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公开(公告)号:US20230192479A1
公开(公告)日:2023-06-22
申请号:US18066802
申请日:2022-12-15
Applicant: INVENSENSE, INC.
Inventor: Joseph Seeger
CPC classification number: B81B7/02 , H02M3/07 , B81B2201/0221 , B81B2201/0257 , B81B2203/04 , B81B2207/03
Abstract: Embodiments for constant charge or capacitance for capacitive micro-electromechanical system (MEMS) sensors are presented herein. A MEMS device comprises a sense element circuit comprising a bias resistance, a charge-pump, and a capacitive sense element comprising an electrode and a sense capacitance. The charge-pump generates, at a bias resistor electrically coupled to the electrode, a bias voltage that is inversely proportional to a capacitance value comprising a value of the sense capacitance to facilitate maintenance of a nominally constant charge on the electrode. A sensing circuit comprises an alternating current (AC) signal source that generates an AC signal at a defined frequency; and generates, based on the AC signal, an AC test voltage at a test capacitance that is electrically coupled to the electrode. The sense element circuit generates, based on the AC test voltage at the defined frequency, an output signal representing the value of the sense capacitance.
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公开(公告)号:US20180356255A1
公开(公告)日:2018-12-13
申请号:US15781352
申请日:2015-12-14
Applicant: Goertek Inc.
Inventor: Junkai ZHAN , Mengjin CAI
IPC: G01D5/241
CPC classification number: G01D5/2417 , B81B2201/0214 , B81B2201/0221 , B81B2201/0264 , B81B2201/0278 , B81B2207/053 , B81C1/00182 , B81C1/00214 , G01K7/34 , G01L9/0045 , G01L9/0047 , G01L9/0073
Abstract: An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.
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公开(公告)号:US09969606B2
公开(公告)日:2018-05-15
申请号:US15064879
申请日:2016-03-09
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor: Matti Liukku , Jaakko Ruohio , Hannu Vesterinen
IPC: B81B3/00 , G01P15/125 , H01G5/14 , G01P15/08
CPC classification number: B81B3/0045 , B81B3/0056 , B81B3/0086 , B81B2201/0221 , B81B2201/0271 , G01P15/125 , G01P2015/0814 , H01G5/14
Abstract: A MEMS structure that provides an improved way to selectively control electromechanical properties of a MEMS device with an applied voltage. The MEMS structure includes a capacitor element that comprises at least one stator element, and at least one rotor element suspended for motion parallel to a first direction in relation to the stator element. The stator element and the rotor element form at least one capacitor element, the capacitance of which varies according to displacement of the rotor element from an initial position. The stator element and the rotor element are mutually oriented such that in at least one range of displacements of the rotor element from an initial position, the second derivative of the capacitance with respect to the displacement has negative values.
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公开(公告)号:US20170267517A1
公开(公告)日:2017-09-21
申请号:US15250519
申请日:2016-08-29
Applicant: KABUSHIKI KAISHA TOSHIBA
Inventor: Akira FUJIMOTO , Naofumi NAKAMURA , Tamio IKEHASHI
CPC classification number: B81B3/0075 , B81B2201/0221 , B81B2201/0235 , B81B2203/0307 , B81B2203/0315 , B81B2207/015 , B81C1/00293 , B81C1/00674 , B81C2201/0123 , B81C2201/0132 , B81C2201/053 , B81C2203/0136 , B81C2203/0145
Abstract: According to one embodiment, an electronic device includes a base region, an element portion located on the base region, the element portion including a movable portion, and a protective film overlying the element portion and forming a cavity on an inner side of the protective film. The protective film includes a first protective layer and a second protective layer located on the first protective layer. A hole extends in a direction parallel to a main surface of the base region, and the second protective layer covers the hole.
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公开(公告)号:US20170240417A1
公开(公告)日:2017-08-24
申请号:US15210588
申请日:2016-07-14
Applicant: KABUSHIKI KAISHA TOSHIBA
Inventor: Masaki YAMADA
IPC: B81B7/00
CPC classification number: B81B7/0038 , B81B3/0051 , B81B2201/0221 , B81B2203/04 , H01G5/16
Abstract: A micro electro mechanical systems (MEMS) device includes a first electrode formed on a substrate, a second electrode that faces the first electrode, a protective film formed on the substrate with a space therebetween in which the first and second electrodes are located, and a sealing layer covering the protective film. The second electrode has a curved structure extending in a direction away from the first electrode, and is movable toward or away from the first electrode. The protective film has a plurality of openings formed therein and a protrusion that protrudes toward the second electrode.
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公开(公告)号:US20170180900A1
公开(公告)日:2017-06-22
申请号:US15452058
申请日:2017-03-07
Applicant: Infineon Technologies AG
Inventor: Alfons Dehe , Stefan Barzen
CPC classification number: H04R31/003 , B81B3/0021 , B81B3/0086 , B81B2201/0221 , B81B2201/0257 , B81B2203/0127 , B81B2203/04 , B81C1/00158 , B81C2201/013 , H04R1/08 , H04R19/005 , H04R31/006 , H04R2201/003
Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.
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公开(公告)号:US09676608B2
公开(公告)日:2017-06-13
申请号:US14462262
申请日:2014-08-18
Applicant: KABUSHIKI KAISHA TOSHIBA
Inventor: Akihiro Kojima , Yoshiaki Sugizaki , Yoshiaki Shimooka
CPC classification number: B81B7/0038 , B81B2201/0221 , B81B2203/04 , B81C1/00476
Abstract: A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is higher than that of the first film. An insulating third film is formed on the second film and has a gas permeability which is lower than the second film. An insulating fourth film is formed on the third film and has an elasticity which is larger than the third film.
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公开(公告)号:US20170098509A1
公开(公告)日:2017-04-06
申请号:US15385431
申请日:2016-12-20
Applicant: Texas Instruments Incorporated
Inventor: Arun Gupta , William C. McDonald , Adam Fruehling , Ivan Kmecko , Lance Barron , Divyanshu Agrawal , Arthur M. Turner , John C. Ehmke
CPC classification number: H01G5/16 , B81B3/0008 , B81B3/001 , B81B3/0013 , B81B7/0064 , B81B7/008 , B81B7/02 , B81B2201/016 , B81B2201/0221 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/0181 , B81B2203/053 , B81B2203/058 , B81B2203/06 , B81B2207/012 , B81B2207/096 , B81C1/00158 , H01G5/011 , H01G5/40
Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.
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公开(公告)号:US20160272481A1
公开(公告)日:2016-09-22
申请号:US15067110
申请日:2016-03-10
Applicant: KABUSHIKI KAISHA TOSHIBA
Inventor: Hiroaki YAMAZAKI , Yoshihiko KURUI , Tamio IKEHASHI
IPC: B81B3/00
CPC classification number: B81B3/0008 , B81B2201/0221 , B81B2203/04 , H01G5/18
Abstract: According to one embodiment, a MEMS device is disclosed. The device includes a substrate, a first electrode fixed on the substrate. The first electrode includes a first one end portion and a first other end portion. A capacitor insulating film is provided on the first electrode. An insulating film is provided on the substrate and located around a periphery of the first electrode. A second electrode is provided above the first electrode and movable. The second electrode includes a second one end portion corresponding to the first one end portion, and a second other end portion corresponding to the first other end portion. The second one end portion extends outside the first one end portion and includes a first bent portion bent downward.
Abstract translation: 根据一个实施例,公开了一种MEMS器件。 该装置包括基板,固定在基板上的第一电极。 第一电极包括第一端部和第一另一端部。 电容绝缘膜设置在第一电极上。 绝缘膜设置在基板上并且位于第一电极的周边周围。 第二电极设置在第一电极上方并可移动。 第二电极包括对应于第一一个端部的第二一个端部和与第一另一个端部对应的第二另一个端部。 第二一个端部在第一一个端部的外侧延伸并且包括向下弯曲的第一弯曲部分。
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公开(公告)号:US20160196923A1
公开(公告)日:2016-07-07
申请号:US14889629
申请日:2014-05-20
Applicant: CAVENDISH KINETICS, INC
Inventor: Robertus Petrus VAN KAMPEN , Anartz UNAMUNO
CPC classification number: H01G5/18 , B81B7/008 , B81B2201/0221 , H01H59/0009
Abstract: The present invention generally relates to a method and apparatus for damping a plate electrode or switching element in a MEMS DVC device. A resistor disposed between a waveform controller and the electrodes of the MEMS DVC causes the voltage to increase while capacitance decreases during the time that the plate electrode is moving. Due to the increase in voltage and decrease in capacitance, the electrostatic force that resists the plate electrode movement away from an electrode increases, which in turn dampens the movement of the plate electrode.
Abstract translation: 本发明一般涉及一种用于阻尼MEMS DVC装置中的平板电极或开关元件的方法和装置。 布置在波形控制器和MEMS DVC的电极之间的电阻器在平板电极移动期间电容降低,导致电压增加。 由于电压的增加和电容的减小,抵抗板电极远离电极的静电力增加,这又抑制板电极的运动。
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