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111.发明授权公开(公告)号：US09642248B2
公开(公告)日：2017-05-02
申请号：US14618235
申请日：2015-02-10
Applicant: Intel Corporation
Inventor： Qing Ma , Johanna M. Swan , Robert Starkston , John S. Guzek , Robert L. Sankman , Aleksandar Aleksov
IPC: H05K1/00 , H05K1/03 , H01L23/15 , H01L23/498 , H01L23/538 , H01L23/00 , H05K1/18 , H05K3/46 , H01L21/56 , H01L21/48 , H05K1/02 , H05K1/11
CPC classification number: H01L23/5386 , B32B2457/08 , H01L21/4857 , H01L21/486 , H01L21/56 , H01L21/568 , H01L21/6835 , H01L23/15 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/09 , H01L24/13 , H01L24/17 , H01L24/19 , H01L24/24 , H01L24/81 , H01L24/82 , H01L25/0655 , H01L2221/68345 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/08238 , H01L2224/12105 , H01L2224/13025 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2402 , H01L2224/24137 , H01L2224/81192 , H01L2224/814 , H01L2224/81801 , H01L2224/8185 , H01L2224/8203 , H01L2224/821 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/15724 , H01L2924/15747 , H01L2924/18162 , H01L2924/2064 , H01L2924/20641 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K1/185 , H05K3/4688 , H05K2201/017 , H05K2203/1469 , Y10T156/1057 , H01L2924/014 , H01L2924/00
Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.
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公开(公告)号：US09591749B2
公开(公告)日：2017-03-07
申请号：US14582549
申请日：2014-12-24
Applicant: INNOLUX CORPORATION
Inventor： Kai Meng , Lien-Hsin Lee
CPC classification number: H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
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113.发明授权LED light source unit for backlight of liquid crystal display, and liquid crystal display 有权液晶显示器背光用LED光源单元，液晶显示器公开(公告)号：US09510442B2
公开(公告)日：2016-11-29
申请号：US13217929
申请日：2011-08-25
Applicant: Yuki Tanuma , Tomoharu Horio , Tadatoshi Miwa , Hiroyuki Tajiri , Takumi Yamade
Inventor： Yuki Tanuma , Tomoharu Horio , Tadatoshi Miwa , Hiroyuki Tajiri , Takumi Yamade
CPC classification number: H05K1/0306 , G02B6/0031 , G02B6/0068 , G02B6/0073 , G02B6/0083 , H01L24/29 , H01L24/48 , H01L24/49 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2924/01014 , H01L2924/01078 , H01L2924/078 , H01L2924/12035 , H01L2924/12041 , H05K2201/017 , H05K2201/10106 , H05K2201/2054 , H01L2224/45099 , H01L2924/3512 , H01L2924/00
Abstract: An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.
Abstract translation: 提供了一种用于液晶显示器的背光源的LED光源单元。 光源单元包括多个LED芯片，绝缘基板和覆盖基板主表面的金属膜。 LED芯片安装在金属膜上。 通过这种布置，增强了光源单元的亮度。
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公开(公告)号：US09433088B2
公开(公告)日：2016-08-30
申请号：US14582530
申请日：2014-12-24
Applicant: INNOLUX CORPORATION
Inventor： Kai Meng , Lien-Hsin Lee
CPC classification number: H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
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公开(公告)号：US09430072B2
公开(公告)日：2016-08-30
申请号：US14473939
申请日：2014-08-29
Applicant: Wintek Corporation
Inventor： Yi-Chun Lin , Ming-Kung Wu , Hsiao-Ping Li , Ping-Wen Huang , Cheng-Yi Chou , Yu-Hua Wu , Xuan-Chang Shiu , Chih-Yuan Wang , Ching-Fu Hsu , Hsiao-Hui Liao , Ting-Yu Chang , Fa-Cheng Wu , Wen-Chun Wang
CPC classification number: G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0306 , H05K1/0393 , H05K2201/017 , H05K2201/09 , H05K2201/10106 , H05K2201/10128
Abstract: A touch panel includes a cover glass, a flexible substrate, and a touch-sensing electrode structure. The flexible substrate is connected to the cover glass via a bonding layer, and the touch-sensing electrode structure is formed on the flexible substrate. The cover glass, the bonding layer, the flexible substrate and the touch-sensing electrode structure are arranged in order, with the flexible substrate being located between the touch-sensing electrode structure and the bonding layer.
Abstract translation: 触摸面板包括盖玻璃，柔性基板和触摸感应电极结构。 柔性基板通过接合层与盖玻璃连接，并且在柔性基板上形成触摸感应电极结构。 盖板玻璃，接合层，柔性基板和触摸感应电极结构依次布置，柔性基板位于触摸感应电极结构和接合层之间。
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Patent Agency Ranking
公开(公告)号：US09380700B2
公开(公告)日：2016-06-28
申请号：US14281631
申请日：2014-05-19
Applicant: Konstantine Karavakis , Kenneth S. Bahl , Steve Carney
Inventor： Konstantine Karavakis , Kenneth S. Bahl , Steve Carney
IPC: H05K3/02 , H05K3/10 , H05K1/03 , H05K1/09 , H05K1/11 , H05K3/08 , H05K3/40 , H05K3/18 , H05K3/00
CPC classification number: H05K1/0306 , H05K1/09 , H05K1/115 , H05K3/0041 , H05K3/08 , H05K3/107 , H05K3/185 , H05K3/4038 , H05K2201/017 , H05K2201/0236 , H05K2201/0376 , H05K2203/025 , H05K2203/0716 , H05K2203/107
Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.
Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。
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117.发明授权公开(公告)号：US09358804B2
公开(公告)日：2016-06-07
申请号：US14610330
申请日：2015-01-30
Applicant: ROHM CO., LTD.
Inventor： Shinobu Obata , Koji Nishi , Takafumi Katsuno , Masumi Okumura , Nobuhito Kinoshita
CPC classification number: B41J2/3352 , B41J2/04541 , B41J2/3351 , B41J2/33515 , B41J2/3353 , B41J2/3354 , B41J2/33545 , B41J2/3355 , B41J2/3357 , B41J2/3359 , H05K1/0306 , H05K1/09 , H05K1/092 , H05K3/06 , H05K3/12 , H05K3/40 , H05K2201/017 , H05K2201/0338 , H05K2201/035
Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
Abstract translation: 根据本公开，公开了精细布线图案的制造方法。 该制造方法包括制备支撑构件，通过厚膜印刷在支撑构件上形成第一层，并通过厚膜印刷在第一层上形成包括Ag的第二层。 该方法还包括通过对第一层和第二层执行蚀刻处理来形成预定的精细布线图案。
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公开(公告)号：US20150129293A1
公开(公告)日：2015-05-14
申请号：US14537998
申请日：2014-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon CHO , Hyo Seung NAM , Yong Sam LEE , Seok Hwan AHN
CPC classification number: H05K1/0271 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15311 , H05K3/002 , H05K3/0029 , H05K3/0047 , H05K3/0052 , H05K3/007 , H05K3/429 , H05K3/4605 , H05K3/4644 , H05K2201/017 , H05K2201/0187 , H05K2201/0195 , H05K2201/0909 , H05K2201/09136 , H05K2201/09827 , H05K2201/09881 , H05K2201/2009 , H05K2203/1536 , H01L2224/81 , H01L2924/00
Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.
Abstract translation: 印刷电路板及其制造方法。 在一个实施例中，印刷电路板包括：由玻璃材料制成的芯; 围绕芯的绝缘体; 以及通过芯和绝缘体连接内部电路层的通孔。
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公开(公告)号：US20150107889A1
公开(公告)日：2015-04-23
申请号：US14582549
申请日：2014-12-24
Applicant: INNOLUX CORPORATION
Inventor： KAI MENG , LIEN-HSIN LEE
CPC classification number: H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
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120.发明授权Fine wiring pattern and composition, manufacturing method thereof, and thermal print head including fine wiring pattern 有权精细的布线图案及其组成，制造方法和包括精细布线图案的热打印头公开(公告)号：US08982169B2
公开(公告)日：2015-03-17
申请号：US13747703
申请日：2013-01-23
Applicant: Rohm Co., Ltd.
Inventor： Shinobu Obata , Koji Nishi , Takafumi Katsuno , Masumi Okumura , Nobuhito Kinoshita
CPC classification number: B41J2/3352 , B41J2/04541 , B41J2/3351 , B41J2/33515 , B41J2/3353 , B41J2/3354 , B41J2/33545 , B41J2/3355 , B41J2/3357 , B41J2/3359 , H05K1/0306 , H05K1/09 , H05K1/092 , H05K3/06 , H05K3/12 , H05K3/40 , H05K2201/017 , H05K2201/0338 , H05K2201/035
Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
Abstract translation: 根据本公开，公开了精细布线图案的制造方法。 该制造方法包括制备支撑构件，通过厚膜印刷在支撑构件上形成第一层，并通过厚膜印刷在第一层上形成包括Ag的第二层。 该方法还包括通过对第一层和第二层执行蚀刻处理来形成预定的精细布线图案。
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