公开(公告)号：US5797765A

公开(公告)日：1998-08-25

申请号：US743444

申请日：1996-11-01

Applicant: Ron Barnett ,  Thomas W. Finkle ,  Michael T. Powers

Inventor： Ron Barnett ,  Thomas W. Finkle ,  Michael T. Powers

IPC: H01R12/53 ,  H01R24/50 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01R24/50 ,  H01R12/53 ,  H05K1/0219 ,  H01R2103/00 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2203/049 ,  H05K3/3447 ,  H05K3/4046

Abstract: A coaxial connector mounts directly to a planar substrate of a circuit module and is oriented perpendicularly to the substrate. A radially symmetric coaxial structure, maintained through a conductive bore in the substrate provides a good impedance match to a planar transmission line on the substrate. A flange of the coaxial connector provides the mating surface to the substrate. A nipple formed on the flange fits in the conductive bore, aligning the center conductor in the conductive bore and maintaining the coaxial structure. A bond connects the center conductor to a microstrip transmission line on the top of the substrate. In a first preferred embodiment of the present invention, a threaded flange receives a threaded coaxial bead to form the coaxial connector. In a second preferred embodiment a coaxial cable is soldered into a smooth flange to form a coaxial connector. In a third preferred embodiment a coaxial bead and a flange are integrated to form the coaxial connector. The outer conductor of the bead is continuous with the flange while the center conductor of the bead protrudes through a hole in the flange.

Abstract translation: 同轴连接器直接安装到电路模块的平面基板上并且垂直于基板定向。 通过衬底中的导电孔保持的径向对称的同轴结构提供与衬底上的平面传输线的良好的阻抗匹配。 同轴连接器的凸缘提供与基板的配合表面。 在凸缘上形成的接头装配在导电孔中，使导电孔中的中心导体对齐并保持同轴结构。 键将中心导体连接到衬底顶部的微带传输线。 在本发明的第一优选实施例中，螺纹法兰接收螺纹同轴珠以形成同轴连接器。 在第二优选实施例中，同轴电缆被焊接到光滑凸缘中以形成同轴连接器。 在第三优选实施例中，同轴的凸缘和凸缘被一体化以形成同轴连接器。 胎圈的外导体与凸缘连续，而胎圈的中心导体通过凸缘中的孔突出。

公开(公告)号：US5598627A

公开(公告)日：1997-02-04

申请号：US471168

申请日：1995-06-06

Applicant: Kazuhito Saka ,  Masayoshi Hashimoto ,  Kou Furuta ,  Takahiro Okamura

Inventor： Kazuhito Saka ,  Masayoshi Hashimoto ,  Kou Furuta ,  Takahiro Okamura

IPC: H01R12/62 ,  H05K1/11 ,  H05K3/10 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40 ,  H05K7/00 ,  H01R43/04

CPC classification number: H01R12/62 ,  H05K1/118 ,  H05K3/363 ,  H05K7/005 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/052 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10977 ,  H05K3/103 ,  H05K3/281 ,  H05K3/4092 ,  Y10T29/49117 ,  Y10T29/49181

Abstract: A wire harness includes a main circuit part 1 including an insulated conductor wiring circuit plate 3 in which conductors 8 are arranged on a base insulation film 9 to form a wiring circuit by turning, bowing, crossing, or branching the conductors and covered with a flexible insulation film 12. Further, a branched connection part 2 is provided including a printed circuit plate 4 connected to a connecting area 14A in the main circuit part 1 through a connecting area 14B formed thereon and adapted to receive leading electrical wires 5. The conductor wiring circuit plate 30 is a flexible circuit plate which has an insulation base film 33, conductors 31 juxtaposed on the base film, an upper coverlet film 32, and a connecting area 36 for the conductors 31 having an adhesive layer 37 on the back side of the film 32. The connecting area 36 is formed by removing a predetermined width 38 of the base film 33 along the lateral direction of the coverlet film 32.

Abstract translation: 线束包括主电路部分1，其包括绝缘导体布线电路板3，其中导体8布置在基底绝缘膜9上，以通过转动，弯曲，交叉或分支导体形成布线电路并且被覆盖有柔性 此外，分支连接部件2设置有印刷电路板4，印刷电路板4通过形成在其上的连接区域14B连接到主电路部分1中的连接区域14A，并且适于接收引导电线5.导体布线 电路板30是柔性电路板，其具有绝缘基膜33，并置在基膜上的导体31，上覆盖膜32和用于导体31的连接区域36，导体31在背面侧具有粘合层37 通过沿着覆盖膜32的横向除去基膜33的预定宽度38形成连接区域36。

公开(公告)号：US5580271A

公开(公告)日：1996-12-03

申请号：US303253

申请日：1994-09-08

Applicant: Raymond R. Buchheister, Jr. ,  Robert Scata ,  Robert J. Hnatuck

Inventor： Raymond R. Buchheister, Jr. ,  Robert Scata ,  Robert J. Hnatuck

IPC: B23K1/00 ,  H01R4/02 ,  H01R13/66 ,  H01R43/02 ,  H05K1/02 ,  H05K3/34 ,  H01R9/07

CPC classification number: H01R13/6658 ,  B23K1/0016 ,  H01R4/025 ,  H01R43/0242 ,  H05K1/0212 ,  B23K2201/38 ,  H01R43/0207 ,  H05K1/0242 ,  H05K2201/083 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10924 ,  H05K2203/1115 ,  H05K3/3421 ,  H05K3/3494 ,  Y10T29/49149 ,  Y10T29/49179

Abstract: An SCSI cable assembly (30) with a termination circuit included within one of the connector housings (44) is disclosed. The termination circuit is on a circuit board (52) that is retained within a cavity (68) between two solder nest halves (50). The solder nest halves (50) have a plurality of openings (70) that are in alignment with contact pads (54) on a surface of the circuit board (52). Solder segments (100) are arranged within the openings (70), and conductors (48) of a cable (32) are individually inserted into the openings in thermal engagement with the solder segments to form a solder nest assembly (40). An electrical connector (42) having a plurality of contact leads (58) spaced similarly to the spacing of the openings (70) is assembled to the solder nest assembly so that each lead (58) is in thermal engagement with a respective conductor (48) in a respective opening (70). Each lead (58) is attached to a common carrier strip (104) which is a self regulating temperature heater. The heater is activated by application of an RF current to reflow the solder segment (100) thereby electrically connecting the leads (58) to their respective conductors (48) and contact pads (54).

Abstract translation: 公开了一种具有包括在连接器壳体（44）之一内的终端电路的SCSI电缆组件（30）。 终端电路在电路板（52）上，该电路板（52）保持在两个焊料半盒（50）之间的空腔（68）内。 焊料半部（50）具有与电路板（52）的表面上的接触焊盘（54）对准的多个开口（70）。 焊接段（100）布置在开口（70）内，并且电缆（32）的导体（48）被单独地插入到与焊料段热接合的开口中以形成焊料嵌套组件（40）。 具有与开口（70）的间隔相似的多个接触引线（58）的电连接器（42）被组装到焊料嵌套组件，使得每个引线（58）与相应的导体（48）热接合 ）在相应的开口（70）中。 每个引线（58）连接到作为自调节温度加热器的公共载体条（104）。 通过施加RF电流来激活加热器以回流焊料段（100），从而将引线（58）电连接到它们各自的导体（48）和接触焊盘（54）。

公开(公告)号：US5357074A

公开(公告)日：1994-10-18

申请号：US108158

申请日：1993-08-17

Applicant: Joseph M. Pawlikowski

Inventor： Joseph M. Pawlikowski

IPC: B23K3/047 ,  H01R4/02 ,  H01R43/02 ,  H05K1/02 ,  H05K3/34 ,  B23K1/00

CPC classification number: H01R43/0242 ,  B23K3/0473 ,  H01R12/53 ,  H05K1/0212 ,  B23K2201/32 ,  H05K1/0242 ,  H05K2201/083 ,  H05K2201/10356 ,  H05K2201/10924 ,  H05K2203/1115 ,  H05K3/3421 ,  H05K3/3494

Abstract: A device 10 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency for providing sufficient thermal energy to melt a fusible electrically conductive material 32 includes an integral member formed from strip 12 of a first metal having a carrier strip section 14 and a plurality of fingers 20 initially integrally coextending therefrom. The carrier strip section 14 further has a thin magnetic layer 18 thereon, transforming the carrier strip into a Curie point heater. The fingers 20 including end portions 22 having layers of solder affixed to opposite sides thereof are adapted to receive bare end portions of conductors 36 inserted into slots 28 thereof. The device 10 and the conductors 36 disposed therein are placed on the board 50 with the respective conductors 36 opposed from respective contact pads 52 and separated by the finger end portions 22. Upon subjecting the heater body 14 to the constant current of known frequency, the heater body 14 generates and transfers sufficient thermal energy to the finger end portions 22 to melt the fusible material 32 disposed therealong thereby electrically and mechanically interconnecting the array of conductors to the contact pads 52. The heater body 14 is then detached from the fingers 20 thereby electrically isolating the interconnections.

Abstract translation: 可用于与已知频率的恒定幅度高频交流电源结合使用以提供足够的热能来熔化可熔导电材料32的装置10包括由具有载体带部分14的第一金属的带12形成的整体部件 以及最初与之共同延伸的多个指状物20。 载体条部分14还具有薄的磁性层18，将载体条变换成居里点加热器。 包括固定在其相对侧上的焊料层的端部22的指状物20适于容纳插入到其狭槽28中的导体36的裸端部分。 设备10和布置在其中的导体36放置在板50上，各个导体36与相应的接触垫52相对并且被指状端部22分离。当对加热器体14进行已知频率的恒定电流时， 加热器主体14产生并将足够的热能传递到手指端部22以熔化设置在其上的可熔材料32，从而将导体阵列电气地和机械地互连到接触垫52.然后加热器主体14从指状物20分离，从而 电隔离互连。

公开(公告)号：US5125856A

公开(公告)日：1992-06-30

申请号：US644703

申请日：1991-01-23

Applicant: Christian Schlegel

Inventor： Christian Schlegel

IPC: H01R13/631 ,  H01R12/71 ,  H01R13/62 ,  H01R13/64 ,  H01R13/642 ,  H05K1/18

CPC classification number: H01R13/642 ,  H01R12/718 ,  H05K1/18 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10522 ,  H05K2203/168

Abstract: A connecting system for making electrical connections between a multiple conductor cable and a printed circuit board. A plurality of connector pins is mounted in a regularly spaced array on the printed circuit board and projecting above a first surface of the board. No other elements are mounted on the printed circuit board which are dedicated solely to the connecting system. Instead, a plurality of electrical components which are mounted on the circuit board for performing circuit functions, are mechanically positioned to surround the pins to provide an internal periphery of predetermined size, shape, and keyed configuration. The keyed periphery closely matches the outer periphery of a connector body attached to the cable. Thus, the electrical components on the circuit board key the connector body to the circuit board such that misplugging is avoided. The elimination of a board mounted connector body, and the close proximity of the electronic components required to perform their keying function, substantially increases circuit board density.

Abstract translation: 用于在多导体电缆和印刷电路板之间进行电连接的连接系统。 多个连接器引脚以规则间隔的阵列安装在印刷电路板上并突出在板的第一表面上方。 没有其他元件安装在专用于连接系统的印刷电路板上。 相反，安装在用于执行电路功能的电路板上的多个电气部件被机械地定位成围绕销以提供预定尺寸，形状和键合配置的内部周边。 键合的周边与连接到电缆的连接器主体的外周紧密匹配。 因此，电路板上的电气部件将连接器主体键合到电路板，从而避免了错误插入。 消除板安装的连接器主体以及执行其键控功能所需的电子部件的紧密接近大大增加了电路板密度。

公开(公告)号：US4999740A

公开(公告)日：1991-03-12

申请号：US319439

申请日：1989-03-06

Applicant: Joseph M. Ilardi ,  Bernard P. Gollomp

Inventor： Joseph M. Ilardi ,  Bernard P. Gollomp

IPC: H01L23/14 ,  H01L23/538 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/021 ,  H01L23/142 ,  H01L23/5384 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/14 ,  H05K1/0219 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10689 ,  H05K2203/049 ,  H05K3/0023

Abstract: A high circuit density printed circuit board is manufactured on a metal substrate by building a layer of photoimageable dielectric on the metal substrate and then imaging the dielectric in a manner so as to create wells for active components which are mounted directly on the metal substrate for the purpose of heat dissipation. The build up of the dielectric layer can be improved to provide circuit traces such as, for example, buried coaxial cables prior to the imaging process to achieve even higher density with conventional circuit boards.

Abstract translation: 在金属基板上制造高电路密度印刷电路板，通过在金属基板上建立可光成像电介质层，然后以这样的方式对电介质进行成像，以形成用于直接安装在金属基板上的有源部件的孔，用于 散热目的 可以改善电介质层的积聚，以在成像过程之前提供诸如掩埋同轴电缆之类的电路迹线，以利用常规电路板实现甚至更高的密度。

公开(公告)号：US4918277A

公开(公告)日：1990-04-17

申请号：US215628

申请日：1988-07-06

Applicant: Gero Zimmer

Inventor： Gero Zimmer

IPC: B23K3/047 ,  B23K20/02 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01R43/02 ,  B23K20/025 ,  B23K3/0471 ,  H05K3/3405 ,  H01R12/62 ,  H05K2201/10356 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K3/3494

Abstract: A heated tool for soldering objects to a plurality of pads which are spaced apart by a selected pitch, comprises a tool member having a heating surface with a plurality of spacer bars thereon, spaced by the pitch between the pads. The spacer bars act to separate one pad from the other to avoid the flow of solder between the pads.

Abstract translation: 用于将物体焊接到以选定间距间隔开的多个焊盘的加热工具包括具有加热表面的工具构件，其上具有多个间隔杆，间隔开焊盘之间的间距。 间隔杆用于将一个焊盘与另一个焊盘分离，以避免焊盘之间的焊料流动。

公开(公告)号：US4718863A

公开(公告)日：1988-01-12

申请号：US859105

申请日：1986-05-02

Applicant: Amir-Akbar Sadigh-Behzadi

Inventor： Amir-Akbar Sadigh-Behzadi

IPC: H01R11/01 ,  H01R12/62 ,  H05K1/11 ,  H05K3/34 ,  H01R9/07

CPC classification number: H01R12/62 ,  H05K3/3405 ,  H01R12/721 ,  H05K1/118 ,  H05K2201/10356 ,  H05K2201/10386

Abstract: A flat multiconductor jumper cable comprises a plurality of elongate substantially parallel and transversely spaced conductors surrounded by a casing of insulation. At one or both ends of the jumper cable, exposed portions of the conductors are formed in a curved clipped portion for solder connection to an integrated circuit substrate. The conductors are preferably formed of a soft non-resilient material such as copper and the clip portion is provided to have a substantially circular cross-section. The clip portion, formed in a generally U-shaped configuration defines a pocket for receipt therein of the edge of a substrate having conductive pads on opposing surfaces. Upon soldering the clip portion to the conductive pads, solder fillets are formed in such a manner as to provide an enhanced electrical and mechanical joint.

Abstract translation: 扁平多导体跳线电缆包括多个细长的基本上平行且横向间隔开的导体，其被绝缘套管包围。 在跳线电缆的一端或两端，导体的暴露部分形成为弯曲限制部分，用于与集成电路基板焊接。 导体优选地由诸如铜的柔软非弹性材料形成，并且夹持部分设置成具有基本上圆形的横截面。 形成为大致U形构造的夹持部分限定了用于在其中接纳具有相对表面上的导电焊盘的衬底的边缘的凹穴。 在将夹子部分焊接到导电焊盘上时，焊接圆角以提供增强的电气和机械接头的方式形成。

公开(公告)号：US4357750A

公开(公告)日：1982-11-09

申请号：US786887

申请日：1977-04-12

Applicant: Barry I. Ostman

Inventor： Barry I. Ostman

IPC: H01B7/08 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R9/07

CPC classification number: H05K3/4092 ,  H01B7/08 ,  H01B7/0838 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/09736 ,  H05K2201/10356 ,  H05K3/281 ,  H05K3/3447 ,  H05K3/36 ,  Y10T29/49156

Abstract: An electrical jumper cable comprising a plurality of spaced metallic conductors is formed from a rigid metallic sheet by selectively reducing the sheet in cross-section so as to define conductor patterns and integral terminal ends, and to render flexible areas of the conductors. The metallic conductors are laminated to flexible insulating films which support the conductors and maintain the conductors in spaced relation to one another.

Abstract translation: 包括多个间隔开的金属导体的电跨接电缆由刚性金属片形成，通过选择性地减小片材的横截面，以便限定导体图案和整体的终端，并且形成导体的柔性区域。 金属导体层压到柔性绝缘膜上，柔性绝缘膜支撑导体并将导体保持彼此间隔开。

公开(公告)号：US4084869A

公开(公告)日：1978-04-18

申请号：US740390

申请日：1976-11-10

Applicant: Yao T. Yen

Inventor： Yao T. Yen

IPC: H01C1/16 ,  H01R33/74 ,  H05K1/18 ,  H05K1/12

CPC classification number: H05K1/18 ,  H01R12/716 ,  H01R12/75 ,  H05K2201/10325 ,  H05K2201/10356 ,  H05K2201/10689 ,  Y10S439/912

Abstract: An interconnector for providing coupling between an integrated circuit pin connector, a socket connector which may be part of a printed circuit board, and a cable. Some pins of the pin connector connect directly with sockets of the socket connector, other pins and sockets are coupled to the cable. When used in an in-circuit emulator for a microcomputer, the interconnector permits the CPU or microprocessor to be physically located on the microcomputer's circuit board during testing of the microcomputer. Some of the signals which normally flow between the CPU or microprocessor and the remainder of the microcomputer are diverted to the cable. This permits sensing of signals intended for the CPU or microprocessor and the substitution of other signals in place of the sensed signals.

Abstract translation: 一种用于在集成电路引脚连接器，可以是印刷电路板的一部分的插座连接器和电缆之间提供耦合的互连器。 引脚连接器的一些引脚直接与插座连接器的插座相连，其他引脚和插座连接到电缆。 当用于微型计算机的在线仿真器时，互连器允许CPU或微处理器在微型计算机测试期间物理地位于微型计算机的电路板上。 通常在CPU或微处理器之间流动的一些信号和微计算机的其余部分的信号被转移到电缆。 这允许感测用于CPU或微处理器的信号以及代替其它信号来代替感测到的信号。