公开(公告)号：US06729025B2

公开(公告)日：2004-05-04

申请号：US09981480

申请日：2001-10-16

Applicant: Brian Farrell ,  Patricia Wilson Nguyen ,  Justyna Teverovsky ,  Jeremiah Slade ,  Mara Powell

Inventor： Brian Farrell ,  Patricia Wilson Nguyen ,  Justyna Teverovsky ,  Jeremiah Slade ,  Mara Powell

IPC: H05K1300

CPC classification number: H05K3/0058 ,  A41D1/002 ,  B32B3/08 ,  B32B5/02 ,  B32B7/04 ,  G06F19/00 ,  H05K1/038 ,  H05K1/189 ,  H05K3/386 ,  H05K2201/029 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0285 ,  H05K2203/065 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T428/24917

Abstract: A method of manufacturing a fabric article to include electronic circuitry in which a flex circuit is assembled to include conductive traces and pads on a flexible substrate, a fabric article is placed on a rigid surface, and the substrate of the flex circuit is secured to the fabric article. Also disclosed is a fabric article which includes electronic circuitry and an electrically active textile article.

Abstract translation: 一种制造织物制品的方法，包括电子电路，其中柔性电路被组装以在柔性基底上包括导电迹线和焊盘，将织物制品放置在刚性表面上，并且柔性电路的基底固定到 面料文章。 还公开了一种织物制品，其包括电子电路和电活性织物制品。

公开(公告)号：US20040016565A1

公开(公告)日：2004-01-29

申请号：US10423816

申请日：2003-04-25

Inventor： Christopher M. Gallant ,  Michel Labrecque ,  Mark A. Clarner ,  John Demain

IPC: H01B007/08

CPC classification number: B29C43/28 ,  B29C43/222 ,  B29C2043/465 ,  B29L2031/729 ,  B60R16/0207 ,  B60R16/0215 ,  H01B7/08 ,  H01B7/40 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/202 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/09118 ,  H05K2201/209 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1545 ,  Y10T428/2933

Abstract: An elongated electrical cable or flexible circuit board includes an electrically conductive path and an insulating body encompassing and electrically isolating the conductive path, the insulating body including an exposed surface having an array of fastener elements extending therefrom, the fastener elements arranged and constructed to engage mating fastener elements associated with a supporting surface to selectively secure the cable or flexible circuit board to the supporting surface. The fastener elements can be loop-engageable fasteners and/or loops. Such a cable or flexible circuit board is continuously formed by introducing an electrical insulating material including a thermoplastic resin into a gap formed adjacent a peripheral surface of a rotating mold roll, the mold roll defining an array of cavities therein, the insulating material being introduced under pressure and temperature conditions selected to cause the insulating material to at least partially fill the cavities to form fastener element stems integrally with and extending from one broad side of a strip of said insulation material; while introducing conductive wires and/or a conductive path formed on or within a substrate to the gap so as to cause the insulating material to envelop and electrically isolate the conductive path and/or to cause the conductive path to become an integral part of the strip of insulation material from which the fastener element stems extend.

Abstract translation: 细长的电缆或柔性电路板包括导电路径和绝缘体，其包围并电绝缘导电路径，绝缘体包括具有从其延伸的紧固件元件阵列的暴露表面，所述紧固件元件被布置和构造成接合配合 与支撑表面相关联的紧固元件以选择性地将电缆或柔性电路板固定到支撑表面。 紧固件元件可以是可与圈接合的紧固件和/或环。 这种电缆或柔性电路板通过将包括热塑性树脂的电绝缘材料引入到邻近旋转模具辊的周边表面形成的间隙中而连续地形成，模具辊在其中限定一系列空腔，绝缘材料被引入到 选择的压力和温度条件使得绝缘材料至少部分地填充空腔以与所述绝缘材料的条带的一个宽侧一体地形成并从其延伸; 同时将导电线和/或形成在衬底上或衬底内的导电路径引入间隙，以便使绝缘材料包封并电绝缘导电路径和/或使导电路径成为带的整体部分 的绝缘材料，紧固件元件从其延伸。

公开(公告)号：US20030112627A1

公开(公告)日：2003-06-19

申请号：US09969119

申请日：2001-09-27

Inventor： Raymond E. Deese

IPC: F21V021/00 ,  F21S004/00

CPC classification number: G09F13/0404 ,  F21S4/24 ,  F21V21/0832 ,  F21V23/06 ,  F21W2131/107 ,  F21Y2115/10 ,  G09F13/22 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/10106 ,  H05K2201/209

Abstract: An energy efficient light strip illumination apparatus that can be easily installed with Velcro fasteners for both new installations and retrofitting incandescent and neon installations. One of the preferred embodiments is a flexible strip in which LED array's are imprinted in sections so that the strip can be cut to customize the size of the light strips to fit signs or other lighted features of any size or shape.

Abstract translation: 一种节能灯条照明设备，可轻松安装Velcro紧固件，用于新设施和改装白炽灯和霓虹灯装置。 优选实施例中的一个是柔性条，其中LED阵列被印刷在部分中，使得条可以被切割以定制光条的尺寸以配合任何尺寸或形状的符号或其他点亮的特征。

公开(公告)号：US20030061709A1

公开(公告)日：2003-04-03

申请号：US09964747

申请日：2001-09-28

Inventor： Tom E. Pearson ,  George Arrigotti ,  Christopher D. Combs ,  Raiyomand F. Aspandiar

IPC: H05K003/36 ,  B23P019/00

CPC classification number: H05K3/3405 ,  H05K1/142 ,  H05K2201/09127 ,  H05K2201/10204 ,  H05K2201/10446 ,  H05K2201/209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53252

Abstract: A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

Abstract translation: 提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。 印刷电路板可以包括至少一个阴构件以接收相应的阳构件。 该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。 延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

公开(公告)号：US06534726B1

公开(公告)日：2003-03-18

申请号：US09696097

申请日：2000-10-25

Applicant: Masanobu Okada ,  Tomoyuki Koide ,  Kazuyoshi Nakaya ,  Hiroyuki Nakaji

Inventor： Masanobu Okada ,  Tomoyuki Koide ,  Kazuyoshi Nakaya ,  Hiroyuki Nakaji

IPC: H01R1204

CPC classification number: H05K3/3442 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/209 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49165 ,  H01L2924/00

Abstract: End-face through holes each comprising a concave-curved end-face opening groove and an end-face electrode covering the inner wall of the groove are formed in the end-faces of a substrate. Furthermore, a solder having a semi-circular shape is attached to the end-face electrode. The solder comprises an electrode facing portion facing the end-face electrode in the end-face groove, and a protuberant portion elongated from the electrode facing portion to protrude on the back-surface side of the substrate. Thereby, even if the substrate or the like is warped, a gap between the end-face electrode and the electrode pad of a mother board can be filled with the protuberant portion of the solder to connect the end-face electrode and the electrode pad to each other.

Abstract translation: 在基板的端面形成有各自包括凹曲面端面开口槽和覆盖槽内壁的端面电极的端面贯通孔。 此外，具有半圆形状的焊料附着到端面电极。 焊料包括在端面槽中面向端面电极的电极面对部分，以及从电极对向部分伸长以在基板的背面侧突出的突出部分。 由此，即使基板等翘曲，母板的端面电极和电极焊盘之间的间隙也可以填充焊料的隆起部分，以将端面电极和电极焊盘连接到 彼此。

公开(公告)号：US20020113311A1

公开(公告)日：2002-08-22

申请号：US10057127

申请日：2002-01-25

Inventor： Bernd Barchmann ,  Erik Heinemann ,  Josef Heitzer ,  Frank Pueschner

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81898 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/113 ,  H05K3/325 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/209 ,  H01L2224/05639 ,  H01L2924/00014

Abstract: A device having a semiconductor component and a printed circuit board are described. The semiconductor component has external contacts and the printed circuit board has contact terminals. The contact terminals display a central blind opening, into which the external contacts of the semiconductor component protrude and are in a force-locking engagement with the contact terminal areas. In the method of electromechanically connecting the two parts to form a device, after they have been aligned, the two components are merely pressed onto each other.

Abstract translation: 描述具有半导体部件和印刷电路板的器件。 半导体元件具有外部触点，并且印刷电路板具有接触端子。 接触端子显示中央盲孔，半导体部件的外部触点突出并且与接触端子区域形成力锁定接合。 在机电地连接两部分以形成装置的方法中，在它们对准之后，两个部件仅被压在彼此上。

公开(公告)号：US20020104677A1

公开(公告)日：2002-08-08

申请号：US10047429

申请日：2002-01-15

Inventor： Wolfgang Diegmann ,  Ruediger Tiedeck ,  Frank H. Adam

IPC: H01B007/18

CPC classification number: H05K3/0058 ,  B60R16/0207 ,  H01B7/40 ,  H05K1/0393 ,  H05K2201/209

Abstract: The invention relates to an electrical conductor having a flat cross-section which has an electrically conducting material which is embedded in an electrically insulating material provided with hooks or loops.

Abstract translation: 本发明涉及一种具有扁平横截面的电导体，其具有导电材料，该导电材料嵌入设置有钩或环的电绝缘材料中。

公开(公告)号：US5984697A

公开(公告)日：1999-11-16

申请号：US984443

申请日：1997-12-03

Applicant: Sean A. Moran ,  Roger W. Berg

Inventor： Sean A. Moran ,  Roger W. Berg

IPC: H01R12/52 ,  H01R13/24 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/14 ,  H05K9/00 ,  H01R4/66

CPC classification number: H01R13/2457 ,  H01R12/52 ,  H01R13/24 ,  H05K3/368 ,  H05K3/4015 ,  H05K7/142 ,  H05K9/0016 ,  H05K1/0215 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10962 ,  H05K2201/2036 ,  H05K2201/209 ,  H05K3/341 ,  H05K3/3447 ,  Y02P70/611

Abstract: A ground clip apparatus is designed to make ground contact between two circuit boards as they are mated together. A standoff member is mounted on one of the boards and a spring clip member is mounted on the other board facing the standoff member. The spring clip member has spring arms which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.

Abstract translation: 接地夹设备被设计成在两个电路板配合在一起时使接地。 支架构件安装在其中一个板上，并且弹簧夹构件安装在另一个板上，面向支座构件。 弹簧夹构件具有当板被配合在一起以使得可靠的接地接触时偏压抵靠构件的弹簧臂。 同时，支座构件抵抗任一板向另一板的挠曲。

公开(公告)号：US5110298A

公开(公告)日：1992-05-05

申请号：US759737

申请日：1991-09-12

Applicant: Dale W. Dorinski ,  Mac W. Branan

Inventor： Dale W. Dorinski ,  Mac W. Branan

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01L24/90 ,  H01L24/10 ,  H01L24/13 ,  H01R12/52 ,  H05K1/117 ,  H05K1/142 ,  H05K3/366 ,  H01L2224/13 ,  H01L2224/13012 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81898 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/10446 ,  H05K2201/209

Abstract: An integral electrical interconnection is made between two circuit carrying substrates (100 and 110). The first circuit carrying substrate (100) contains one or more protrusions (102) on the peripheral edge of the substrate (100) which couples to a series of one or more apertures (104) on the peripheral edge of a second circuit carrying substrate (110). Both the tabs and the apertures are covered with conductive materials (202 and 210) also connected to the circuit.

Abstract translation: 在两个承载电路的基板（100和110）之间形成一体的电气互连。 第一电路承载基板（100）在基板（100）的周边边缘上包含一个或多个凸起（102），所述突起连接到第二电路承载基板的外围边缘上的一系列一个或多个孔（104） 110）。 两个舌片和孔均用也连接到电路的导电材料（202和210）覆盖。

公开(公告)号：US4601038A

公开(公告)日：1986-07-15

申请号：US695764

申请日：1985-01-28

Applicant: Steve Guch, Jr.

Inventor： Steve Guch, Jr.

IPC: H01S3/04 ,  H01S3/042 ,  H01S3/092 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K7/02

CPC classification number: H01S3/093 ,  H05K3/0061 ,  H05K7/02 ,  H01S3/025 ,  H01S3/0404 ,  H01S3/0405 ,  H01S3/042 ,  H05K1/05 ,  H05K2201/209 ,  H05K3/281

Abstract: The exterior surfaces of a laser rod and pump lamp are covered with a highly reflective metal foil to prevent light leakage from the rod and lamp. The laser rod and pump lamp operate within a cavity inside a heat sink. Between the metal foil and the housing is a thermally conductive fluidic material selected to provide a tailored thermal impedance between the heat sink and the rod and pump to optimize the steady state temperatures of these components. The conductive fluid is not circulated but is contained to act as a simple heat conductor. The optically reflective and the heat transfer functions of the laser pumping operation are essentially separate from each other, enabling selection of materials for these respective functions to enhance performance of the laser and substantially simplify its construction.