shain YU

IPC: C08G59/14 ,  H05K1/03 ,  C09D163/00

CPC classification number: H05K1/0373 ,  C08G59/02 ,  C08G65/485 ,  C09D163/00 ,  H05K1/0237 ,  H05K1/0366 ,  H05K2201/012

Abstract: The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I). whereinA is: PPE are: Z are: Y are: Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100˜450 parts and catalyst 0.01˜5 parts are added, stirred and mixed at 90˜180□, for 1˜4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03 (1 GHz), dissipation factor is 0.0046 (1 GHz) and no delamination longer than 60 minutes dipping in 288 soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.

公开(公告)号：US20170198135A1

公开(公告)日：2017-07-13

申请号：US15313669

申请日：2014-12-02

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui LI ,  Kehong FANG

IPC: C08L63/08 ,  H05K1/03 ,  C08J5/24 ,  C08J5/04 ,  C08L63/00 ,  C08G59/58

CPC classification number: C08L63/08 ,  B32B15/092 ,  C08G59/42 ,  C08G59/58 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/08 ,  C08J2425/02 ,  C08J2435/00 ,  C08J2471/12 ,  C08K3/36 ,  C08K5/0066 ,  C08K5/3445 ,  C08K5/49 ,  C08L35/06 ,  C08L63/00 ,  C08L63/04 ,  C08L71/12 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2205/05 ,  C08L2312/00 ,  H05K1/0373 ,  H05K2201/012 ,  C08F212/12 ,  C08F222/06

Abstract: The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

公开(公告)号：US20170190875A1

公开(公告)日：2017-07-06

申请号：US15468977

申请日：2017-03-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki FUJIWARA ,  Yuki KITAI ,  Hirosuke SAITO

IPC: C08K5/378 ,  C08K5/3445 ,  H01L23/29 ,  C08J5/24 ,  B32B15/14 ,  H05K1/03 ,  C08G73/02 ,  C08L79/02

CPC classification number: C08K5/378 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2581/00 ,  C08G14/06 ,  C08G59/686 ,  C08G59/687 ,  C08G73/0233 ,  C08G73/22 ,  C08J5/24 ,  C08J2379/02 ,  C08J2379/04 ,  C08K5/3445 ,  C08L61/04 ,  C08L61/34 ,  C08L63/00 ,  C08L79/02 ,  C08L79/04 ,  C08L2203/20 ,  H01L23/145 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0129 ,  H01L2924/00

Abstract: A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.

公开(公告)号：US20170166513A1

公开(公告)日：2017-06-15

申请号：US15130085

申请日：2016-04-15

Applicant: GUANGDONG GUANGSHAN NEW MATERIALS CO., LTD.

Inventor： Qingchong Pan

IPC: C07C69/94 ,  C08G59/42 ,  C09D163/00

CPC classification number: C07C69/94 ,  B32B5/02 ,  B32B7/04 ,  B32B9/005 ,  B32B9/041 ,  B32B15/08 ,  B32B15/09 ,  B32B15/092 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/281 ,  B32B27/36 ,  B32B27/38 ,  B32B2250/42 ,  B32B2255/00 ,  B32B2255/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/12 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/748 ,  B32B2457/00 ,  B32B2605/00 ,  C08G59/4223 ,  C08G59/686 ,  C08G63/193 ,  C08G63/50 ,  C08J5/24 ,  C08J2363/00 ,  C09D163/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4676 ,  H05K2201/012 ,  H05K2201/0209

Abstract: The present invention relates to an epoxy resin curing agent having a structure of Formula I and preparation methods and uses thereof. The present invention makes a resin composition formed by the epoxy resin curing agent have good low dielectric properties by using an epoxy resin curing agent having a specific structure, and the cured products of the epoxy resin composition have low dielectric constant and dielectric loss and good heat resistance and are low dielectric materials having great economic properties and being environmental friendly.

公开(公告)号：US20170156207A1

公开(公告)日：2017-06-01

申请号：US15428734

申请日：2017-02-09

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

IPC: H05K1/03 ,  C08L63/04 ,  C08J5/24 ,  C08G59/50 ,  C08G59/40 ,  B32B15/08 ,  C08L63/08

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/4021 ,  C08G59/4042 ,  C08G59/506 ,  C08G59/5086 ,  C08G73/12 ,  C08G73/124 ,  C08J5/24 ,  C08J2363/04 ,  C08J2363/08 ,  C08J2423/22 ,  C08J2425/08 ,  C08L25/08 ,  C08L63/00 ,  C08L63/04 ,  C08L63/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/31678 ,  C08L2666/04

Abstract: The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.

公开(公告)号：US09629254B2

公开(公告)日：2017-04-18

申请号：US14208144

申请日：2014-03-13

Applicant: Plasma Systems Holdings, Inc.

Inventor： Michael Forney ,  James Stameson

IPC: H05K3/28 ,  C08G59/68 ,  H05K1/03

CPC classification number: H05K3/285 ,  C08G59/686 ,  H05K1/0326 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/24802

Abstract: Disclosed herein are embodiments of an epoxy casting resin system which can be used to at least partially cover an electronic component or mechanism. In some embodiments, the epoxy resin can have a low viscosity, while maintaining advantageous physical, thermal, and electrical properties. Further described are methods for making embodiments of the epoxy casting resin.

公开(公告)号：US20170002131A1

公开(公告)日：2017-01-05

申请号：US15113618

申请日：2015-06-01

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Xianping Zeng ,  Liexiang He ,  Yongjing Xu

IPC: C08G59/06 ,  C08K5/11 ,  C08K5/00 ,  C08J5/24 ,  C08K3/00 ,  C08K3/36

CPC classification number: C08G59/063 ,  B32B27/04 ,  C08G59/3236 ,  C08G59/4215 ,  C08G73/1071 ,  C08J5/24 ,  C08J2363/02 ,  C08K3/013 ,  C08K3/36 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/11 ,  C08L63/00 ,  C08L79/00 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212

Abstract: Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.

Abstract translation: 在本发明中，提供了环氧树脂组合物，预浸料和使用该环氧树脂的叠层体，所述环氧树脂组合物包含以下组分：（A）酰亚胺改性环氧树脂; 和（B）交联剂，所述酰亚胺改性环氧树脂是具有式（1）和/或式（2）结构的环氧树脂。 由环氧树脂组合物制备的预浸料和层压板具有高玻璃化转变温度，低介电常数，低介电损耗因子，高耐热和耐湿性，高韧性和良好的加工性能。