公开(公告)号：US20100188828A1

公开(公告)日：2010-07-29

申请号：US12751595

申请日：2010-03-31

Applicant: Kazuaki TAKAO

Inventor： Kazuaki TAKAO

IPC: H05K5/00 ,  H05K7/00

CPC classification number: G06F1/1613 ,  G06F1/185 ,  H01R12/7017 ,  H01R12/714 ,  H01R12/721 ,  H01R12/88 ,  H05K1/141 ,  H05K3/301 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A printed circuit board unit includes a printed wiring board. A socket is mounted on the surface of the printed wiring board. A fixation member is mounted on the surface of the printed wiring board at a position spaced from the socket. A screw bore is defined in the fixation member for receiving insertion of a screw. An engagement member is configured to move in the horizontal direction along the surface of the printed wiring board between a reference position and a withdrawing position. The engagement member is set at the reference position so that a predetermined space is defined between the engagement member and the fixation member. The engagement member withdraws from the reference position to the withdrawing position so as to get out of the predetermined space. An elastic member is configured to exhibit an elastic force urging the engagement member toward the reference position.

Abstract translation: 印刷电路板单元包括印刷线路板。 插座安装在印刷电路板的表面上。 固定构件在与插座间隔开的位置处安装在印刷线路板的表面上。 螺钉孔限定在固定构件中用于接收螺钉的插入。 接合构件被构造成沿着印刷线路板的表面在参考位置和退出位置之间沿水平方向移动。 接合构件设置在参考位置，使得在接合构件和固定构件之间限定预定的空间。 接合构件从参考位置退出到退出位置，以便脱离预定空间。 弹性构件被构造成表现出朝向基准位置推动接合构件的弹性力。

公开(公告)号：US20100175811A1

公开(公告)日：2010-07-15

申请号：US12727576

申请日：2010-03-19

Applicant: Toshio KUMAI

Inventor： Toshio KUMAI

IPC: B32B7/12

CPC classification number: B29C66/474 ,  B29C65/44 ,  B29C65/483 ,  B29C65/4835 ,  B29C65/8207 ,  B29C65/8215 ,  B29C66/71 ,  B29C66/73151 ,  B29C66/742 ,  B29C66/8322 ,  B29C66/91411 ,  B29C66/91413 ,  B29C66/91431 ,  B29C66/919 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2077/00 ,  B29K2101/12 ,  B29K2305/00 ,  B29K2995/007 ,  B29L2031/3425 ,  B29L2031/737 ,  C23C18/1605 ,  C25D5/022 ,  F16B37/122 ,  H05K3/4046 ,  H05K3/426 ,  H05K2201/10401 ,  H05K2201/10409 ,  B29K2083/00 ,  B29K2027/12

Abstract: A board comprising a frame comprised of a thermoplastic resin in which an insert part is embedded and metallized over the entire surface by a metal film. In particular, a method of embedding an insert part, while preventing the metal film from being depositing on the female screw in the insert part, a first aspect of which, at first, forming a metal film on the entire surface of the frame including a through hole in the frame, then press fitting the insert part into the through hole. In the second aspect, before the frame in, which the insert part is held, is formed with the metal film, a masking member that covers the entire surface of the female screw of the insert part is attached.

Abstract translation: 一种板，包括由热塑性树脂构成的框架，其中插入部分被嵌入并通过金属膜在整个表面上金属化。 特别是一种埋入插入部件的方法，同时防止金属膜沉积在插入部件中的内螺纹上，其第一方面首先在框架的整个表面上形成金属膜，该金属膜包括： 通过框架中的通孔，然后将插入部分压入通孔。 在第二方面中，在插入部分被保持的框架之前由金属膜形成的情况下，安装了覆盖插入部分的内螺纹的整个表面的掩蔽构件。

公开(公告)号：US20100165579A1

公开(公告)日：2010-07-01

申请号：US12464560

申请日：2009-05-12

Applicant: QIN LI ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： QIN LI ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K7/20

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/0064 ,  H05K7/205 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009

Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.

Abstract translation: 电路板组件包括其上安装有两个散热组件的电路板和附接到电路板的下侧的L形背板。 每个散热组件在其相对的角部处包括至少一对固定构件。 背板包括第一部分和第二部分，每个部分限定与散热组件的固定部件相对应的至少一对圆形突起。

公开(公告)号：US20100149732A1

公开(公告)日：2010-06-17

申请号：US12316315

申请日：2008-12-12

Applicant: Thampy Kurian

Inventor： Thampy Kurian

IPC: H05K7/00 ,  H01R43/00

CPC classification number: H01P1/387 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/142 ,  H05K3/3421 ,  H05K2201/10409 ,  H05K2201/10969 ,  Y10T29/49002

Abstract: A structure of a high frequency non-reciprocal passive device, such as circulator/isolator and method of installation. The structure includes a substantially rigid lip with cutouts for hot leads to go through. The walls of the cutout are situated in close proximity and symmetrically to the leads. The structure also having mounting holes. The installation process includes a step of putting the structure into a pocket in a carrier wherein a defined amount of a low heat transfer/electrical resistance substance, for example a grease, is located. The size of the lip is larger than the size of the pocket. Therefore the structure is supported on the rim of the pocket, while its portion which is under the lip and having smaller size is located in the pocket. Mounting screws can provide a predetermined pressure to the carrier by the device housing. By this, the lip is provided a reliable grounding in close proximity to the hot leads of the device, while the gap between the bottom of the pocket and the housing of the device is also defined and kept.

Abstract translation: 高频不可逆无源器件的结构，例如循环器/隔离器和安装方法。 该结构包括具有用于热导线穿过的切口的基本上刚性的唇部。 切口的墙壁靠近并与导线对称。 该结构还具有安装孔。 安装过程包括将结构放入载体中的口袋中，其中定位了一定量的低传热/电阻物质，例如润滑脂。 唇部的尺寸大于口袋的尺寸。 因此，该结构被支撑在口袋的边缘上，而其下面的具有较小尺寸的部分位于口袋中。 安装螺钉可以通过装置壳体向载体提供预定的压力。 由此，唇部提供了靠近设备的热引线的可靠接地，同时还限定并保持了口袋的底部与设备的壳体之间的间隙。

公开(公告)号：US20100148796A1

公开(公告)日：2010-06-17

申请号：US12451138

申请日：2008-04-25

Applicant: Thomas Feucht ,  Andreas Arlt

Inventor： Thomas Feucht ,  Andreas Arlt

IPC: G01R31/04

CPC classification number: G01R31/043 ,  G01R27/205 ,  G01R31/026 ,  H05K1/0268 ,  H05K1/0293 ,  H05K2201/10409 ,  H05K2203/162 ,  H05K2203/173

Abstract: A device for checking the attachment of a circuit board on a carrier, in particular a housing, has on each attachment point a pair of mutually associated electrically conductive contact surfaces and an electrically conductive connecting arrangement, which connects the circuit board mechanically to the carrier and at the same time connects the electrically conductive contact surfaces of the respective pair electrically to each other. At least one of the electrically conductive contact surfaces of a pair is situated on the circuit board. The other contact surface may likewise be situated on the circuit board or, for an electrically conductive carrier, even on the carrier. The respective pairs of conductive contact surfaces and the electrically conductive connecting arrangement form an electric circuit, which may be connected in a series circuit or a parallel circuit. An evaluation circuit checks whether the electric circuit thus formed is closed.

Abstract translation: 用于检查电路板在载体上，特别是壳体上的附接的装置在每个连接点上具有一对相互关联的导电接触表面和导电连接装置，其将电路板机械连接到载体上， 同时将相应对的导电接触表面彼此电连接。 一对的导电接触表面中的至少一个位于电路板上。 另一个接触表面同样可以位于电路板上，或者对于导电载体，甚至位于载体上。 各对导电接触表面和导电连接装置形成电路，其可以串联电路或并联电路连接。 评估电路检查这样形成的电路是否闭合。

公开(公告)号：US20100142163A1

公开(公告)日：2010-06-10

申请号：US12630749

申请日：2009-12-03

Applicant: Tsunehito UEMURA ,  Hiroshi UENO

Inventor： Tsunehito UEMURA ,  Hiroshi UENO

IPC: H05K5/00

CPC classification number: H05K9/0039 ,  H05K1/02 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/09909 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board is fixed to a housing including a boss-like fixing part by being fastened by a fixing tool. The circuit board includes a printed portion formed in a region that the circuit board contacts with the housing. The printed portion includes a lattice printed portion formed by silk screening on a periphery of a fixing hole through which the fixing tool is inserted, and a ring printed portion formed by silk screening on a periphery of the lattice printed portion. The lattice printed portion includes a non-printed region, and the ring printed portion includes no non-printed region.

Abstract translation: 电路板通过固定工具固定而固定在包括凸起状固定部分的壳体上。 电路板包括形成在电路板与壳体接触的区域中的印刷部分。 打印部分包括通过丝网印刷形成的格子印刷部分，该丝网印刷部分在固定孔的外周插入固定工具，以及环形印刷部分，其通过丝网印刷形成在格子印刷部分的周围。 格子印刷部分包括非印刷区域，并且环形印刷部分不包括非印刷区域。

公开(公告)号：US20100088886A1

公开(公告)日：2010-04-15

申请号：US12574719

申请日：2009-10-07

Applicant: Ting-Jui Wang

Inventor： Ting-Jui Wang

IPC: H05K3/34

CPC classification number: H05K3/3447 ,  H05K2201/10333 ,  H05K2201/10409 ,  H05K2203/0195 ,  H05K2203/082 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

Abstract: A packaging method for assembling a captive screw to a printed circuit board (PCB) includes the steps of providing a captive screw having a screw head, a threaded shank and a sleeve; pressing a fixture toward the screw head for a part of the threaded shank to exposed from a distal end of the sleeve, and then clamping the fixture on the sleeve; providing a PCB having through holes and a layer of solder provided thereon; using a tool to pick up the fixture and the captive screw and align the threaded shank with one through hole on the PCB; releasing the fixture and the captive screw from the tool for a flange at the distal end of the sleeve to extend into the through hole; heating, melting and then cooling to harden the solder layer, so that the sleeve is fixedly held to the PCB; and removing the fixture.

Abstract translation: 用于将固定螺钉组装到印刷电路板（PCB）的封装方法包括以下步骤：提供具有螺钉头，螺纹柄和套筒的固定螺钉; 将固定器朝着螺钉头按压一部分螺纹柄从套筒的远端露出，然后将夹具夹紧在套筒上; 提供具有通孔的PCB和设置在其上的焊料层; 使用工具拾取夹具和固定螺丝，并将螺纹柄与PCB上的一个通孔对齐; 从工具释放夹具和固定螺钉，用于在套筒的远端处的凸缘延伸到通孔中; 加热，熔化然后冷却以使焊料层硬化，使得套筒固定地保持在PCB上; 并拆下灯具。

公开(公告)号：US07688591B2

公开(公告)日：2010-03-30

申请号：US12043606

申请日：2008-03-06

Applicant: Sadato Imai ,  Satoru Kikuchi ,  Koichi Fukasawa

Inventor： Sadato Imai ,  Satoru Kikuchi ,  Koichi Fukasawa

IPC: H05K7/20 ,  F21V21/00 ,  F21V29/00

CPC classification number: F21V29/70 ,  F21K9/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01R4/023 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/114 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3421 ,  H05K7/205 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00

Abstract: The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved. In addition, the cost of the electronic-component-mounting board can be reduced.

Abstract translation: 根据本发明的电子部件安装板包括：高散热基板，包括金属板和形成在金属板的上表面上的电路图案; 电子部件，安装在高散热基板上，与电路图形电连接; 以及一个外部连接端子，其设置在高散热基板上并且提供电子部件安装板和外部设备之间的电连接。 外部连接端子由导热率小于金属板的导热性的材料形成，并且具有焊接有引线的至少一个外部电极。 因此，即使在高散热性基板上也可以通过焊接来连接引线。 因此，电连接的可靠性得到改善，并且可以实现电子部件安装板的尺寸和厚度的减小。 另外，可以减少电子部件安装板的成本。

公开(公告)号：US07652358B2

公开(公告)日：2010-01-26

申请号：US12136117

申请日：2008-06-10

Applicant: Atsushi Minakawa ,  Mamoru Sekiya ,  Norio Umezu

Inventor： Atsushi Minakawa ,  Mamoru Sekiya ,  Norio Umezu

IPC: H01L23/495

CPC classification number: H01L23/4006 ,  H01L25/112 ,  H01L2023/4056 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/14 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.

Abstract translation: 根据本发明的优选实施例的半导体器件是包括主衬底和一个或多个子衬底的半导体器件，并且半导体器件包括安装在子衬底上的第一发热器件，安装到第一衬底的子衬底散热器 发热装置和安装在主基板上的主衬底散热片，其中，辅助基板散热器和主衬底散热片彼此固定，使得在辅助衬底和主衬底之间存在预定的位置关系 。

公开(公告)号：US20100008048A1

公开(公告)日：2010-01-14

申请号：US12564541

申请日：2009-09-22

Applicant: Takashi URAI

Inventor： Takashi URAI

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H05K1/0271 ,  H01L23/4006 ,  H01L23/562 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/0058 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/00

Abstract: A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection plate member penetrates.

Abstract translation: 应变减少固定结构包括在印刷电路板上的通孔周围形成的沉孔，用于将印刷电路板固定到保护板构件的固定轴穿过该沉孔。