公开(公告)号：US20150353787A1

公开(公告)日：2015-12-10

申请号：US14655933

申请日：2013-12-20

Applicant: NITTO DENKO CORPORATION

Inventor： Mizuho Nagata ,  Kenichi Okada ,  Toshitaka Takahashi ,  Yousuke Makihata ,  Kayo Shimokawa ,  Toshitsugu Hosokawa

IPC: C09J133/08 ,  C09J7/02

CPC classification number: C09J133/10 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J133/08 ,  C09J2201/602 ,  C09J2203/318 ,  C09J2433/00 ,  C08F2220/1825 ,  C08F220/06 ,  C08F230/02 ,  C08F230/00

Abstract: It is an object of the invention to provide a water-dispersible pressure-sensitive adhesive composition that is suitable for use on a transparent conductive layer and capable of forming a pressure-sensitive adhesive layer effective in suppressing the corrosion of various adherends such as transparent conductive thin coatings, in particular, effective in suppressing the corrosion in a high-temperature environment and a high-temperature, high-humidity environment, and capable of providing good optical properties on a transparent conductive layer. The invention is a water-dispersible pressure-sensitive adhesive composition for a transparent conductive layer, the composition comprising: a (meth)acryl-based polymer obtained by polymerizing, in the presence of a surfactant, a monomer component comprising an alkyl(meth)acrylate having an alkyl group of 4 to 14 carbon atoms, wherein the surfactant is a reactive surfactant having three or less oxyalkylene repeating units and/or a reactive surfactant having no oxyalkylene repeating unit.

Abstract translation: 本发明的目的是提供一种适用于透明导电层并能够形成压敏粘合剂层的水分散性压敏粘合剂组合物，其有效抑制各种被粘物的腐蚀，例如透明导电 特别是在高温环境和高温高湿环境下有效抑制腐蚀，能够在透明导电层上提供良好的光学性能。 本发明是用于透明导电层的水分散性压敏粘合剂组合物，该组合物包含：（甲基）丙烯酸基聚合物，其通过在表面活性剂存在下聚合包含（甲基）丙烯酸烷基酯的单体组分， 丙烯酸酯，其中表面活性剂是具有三个或更少个氧化烯重复单元的反应性表面活性剂和/或不具有氧化烯重复单元的反应性表面活性剂。

公开(公告)号：US20150248139A1

公开(公告)日：2015-09-03

申请号：US14429296

申请日：2013-09-18

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke Kuroda

IPC: G06F1/16 ,  G06F3/041

CPC classification number: G06F1/16 ,  B32B15/06 ,  B32B15/08 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/092 ,  B32B15/095 ,  B32B15/20 ,  B32B25/12 ,  B32B25/16 ,  B32B25/20 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/30 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/05 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/402 ,  B32B2307/4023 ,  B32B2307/4026 ,  B32B2307/41 ,  B32B2307/416 ,  B32B2405/00 ,  B32B2457/20 ,  C09J7/29 ,  C09J9/02 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2400/163 ,  G02B5/208 ,  G06F3/0412

Abstract: A conductive sheet has a structure in which a conductive adhesive layer laminated on one side of a base substrate and a light-shielding insulating layer laminated on another side of the base substrate. The base substrate has a structure in which the same kind of metal layers are formed on respective sides of a resin film. The light-shielding insulating layer of the conductive sheet has a surface having a surface resistivity of 1.0×108 Ω/square or more, a gloss value of 80% or less, and an optical density of 1 or more.

Abstract translation: 导电片具有层叠在基底基板的一侧上的导电性粘合剂层和层叠在基材的另一侧的遮光绝缘层的结构。 基底基板具有在树脂膜的各侧形成相同种类的金属层的结构。 导电片的遮光绝缘层具有表面电阻率为1.0×10 8Ω·cm 2·正方形以上，光泽值为80％以下，光密度为1以上的表面。

公开(公告)号：US20150240130A1

公开(公告)日：2015-08-27

申请号：US14712093

申请日：2015-05-14

Applicant: Trillion Science Inc.

Inventor： Rong-Chang Liang ,  Jane Sun ,  Howard Ho Man Chu ,  Meng-Chun Lee

IPC: C09J9/02 ,  C09J7/00

CPC classification number: C09J9/02 ,  C08K7/04 ,  C08K7/16 ,  C08K2201/001 ,  C08K2201/005 ,  C09J7/02 ,  C09J7/20 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H05K3/323 ,  Y10T428/24 ,  Y10T428/24893

Abstract: An ACF comprising a substrate, a layer of an adhesive on the surface of the substrate, the adhesive optionally having conductive particles dispersed therein, at least one tier of conductive particles arranged in a non-random array, the tier being formed by transfer of conductive particles from a carrier belt having a stitching line to the surface of the adhesive layer wherein the portion of the tier corresponding to the stitching line is free of conductive particles, and the adhesive layer being overcoated with a second tier of conductive particles arranged in a non-random array at least in the area of the first tier corresponding to the stitching line. The tiers may be at the same or different depths within the adhesive layer. More than two tiers of conductive particles may be present in the ACF.

Abstract translation: 一种ACF，包括基材，在基材表面上的粘合剂层，粘合剂任选地具有分散在其中的导电颗粒，至少一层导电颗粒以非随机阵列排列，该层通过传导导电 具有缝合线的载体带到粘合剂层的表面的颗粒，其中对应于缝合线的层的部分没有导电颗粒，并且粘合剂层被涂覆有布置在非粘合层中的第二层导电颗粒 至少在对应于缝合线的第一层的区域中的等级阵列。 层可以在粘合剂层内处于相同或不同的深度。 ACF中可能存在两层以上的导电颗粒。

公开(公告)号：US20150147556A1

公开(公告)日：2015-05-28

申请号：US14553532

申请日：2014-11-25

Applicant: NITTO DENKO CORPORATION

Inventor： Shu SASAKI ,  Jyunichi NAKAYAMA ,  Rie YUTO ,  Yoshio TERADA

IPC: C09J9/02 ,  C08K9/10 ,  C09J11/04 ,  C09J7/00 ,  C09J11/06

CPC classification number: C09J9/02 ,  C08K7/16 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/005 ,  C09J7/00 ,  C09J7/10 ,  C09J11/00 ,  C09J133/08 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  G02F2202/16 ,  G02F2202/28 ,  H05K3/323 ,  Y10T428/25 ,  Y10T428/256

Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 μm or more to about 50 μm or less and at least one further peak top existing in a particle size range from about 1 μm or more to about 12 μm or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.

Abstract translation: 导电性粘合带包含含有树脂成分和导电性粒子的粘合剂层。 导电颗粒具有至少一个峰顶，其存在于约15μm或更多至约50μm或更小的粒度范围内，并且至少一个另外的峰顶存在于约1μm或更大至约 其粒度分布曲线为12μm以下。 导电性颗粒以40质量％以上且80质量％以下的量包含在粘合剂层中，并且具有大于零但小于8g / cm 3的真实密度。

公开(公告)号：US08896117B2

公开(公告)日：2014-11-25

申请号：US13679113

申请日：2012-11-16

Applicant: Youn Jo Ko ,  Jin Kyu Kim ,  Dong Seon Uh ,  Kil Yong Lee ,  Jang Hyun Cho

Inventor： Youn Jo Ko ,  Jin Kyu Kim ,  Dong Seon Uh ,  Kil Yong Lee ,  Jang Hyun Cho

IPC: H01L23/52 ,  C09J9/02 ,  C09J133/04 ,  C09J7/00 ,  H01L23/00

CPC classification number: H01L23/52 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J133/04 ,  C09J2201/134 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/00014 ,  H01L2224/29399 ,  H01L2924/00

Abstract: A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.

Abstract translation: 通过各向异性导电膜结合的半导体器件，各向异性导电膜包括导电粘合剂层和层叠在其上的绝缘粘合剂层，导电粘合剂层中的反应性单体的量高于绝缘粘合剂层中的反应性单体的量 。

公开(公告)号：US08877560B2

公开(公告)日：2014-11-04

申请号：US13942893

申请日：2013-07-16

Applicant: Lite-On Technology Corp.

Inventor： Wen-Chi Chen ,  Ming-Feng Tang ,  Chung-Fu Wang

IPC: H01L21/00 ,  B32B9/00 ,  B32B33/00 ,  B32B27/12 ,  C09J7/02 ,  H05K13/00 ,  H01L23/373 ,  H01L21/48 ,  H05K7/20 ,  H01L23/40

CPC classification number: H05K13/00 ,  C09J7/10 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2483/00 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K7/20 ,  Y10T428/1476 ,  Y10T428/1481 ,  H01L2924/00

Abstract: A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.

Abstract translation: 一种用于组装发热元件和散热元件的方法包括：制备包括压敏层的压敏元件和连接到压敏层的第一和第二释放膜; 将第二剥离膜与压敏层分离，然后将散热元件粘附到压敏层; 迫使第一个释放膜; 将第一剥离膜与压敏层分离，然后将发热元件粘附到压敏层; 并将发热元件固定在压敏层上。 还公开了压敏元件和供电单元。

公开(公告)号：US08431206B2

公开(公告)日：2013-04-30

申请号：US12839153

申请日：2010-07-19

Applicant: Sun-Ki Kim

Inventor： Sun-Ki Kim

IPC: B32B9/00 ,  B32B3/00 ,  B32B7/12 ,  B32B15/04 ,  H01B7/08

CPC classification number: H01B1/22 ,  C08K3/017 ,  C08K3/08 ,  C09J7/29 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2205/102 ,  C09J2400/163 ,  Y10T428/12 ,  Y10T428/14 ,  Y10T428/1438 ,  Y10T428/1476 ,  Y10T428/24612 ,  Y10T428/28 ,  Y10T428/2804

Abstract: A multipurpose adhesive tape with minimized curling is provided. The adhesive tape includes a base formed as a thin sheet, an adhesive attached to the reverse surface of the base, and a projection projecting along the length of the outer surface of the base within a portion of the width thereof.

Abstract translation: 提供最小化卷曲的多功能胶带。 胶带包括形成为薄片的基部，附着到基部的反面的粘合剂，以及在其宽度的一部分内沿着基部的外表面的长度突出的突起。

公开(公告)号：US20130071636A1

公开(公告)日：2013-03-21

申请号：US13233360

申请日：2011-09-15

Applicant: Jiannrong Lee ,  Yuhao Sun ,  Maung Kyaw Aung ,  Chin-Jen Tseng ,  Chiapu Chang ,  Shuji Rokutanda ,  Rong-Chang Liang

Inventor： Jiannrong Lee ,  Yuhao Sun ,  Maung Kyaw Aung ,  Chin-Jen Tseng ,  Chiapu Chang ,  Shuji Rokutanda ,  Rong-Chang Liang

IPC: B32B5/16 ,  B32B3/10 ,  B65G17/36 ,  B32B38/10 ,  B32B37/14

CPC classification number: C09J9/02 ,  B32B3/10 ,  B32B5/16 ,  B32B7/12 ,  B32B27/14 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/308 ,  B32B27/36 ,  B32B27/365 ,  B32B37/12 ,  B32B37/14 ,  B32B37/226 ,  B32B38/06 ,  B32B38/10 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/105 ,  B32B2266/045 ,  B32B2307/202 ,  B32B2309/08 ,  B32B2310/0843 ,  B32B2457/00 ,  B65G17/36 ,  C08K9/02 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/28 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H05K3/321 ,  Y10T156/1066 ,  Y10T428/24893 ,  Y10T428/249921

Abstract: A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.

Abstract translation: 一种用于制造诸如各向异性导电膜的电子器件或部件的方法，包括：将多个导电粒子分布在形成在连续载体带的表面上的微腔阵列中，使携带导电颗粒的带旋转，同时传送 将粘合剂层与旋转带的表面接触，将导电颗粒从带上的微腔转移到粘合剂层中的粘合剂层中的对应于带上的微腔阵列的预定位置，并将粘合剂层从 皮带的表面。 在一个实施例中，微腔的位置以受控的方式变化。

公开(公告)号：US20130009105A1

公开(公告)日：2013-01-10

申请号：US13542290

申请日：2012-07-05

Applicant: Naoaki HIGUCHI ,  Tooru NAKASHIMA ,  Eiji YAMANAKA

Inventor： Naoaki HIGUCHI ,  Tooru NAKASHIMA ,  Eiji YAMANAKA

IPC: H01B1/12

CPC classification number: C09J133/08 ,  C08K3/08 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2433/00

Abstract: A conductive pressure-sensitive adhesive tape contains an acrylic pressure-sensitive adhesive, a conductive filler, and a heating foaming agent. An acrylic polymer can be preferably used as the acrylic pressure-sensitive adhesive. With the multiple conductive fillers being electrically connected to each other, conductive paths communicating from one of the major surfaces of the tape to the other major surface thereof are formed before temperature sensing. The heating foaming agent is a heating-type foaming agent that is foamed by being heated. The electrical connection between the conductive fillers, which has been formed before the heating foaming agent is foamed, is disconnected by the foamed heating foaming agent, and the conductive paths communicating from one of the major surfaces of the tape to the other major surface thereof are eliminated.

Abstract translation: 导电性压敏粘合带含有丙烯酸类压敏粘合剂，导电性填料和加热发泡剂。 可以优选使用丙烯酸类聚合物作为丙烯酸类压敏粘合剂。 在多个导电填料彼此电连接的情况下，在温度感测之前形成从磁带的一个主表面到另一主表面连通的导电路径。 加热发泡剂是通过加热发泡的加热型发泡剂。 在加热发泡剂发泡之前形成的导电填料之间的电连接被发泡加热发泡剂断开，并且从磁带的一个主表面连接到另一个主表面的导电路径是 消除了

公开(公告)号：US20120295098A1

公开(公告)日：2012-11-22

申请号：US13111300

申请日：2011-05-19

Applicant: Jiunn-Jye Hwang ,  Jiannrong Lee ,  Shuji Rokutanda ,  Chin-Jen Tseng ,  Rong-Chang Liang

Inventor： Jiunn-Jye Hwang ,  Jiannrong Lee ,  Shuji Rokutanda ,  Chin-Jen Tseng ,  Rong-Chang Liang

IPC: B32B5/16 ,  B32B5/00 ,  B32B7/12

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K9/04 ,  C08K9/06 ,  C08K2201/001 ,  C09J7/10 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2463/00 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/264

Abstract: Structures and manufacturing processes of an ACF array and more particularly a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a coupling agent onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film, the conductive particles are transferred to the adhesive film such that they are only partially embedded in the film.

Abstract translation: ACF阵列的结构和制造过程，更具体地，是具有预定构型，形状和尺寸的非随机阵列的微腔。 该制造方法包括用偶联剂将表面处理的导电颗粒流体填充到包含预定阵列的微腔的基底或载体网上。 然后将如此制备的填充的导电微腔阵列用粘合剂膜覆盖或层压，将导电颗粒转移到粘合剂膜，使得它们仅部分地嵌入膜中。