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    Multilayer wiring base plate and probe card using the same
    113.
    发明授权
    Multilayer wiring base plate and probe card using the same 有权
    多层接线底板和探针卡使用相同

    公开(公告)号：US09271393B2

    公开(公告)日：2016-02-23

    申请号：US13943618

    申请日：2013-07-16

    Applicant: Kabushiki Kaisha Nihon Micronics

    Inventor： Noboru Otabe ,  Toshinori Omori ,  Takayasu Sugai

    IPC: G01R31/00 ,  H05K1/02 ,  H05K1/16

    CPC classification number: H05K1/0271 ,  H05K1/167 ,  H05K2201/0317 ,  H05K2201/068 ,  H05K2201/09781

    Abstract: A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.

    Abstract translation: 多层布线基板包括绝缘板，绝缘板包括由绝缘材料制成的多个合成树脂层，设置在绝缘板中的布线电路，沿着至少一个合成树脂层形成的薄膜电阻器，以被埋入 所述合成树脂层插入到所述布线电路中，以及形成为埋设在所述合成树脂层附近的所述合成树脂层中的形成所述薄膜电阻器以埋设的所述合成树脂层的热膨胀和收缩限制层， 薄膜电阻器，并且具有比相邻合成树脂层的线膨胀系数小的线性膨胀系数。

    Thin film electrode ceramic substrate and method for manufacturing the same
    114.
    发明授权
    Thin film electrode ceramic substrate and method for manufacturing the same 有权
    薄膜电极陶瓷基板及其制造方法

    公开(公告)号：US09101064B2

    公开(公告)日：2015-08-04

    申请号：US13548575

    申请日：2012-07-13

    Applicant: Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

    Inventor： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

    IPC: H05K1/03 ,  H05K1/09 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10

    CPC classification number: H05K3/06 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/02 ,  H05K3/107 ,  H05K2201/0317 ,  H05K2203/025

    Abstract: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.

    Abstract translation: 本文公开了一种薄膜电极陶瓷基板及其制造方法。 薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板的表面上的一个或多个抗蚀刻金属层; 在抗蚀刻金属层上形成的薄膜电极图案; 以及形成在薄膜电极图案上的镀层，其中薄膜电极图案的各个边缘部分与抗蚀刻金属层接触，因此在陶瓷基板的表面和薄膜之间发生切削缺陷 可以防止由于蚀刻剂引起的薄膜电极图案之间的电极图案和薄膜电极图案之间的粘合强度，从而确保薄膜电极图案的耐久性和可靠性。

    Wiring substrate and method of manufacturing the same
    117.
    发明授权
    Wiring substrate and method of manufacturing the same 有权
    接线基板及其制造方法

    公开(公告)号：US08933342B2

    公开(公告)日：2015-01-13

    申请号：US13624310

    申请日：2012-09-21

    Applicant: NGK Spark Plug Co., Ltd.

    Inventor： Kenji Suzuki ,  Masanori Kito ,  Yuma Otsuka ,  Hisayoshi Kamiya ,  Tsuyoshi Tanabashi

    IPC: H05K1/16 ,  H05K1/02 ,  H05K3/24 ,  H05K1/03

    CPC classification number: H05K1/0246 ,  H05K1/0251 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/242 ,  H05K2201/0317

    Abstract: A wiring substrate includes a substrate main body having a first main face and a second main face opposite the first main face; a resistor formed on the first main face; a plurality of first-main-face-side wiring layers which are each formed on the resistor and which each include a grounding metal layer formed of a metal having a resistance lower than that of the resistor and a conductor layer formed on the grounding metal layer; a second-main-face-side wiring layer formed on the second main face; and a via which is formed in the substrate main body and which establishes electrical connectivity between the first-main-face-side wiring layers and the second-main-face-side wiring layer. The wiring substrate further includes a conductive covering layer which covers an upper surface and substantially covers the side surfaces of each of the first-main-face-side wiring layers.

    Abstract translation: 布线基板包括具有第一主面和与第一主面相对的第二主面的基板主体; 形成在所述第一主面上的电阻器; 多个第一主面侧布线层，分别形成在电阻器上，并且各自包括由电阻低于电阻器的电阻的金属形成的接地金属层和形成在接地金属层上的导体层 ; 形成在第二主面上的第二主面侧配线层; 以及形成在基板主体中并且建立第一主面侧布线层和第二主面侧布线层之间的电连通性的通孔。 布线基板还包括覆盖上表面并且基本上覆盖每个第一主面侧布线层的侧表面的导电覆盖层。

    WIRING BOARD
    118.
    发明申请
    WIRING BOARD 有权
    接线板

    公开(公告)号：US20150000965A1

    公开(公告)日：2015-01-01

    申请号：US14317657

    申请日：2014-06-27

    Applicant: KYOCERA SLC TECHNOLOGIES CORPORATION

    Inventor： Makoto SHIROSHITA

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/113 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/131 ,  H01L2224/81193 ,  H05K1/025 ,  H05K2201/0175 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/10674 ,  H01L2924/014

    Abstract: A wiring board 10a according to the present invention is provided with an insulating board 1 laminated at least one insulating layer 1b having a via hole 8 on at least one surface of a core layer 1a, a via conductor 2b formed inside the via hole 8 and containing a low resistance material, and a connection pad formed at the surface of the insulating layer 1b and including a thin film resistor layer 3a containing a high resistance material, wherein the thin film resistor layer 3a is adhered to the insulating layer 1b in such a manner as to cover the via conductor 2b and the insulating layer 1b surrounding the via conductor 2b.

    Abstract translation: 根据本发明的布线板10a设置有绝缘板1，其在芯层1a的至少一个表面上具有通孔8的至少一个绝缘层1b，形成在通孔8内的通孔导体2b和 含有低电阻材料的连接焊盘和形成在绝缘层1b的表面的连接焊盘，并且包括含有高电阻材料的薄膜电阻层3a，其中薄膜电阻层3a以这样的方式粘附到绝缘层1b上 以覆盖通孔导体2b和围绕通孔导体2b的绝缘层1b的方式。

    ELECTRONIC DEVICE
    119.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20140240936A1

    公开(公告)日：2014-08-28

    申请号：US14190640

    申请日：2014-02-26

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Tomoki KOBAYASHI

    IPC: H05K9/00

    CPC classification number: H05K9/0075 ,  H01L2224/48091 ,  H05K1/0233 ,  H05K1/0243 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/086 ,  H05K2201/10098 ,  H05K2203/095 ,  H05K2203/1476 ,  H01L2924/00014

    Abstract: There is provided an electronic device. The electronic device includes: a wiring board; a first electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a first frequency band; a second electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a second frequency band; a first magnetic thin film covering the wiring board, the first electronic component and the second electronic component, wherein the first magnetic thin film has a composition corresponding to the first frequency band; and a second magnetic thin film covering the first magnetic thin film, wherein the second magnetic thin film has a composition corresponding to the second frequency band.

    Abstract translation: 提供电子设备。 电子设备包括：接线板; 第一电子部件，安装在所述布线基板上，并配置为发射具有第一频带的电磁波; 安装在所述布线板上并被配置为发射具有第二频带的电磁波的第二电子部件; 覆盖所述布线板的第一磁性薄膜，所述第一电子部件和所述第二电子部件，其中所述第一磁性薄膜具有对应于所述第一频带的组成; 以及覆盖所述第一磁性薄膜的第二磁性薄膜，其中所述第二磁性薄膜具有对应于所述第二频带的组成。

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