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    Bond connection for components
    111.
    发明授权
    Bond connection for components 失效
    组件的连接连接

    公开(公告)号：US4948030A

    公开(公告)日：1990-08-14

    申请号：US304052

    申请日：1989-01-30

    Applicant: Marc K. Chason ,  Michael J. Onystok ,  Nathan P. Bellin

    Inventor： Marc K. Chason ,  Michael J. Onystok ,  Nathan P. Bellin

    IPC: B23K1/20 ,  H05K3/34

    CPC classification number: H05K3/3426 ,  B23K1/20 ,  H01L2924/00013 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613

    Abstract: An electrical joint using spheroidal tipped leads improves the strength of a connection regardless of the material used to bond the connections. Axial leads of a component are formed into spheroids using an appropriate heat source to melt a small portion of the lead tip. Melting a portion of the lead alloys the lead with any non-wettable solder mask rendering a wettable spheroid. Surface tension in the molten metal forms the spheroid. The spheroid increases the area to which solder or other bonding agent adheres to. Solder mask remaining on the lead decreases solder wicking further up the lead. Reduced solder wicking retains the compliance of the lead. Controlled melting of the lead maintains planarity for multileaded components.

    Abstract translation: 使用球形尖端的电接头改善了连接的强度，而不管用于粘接连接的材料如何。 使用适当的热源将部件的轴向引线形成为球体，以熔化引导尖端的一小部分。 用引导可湿性球体的任何不可润湿的焊接掩模来熔化铅合金的一部分。 熔融金属中的表面张力形成球体。 球体增加焊料或其他粘合剂粘附到的面积。 导线上残留的焊盘会使引线上的焊锡芯线进一步上升。 减少焊锡芯吸保持铅的顺应性。 铅的控制熔化保持了多层组件的平面性。

    Method and transfer plate for applying solder to component leads
    112.
    发明授权
    Method and transfer plate for applying solder to component leads 失效
    用于将焊料焊接到元件引线的方法和转印板

    公开(公告)号：US4722470A

    公开(公告)日：1988-02-02

    申请号：US936574

    申请日：1986-12-01

    Applicant: Ajay Johary

    Inventor： Ajay Johary

    IPC: B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  H01R4/02 ,  H01R43/02 ,  H05K3/34 ,  B23K31/02 ,  B23K35/14

    CPC classification number: H05K3/3426 ,  B23K3/06 ,  B23K35/0222 ,  H01R43/0235 ,  H05K3/3484 ,  H01R4/028 ,  H05K2201/10727 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613

    Abstract: A method and a solder transfer member for applying discrete bodies of solder of predetermined size to the leads of a component for subsequent surface mounting to a substrate. The transfer member is a plate having a non-wetted surface, for example titanium, with an array of cavities matching the component lead pattern, each having a volume corresponding to the desired amount of solder to be applied to the corresponding lead. The method includes placing solder paste on the transfer member and filling the cavities by wiping the plate surface. The component is placed on the transfer member with the leads contacting the solder paste in the cavities. Reflow of the solder paste bonds to each lead a discrete body of solder having a precisely determined size. To limit wicking of solder on the leads, selective masking may be performed by applying a water soluble mask coating to the leads and removing the mask from selected areas by placing the component against a surface charged with water before placing the component on the transfer member.

    Flexible circuit board interconnect having low thermal conductivity
    113.
    发明授权
    Flexible circuit board interconnect having low thermal conductivity 失效
    具有低导热性的柔性电路板互连

    公开(公告)号：US4509095A

    公开(公告)日：1985-04-02

    申请号：US356069

    申请日：1982-03-08

    Applicant: John Boros

    Inventor： John Boros

    IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K7/20

    CPC classification number: H05K3/4691 ,  H01R12/52 ,  H05K1/0201 ,  H05K1/09 ,  H05K2201/062 ,  H05K2201/10909

    Abstract: The invention is directed to an apparatus adapted for flexible electrical interconnection between first and second rigid circuit systems, the systems being desirably isolated thermally from each other against heat energy tending undesirably to transfer between the systems, comprising in combination, a first flexible electrical conductor extending outwardly of the first circuit system to terminate in a first end, a second flexible electrical conductor extending outwardly of the second circuit system to terminate in a second end, and a third flexible electrical conductor bridging at least the first and second ends to provide the flexible electrical interconnection between the first and second systems and characterized by low thermal conductivity relative to at least one of the first and second conductors to thermally isolate the systems. Also included are methods for providing the flexible electrical interconnection between first and second rigid circuit systems.

    Abstract translation: 本发明涉及一种适于在第一和第二刚性电路系统之间进行柔性电互连的装置，所述系统期望彼此热隔离，以抵抗不期望地在系统之间转移的热能，其包括组合的第一柔性电导体， 在第一电路系统的外部终止于第一端，从第二电路系统向外延伸以终止于第二端的第二柔性电导体，以及至少桥接至少第一端和第二端的第三柔性电导体，以提供柔性 第一和第二系统之间的电互连，并且其特征在于相对于第一和第二导体中的至少一个具有低导热性以热隔离系统。 还包括用于在第一和第二刚性电路系统之间提供柔性电互连的方法。

    Inlaid contact
    114.
    发明授权
    Inlaid contact 失效
    镶嵌接触

    公开(公告)号：US4183611A

    公开(公告)日：1980-01-15

    申请号：US685856

    申请日：1976-05-13

    Applicant: Albert Casciotti ,  Gary L. Zimmerman

    Inventor： Albert Casciotti ,  Gary L. Zimmerman

    IPC: H01R4/02 ,  H01R43/16 ,  H05K3/34 ,  H01R9/06

    CPC classification number: H05K3/3447 ,  H01R4/028 ,  H01R12/57 ,  H01R43/16 ,  H05K2201/10295 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y10S428/929 ,  Y10T29/49213 ,  Y10T428/1275 ,  Y10T428/12924

    Abstract: An improved electrical contact is disclosed formed from a sheet metal stock base which has been skived and inlaid with at least one strip of metal having different electrical and/or mechanical characteristics from the base metal to thereby form an improved electrical contact. The inlaid strips can include a strip of noble metal to improve the electrical characteristics of the contact at the point of engagement with a mating contact. At least one solder repelling strip can be inlaid so that the resulting contact may be dip or wave soldered without the danger of the solder being wicked into the contact. A further inlaid strip can include a solder material so that the contact can be soldered by a reflow operation.

    Abstract translation: 公开了一种改进的电触点，其由金属板材基体形成，该金属板坯基座已经被切割并镶嵌有与母材金属具有不同电和/或机械特性的至少一条金属条，从而形成改进的电接触。 嵌入的条带可以包括贵金属条，以改善与配合触点的接合点处触点的电特性。 可以嵌入至少一个焊料排斥条，使得所得到的接触可以是浸渍或波焊，而不会使焊料被恶化到接触中。 另外的嵌入带可以包括焊料材料，使得接触可以通过回流操作来焊接。

    CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
    116.
    发明公开
    CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240276656A1

    公开(公告)日：2024-08-15

    申请号：US18179378

    申请日：2023-03-07

    Applicant: ACTRON TECHNOLOGY CORPORATION

    Inventor： Hsin-Chang Tsai ,  Ching-Wen Liu

    IPC: H05K5/00 ,  H05K1/18

    CPC classification number: H05K5/003 ,  H05K1/181 ,  H05K2201/09145 ,  H05K2201/10909

    Abstract: A circuit substrate includes a base material, a first electrode, and a second electrode. The base material has an upper side and a lower side opposite to each other in a length direction. The first electrode extends and is configured on the base material along the length direction. The second electrode is configured beside the first electrode and includes a first portion and a second portion connected to each other. The first portion is configured on the base material along the length direction. The second portion is configured on the base material along a width direction and is located between the upper side and the first electrode. A cross-sectional width of the first portion becomes larger from the lower side to the upper side.

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