公开(公告)号：US06975200B2

公开(公告)日：2005-12-13

申请号：US11034272

申请日：2005-01-12

Applicant: Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

Inventor： Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

IPC: H01L25/00 ,  H01F19/08 ,  H01F27/28 ,  H01F27/29 ,  H01L23/552 ,  H02M3/00 ,  H02M3/155 ,  H02M3/158 ,  H05K1/18 ,  H05K3/34 ,  H01F5/00

CPC classification number: H01L23/552 ,  H01F19/08 ,  H01F27/28 ,  H01F27/292 ,  H01L23/49811 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/00 ,  H02M3/158 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/0212 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10234 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A surface-mount microconverter is formed by mounting a microinductor chip and a semiconductor integrated circuit chip on a circuit board. Stud terminals are arranged on the circuit board and the microinductor chip is supported on the stud terminals, and the microinductor chip and the semiconductor integrated circuit chip are superposed on the circuit board. The microconverter has an improved ability and is small and thin. The microconverter includes an effective laminated magnetic-core inductor. The inductor comprises a helical coil formed by uniting alternately superposed insulating magnetic layers and conductive pattern layers, and an annular closed magnetic path formed by the insulating magnetic layers and defining a magnetic field created by the coil. The inductor can be miniaturized in a thin chip, and a wide range in which magnetic flux density varies linearly can be secured by balancing a closed magnetic path for a magnetic field created by the coil.

Abstract translation: 表面安装微型转换器通过将微型电感芯片和半导体集成电路芯片安装在电路板上而形成。 螺柱端子布置在电路板上，微电感芯片支撑在螺柱端子上，微电感芯片和半导体集成电路芯片叠加在电路板上。 微型转换器具有改进的能力，体积小而薄。 微型转换器包括有效的层叠磁芯电感器。 电感器包括通过将交替叠置的绝缘磁性层和导电图案层相互组合形成的螺旋线圈和由绝缘磁性层形成并限定由线圈产生的磁场的环形闭合磁路。 电感器可以在薄的芯片中小型化，并且可以通过平衡由线圈产生的磁场的闭合磁路来确保磁通密度线性变化的宽范围。

公开(公告)号：US06927346B2

公开(公告)日：2005-08-09

申请号：US10326901

申请日：2002-12-20

Applicant: Carolyn R. McCormick ,  Terrance J. Dishongh

Inventor： Carolyn R. McCormick ,  Terrance J. Dishongh

IPC: H05K3/34 ,  H05K1/16

CPC classification number: H05K3/3436 ,  H05K3/3463 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Apparatus and methods for interconnecting a SMT component interconnect to a via-in-pad (VIP) interconnect. A first reflowable material is deposited on the VIP bond pad. A sphere having a higher melt temperature than the reflow temperature of the first interconnect material is deposited on the first interconnect material. A first reflow process is performed to interconnect the sphere and the VIP bond pad while the sphere remains solid, and the first reflowable material preventing the first interconnect material from migrating into the via-in-pad.

Abstract translation: 用于将SMT组件互连件互连到通孔式（VIP）互连的装置和方法。 第一个可回流材料沉积在VIP接合垫上。 具有比第一互连材料的回流温度更高的熔融温度的球体沉积在第一互连材料上。 执行第一回流工艺以在球体保持固体的同时使球体和VIP接合焊盘互连，并且第一可回流材料防止第一互连材料迁移到通孔内焊盘。

公开(公告)号：US20050134420A1

公开(公告)日：2005-06-23

申请号：US11034272

申请日：2005-01-12

Applicant: Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

Inventor： Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

IPC: H01L25/00 ,  H01F19/08 ,  H01F27/28 ,  H01F27/29 ,  H01L23/552 ,  H02M3/00 ,  H02M3/155 ,  H02M3/158 ,  H05K1/18 ,  H05K3/34 ,  H01F27/24

CPC classification number: H01L23/552 ,  H01F19/08 ,  H01F27/28 ,  H01F27/292 ,  H01L23/49811 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/00 ,  H02M3/158 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/0212 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10234 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A surface-mount microconverter is formed by mounting a microinductor chip and a semiconductor integrated circuit chip on a circuit board. Stud terminals are arranged on the circuit board and the microinductor chip is supported on the stud terminals, and the microinductor chip and the semiconductor integrated circuit chip are superposed on the circuit board. The microconverter has an improved ability and is small and thin. The microconverter includes an effective laminated magnetic-core inductor. The inductor comprises a helical coil formed by uniting alternately superposed insulating magnetic layers and conductive pattern layers, and an annular closed magnetic path formed by the insulating magnetic layers and defining a magnetic field created by the coil. The inductor can be miniaturized in a thin chip, and a wide range in which magnetic flux density varies linearly can be secured by balancing a closed magnetic path for a magnetic field created by the coil.

公开(公告)号：US06885278B2

公开(公告)日：2005-04-26

申请号：US10624379

申请日：2003-07-22

Applicant: Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

Inventor： Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

IPC: H01L25/00 ,  H01F19/08 ,  H01F27/28 ,  H01F27/29 ,  H01L23/552 ,  H02M3/00 ,  H02M3/155 ,  H02M3/158 ,  H05K1/18 ,  H05K3/34 ,  H01F5/00

CPC classification number: H01L23/552 ,  H01F19/08 ,  H01F27/28 ,  H01F27/292 ,  H01L23/49811 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/00 ,  H02M3/158 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/0212 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10234 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A surface-mount microconverter is formed by mounting a microinductor chip and a semiconductor integrated circuit chip on a circuit board. Stud terminals are arranged on the circuit board and the microinductor chip is supported on the stud terminals, and the microinductor chip and the semiconductor integrated circuit chip are superposed on the circuit board. The microconverter has an improved ability and is small and thin. The microconverter includes an effective laminated magnetic-core inductor. The inductor comprises a helical coil formed by uniting alternately superposed insulating magnetic layers and conductive pattern layers, and an annular closed magnetic path formed by the insulating magnetic layers and defining a magnetic field created by the coil. The inductor can be miniaturized in a thin chip, and a wide range in which magnetic flux density varies linearly can be secured by balancing a closed magnetic path for a magnetic field created by the coil.

公开(公告)号：US06849953B2

公开(公告)日：2005-02-01

申请号：US09942363

申请日：2001-08-29

Applicant: John W. Smith

Inventor： John W. Smith

IPC: H01L21/56 ,  H01L23/498 ,  H05K1/14 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/73203 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: A microelectronic assembly includes composite conductive elements, each incorporating a core and a coating of a low-melting conductive material. The composite conductive elements interconnect microelectronic elements. At the normal operating temperature of the assembly, the low-melting conductive material melts, allowing the cores and microelectronic elements to move relative to one another and relieve thermally-induced stress.

Abstract translation: 微电子组件包括复合导电元件，每个都包含芯和低熔点导电材料的涂层。 复合导电元件互连微电子元件。 在组件的正常工作温度下，低熔点导电材料熔化，允许芯和微电子元件相对于彼此移动并减轻热致应力。

公开(公告)号：US06823582B1

公开(公告)日：2004-11-30

申请号：US10211440

申请日：2002-08-02

Applicant: Shahram Mostafazadeh ,  Joseph O. Smith

Inventor： Shahram Mostafazadeh ,  Joseph O. Smith

IPC: B23P1900

CPC classification number: H05K3/325 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10121 ,  H05K2201/10234 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An apparatus and method for force mounting semiconductor packages onto printed circuit boards without the use of solder. The apparatus includes a substrate, a first integrated circuit die mounted onto the substrate, a housing configured to house the first integrated circuit die mounted onto the substrate, and a force mechanism configured to force mount the housing including the integrated circuit die and substrate onto a printed circuit board. The method includes mounting a first integrated circuit die onto a first surface of a substrate, housing the first integrated circuit die mounted onto the substrate in a housing, and using a force mechanism to force mount the housing including the first integrated circuit die mounted on the substrate onto a printed circuit board. According to various embodiments, the force mechanism includes one of the following types of force mechanisms clamps, screws, bolts, adhesives, epoxy, or Instrument housings or heat stakes.

Abstract translation: 一种在不使用焊料的情况下将半导体封装强制安装到印刷电路板上的装置和方法。 该装置包括基板，安装在基板上的第一集成电路芯片，被构造成容纳安装在基板上的第一集成电路芯片的壳体，以及强制机构，其被构造成将包括集成电路管芯和基板的壳体安装到 印刷电路板。 该方法包括将第一集成电路管芯安装到衬底的第一表面上，将安装在衬底上的第一集成电路管芯容纳在壳体中，并且使用力机构来强制安装壳体，该壳体包括安装在衬底上的第一集成电路管芯 衬底到印刷电路板上。 根据各种实施例，力机构包括以下类型的力机构夹具，螺钉，螺栓，粘合剂，环氧树脂或仪器壳体或热桩中的一种。

公开(公告)号：US06781245B2

公开(公告)日：2004-08-24

申请号：US10291117

申请日：2002-11-08

Applicant: Chien-Ping Huang

Inventor： Chien-Ping Huang

IPC: H01L2348

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A solder ball array type package structure is able to control collapse. The package includes a substrate, a carrier, a plurality of dies, a molding compound and a plurality of solder balls. The substrate has at least one active surface. Pads are located on the first surface of the substrate. The carrier has at least an active surface and a back surface opposite the active surface. A plurality of dies are located on the back surface and the active surface of the carrier. The dies arranged on the active surface are electrically connected to the carrier by flip chip technology. A molding compound encapsulates on the back surface of the carrier to cover the dies on the back surface of the carrier. Solder balls having a base material are provided on the active surface of the carrier in array. At least three solder balls coated with the base material having a high melting-temperature core are further provided in the periphery of the array. The carrier is arranged such that the active surface faces the first surface of the substrate to allow each solder ball correspond to the one of the pads, respectively.

Abstract translation: 焊球阵列式封装结构能够控制崩溃。 该封装包括基板，载体，多个模具，模塑料和多个焊球。 衬底具有至少一个活性表面。 垫片位于基板的第一表面上。 载体至少具有与活性表面相对的活性表面和后表面。 多个模具位于载体的背面和活性表面上。 布置在有源表面上的管芯通过倒装芯片技术与载体电连接。 模塑料封装在载体的背面，以覆盖载体背面上的模具。 具有基材的焊球被设置在载体的有源表面上。 在阵列的周围还设有至​​少三个涂覆有具有高熔点芯的基材的焊球。 载体布置成使得活性表面面向基板的第一表面，以允许每个焊球分别对应于焊盘之一。

公开(公告)号：US20040113708A1

公开(公告)日：2004-06-17

申请号：US10475072

申请日：2003-10-17

Inventor： Hitoshi Takanashi ,  Tsuneo Uchiyama ,  Youji Nagano ,  Kyo Horie ,  Noriyuki Watanabe ,  Kazuhiro Shii

IPC: H03B005/32

CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K3/3442 ,  H05K5/0091 ,  H05K2201/10083 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A piezoelectric oscillator comprising a piezoelectric vibrator with a piezoelectric vibrating element housed in a package and bottom terminals formed on the outer side of the bottom of the package, a circuit board with at least one electronic circuit component mounted and conductor patterns formed on the top side, and columnlike supports which mechanically and electrically connects the bottom terminals of the piezoelectric vibrator and the conductor patterns on the circuit board. The piezoelectric oscillator has a smaller board occupation area, and can be manufactured by quantity production using a batch process at a high productivity and a reduced cost.

Abstract translation: 一种压电振荡器，包括压电振动器，其具有容纳在封装中的压电振动元件和形成在所述封装的底部的外侧上的底端子;电路板，具有安装的至少一个电子电路部件和形成在所述顶侧上的导体图案 和柱状支撑体，其将压电振动器的底端和电路板上的导体图案机械地和电连接。 压电振荡器具有较小的板占用面积，并且可以通过以高生产率和降低成本的批量处理的数量生产来制造。

公开(公告)号：US20040084210A1

公开(公告)日：2004-05-06

申请号：US10625216

申请日：2003-07-22

Inventor： Terrance J. Dishongh ,  Carolyn R. McCormick

IPC: H05K001/11

CPC classification number: H05K1/113 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2201/0959 ,  H05K2201/10234 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A first signal routing layer may be formed on a first surface of a printed circuit board (PCB). An array of interconnections may formed on the first surface of the PCB, the array of interconnections comprising at least one padless via formed within the PCB, the at least one padless via extending from the first signal routing layer to at least one conductive plane and/or a second signal routing layer. The at least one padless via may be in electrical contact with the at least one conductive plane and/or a conductive trace on the second signal routing layer. A component may be attached to the PCB, with a solder interconnection between the at least one padless via and a contact pad on a bottom surface of the component. The component may be, for example, an electronic component such as a ball grid array (BGA) component or a leadless surface mount component.

Abstract translation: 第一信号布线层可以形成在印刷电路板（PCB）的第一表面上。 互连阵列可以形成在PCB的第一表面上，互连阵列包括形成在PCB内的至少一个无衬垫通孔，从第一信号布线层延伸到至少一个导电平面的至少一个无衬垫通孔和/ 或第二信号路由层。 所述至少一个无衬垫通孔可以与所述至少一个导电平面和/或所述第二信号布线层上的导电迹线电接触。 组件可以附接到PCB，其中焊料互连在该至少一个无衬垫通孔和该部件的底部表面上的接触焊盘之间。 组件可以是例如电子部件，例如球栅阵列（BGA）部件或无引线表面安装部件。

公开(公告)号：US06724095B2

公开(公告)日：2004-04-20

申请号：US09915076

申请日：2001-07-25

Applicant: Gerald J. D'Amato ,  Sari K. Christensen ,  Nicole Butel

Inventor： Gerald J. D'Amato ,  Sari K. Christensen ,  Nicole Butel

IPC: H01L23544

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L24/02 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/303 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10234 ,  H05K2201/10325 ,  H05K2203/048 ,  H05K2203/167 ,  Y02P70/613

Abstract: An integrated circuit package is provided with alignment pads which are solid or annular ring shaped. Alignment members such as balls or bullets are attached to the alignment pads via a wetting media. When heated, the wetting media serves to center and seat the alignment members on the alignment pads. When cooled, the wetting media serves to bond the alignment members to the alignment pads.

Abstract translation: 集成电路封装设置有固定或环形环形的对准焊盘。 诸如球或子弹的对准构件通过润湿介质附接到对准垫。 当加热时，润湿介质用于将对准构件对准并对准对准衬垫。 当冷却时，润湿介质用于将对准构件结合到对准衬垫。