公开(公告)号：US06820328B2

公开(公告)日：2004-11-23

申请号：US10328337

申请日：2002-12-23

Applicant: Tina P. Barcley

Inventor： Tina P. Barcley

IPC: H05K330

CPC classification number: H05K1/0206 ,  H05K3/0061 ,  H05K3/429 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2201/0979 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method removes heat from a densely packed electronic assemblage. Densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the heat generating component by absorbing heat from the heat generating component.

公开(公告)号：US06809269B2

公开(公告)日：2004-10-26

申请号：US10322527

申请日：2002-12-19

Applicant: James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich

Inventor： James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich

IPC: H01R1204

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

公开(公告)号：US06797224B2

公开(公告)日：2004-09-28

申请号：US10026382

申请日：2001-12-20

Applicant: Jesse Pedigo ,  Timothy Meyer

Inventor： Jesse Pedigo ,  Timothy Meyer

IPC: B29C6708

CPC classification number: H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

Abstract: A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

Abstract translation: 填充系统包括加压填充源和压力填充头，其中填充头还包括加热元件，其被定位成传递热量以填充通过填充头的材料。 使用通过压力填充头的填充材料填充孔的方法包括以下步骤：使填充材料进入填充头，在填充头内部改变填充材料的粘度，并且使改性粘度填充材料 退出填充头并进入至少一个孔。

公开(公告)号：US20040134682A1

公开(公告)日：2004-07-15

申请号：US10751428

申请日：2004-01-06

Applicant: IBIDEN CO., LTD.

Inventor： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC: H05K001/00

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

Abstract translation: 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。

公开(公告)号：US20040107569A1

公开(公告)日：2004-06-10

申请号：US10313932

申请日：2002-12-05

Inventor： John Guzek ,  Hamid Azimi ,  Dustin Wood

IPC: H01L029/00 ,  H01L023/48

CPC classification number: H01L23/49827 ,  H01L23/142 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Apparatus and methods are provided for a rigid metal core carrier substrate. The metal core increases the modulus of elasticity of the carrier substrate to greater than 20 GPa to better resist bending loads and stresses encountered during assembly, testing and consumer handling. The carrier substrate negates the need to provide external stiffening members resulting in a microelectronic package of reduced size and complexity. The coefficient of thermal expansion of the carrier substrate can be adapted to more closely match that of the microelectronic die, providing a device more resistant to thermally-induced stresses. In one embodiment of the method in accordance with the invention, a metal sheet having a thickness in the range including 200-500 nullm and a flexural modulus of elasticity of at least 20 GPa is laminated on both sides with dielectric and conductive materials using standard processing technologies to create a carrier substrate.

Abstract translation: 提供了用于刚性金属芯载体衬底的装置和方法。 金属芯将载体基板的弹性模量增加到大于20GPa，以更好地抵抗组装，测试和消费者处理期间遇到的弯曲载荷和应力。 载体基板不需要提供外部加强构件，导致尺寸减小和复杂度降低的微电子封装。 载体衬底的热膨胀系数可以适应于更紧密地匹配微电子管芯的热膨胀系数，从而提供对热诱导应力更耐受的器件。 在根据本发明的方法的一个实施方案中，使用标准处理的电介质和导电材料将具有200-500μm厚度的厚度和至少20GPa的挠曲弹性模量的金属片层压在两侧上 创造载体基板的技术。

公开(公告)号：US06730859B2

公开(公告)日：2004-05-04

申请号：US09817947

申请日：2001-03-27

Applicant: Shigetsugu Muramatsu ,  Kazunari Imai

Inventor： Shigetsugu Muramatsu ,  Kazunari Imai

IPC: H01R1204

CPC classification number: H05K3/3447 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/4602 ,  H05K2201/092 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/1394 ,  Y10T29/49139

Abstract: A substrate for mounting an electronic part or parts thereon, which comprises a core substrate and at least a set of insulation layer and patterned wiring line layer, which is formed on the insulation layer, at at least one side of the core substrate, the core substrate having holes, in each of which a lead pin of the electronic part to be mounted is to be inserted, and being provided with lands which surround the opening of the hole and to which the lead pin inserted in the hole is to be bonded, wherein the insulation layer or layers at at least one side of the core substrate has bores, which expose the land at their bottoms, and communicate with the hole. A method of manufacturing such a substrate is also disclosed.

Abstract translation: 一种用于安装其上的电子部件的基板，其包括在所述芯基板的至少一侧上形成在所述绝缘层上的芯基板和至少一组绝缘层和图案化布线线层，所述芯 具有孔的基板，其中每个要安装的电子部件的引脚插入，并且设置有围绕孔的开口的焊盘，插入孔中的引脚与引脚抵接， 其中所述芯基板的至少一侧的所述绝缘层或多个孔具有孔，其在其底部暴露所述焊盘并与所述孔连通。 还公开了制造这种基板的方法。

公开(公告)号：US20040074669A1

公开(公告)日：2004-04-22

申请号：US10310803

申请日：2002-12-06

Inventor： Mitsunori Nagashima ,  Tomoyoshi Hiei

IPC: H05K001/11

CPC classification number: H05K3/3405 ,  H05K1/113 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/1028 ,  H05K2201/1034 ,  Y10T29/49165

Abstract: A circuit board comprises a board substrate including a substrate layer formed with a pad on an upper surface thereof, and a metal piece soldered on the pad. At least one through-hole including an internal wall formed with a conductive film is provided at a portion corresponding to the pad on the substrate layer. The through-hole is filled with a predetermined filler for closing at least an open mouth of the through-hole at the upper surface of the substrate layer. The pad is connected integrally with the conductive film on the internal wall of the through-hole.

Abstract translation: 一种电路板包括一个板基板，该基板包括一个在其上表面上形成有一个焊盘的基板层，以及一个焊接在焊盘上的金属片。 至少一个包括形成有导电膜的内壁的通孔设置在与衬底层上的衬垫相对应的部分。 填充有用于在基材层的上表面封闭通孔的至少一个开放口的预定填料。 衬垫与通孔内壁上的导电膜一体连接。

公开(公告)号：US06713792B2

公开(公告)日：2004-03-30

申请号：US10060563

申请日：2002-01-30

Applicant: Leendert J. van der Windt

Inventor： Leendert J. van der Windt

IPC: H01L2348

CPC classification number: H05K3/44 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0047 ,  H05K3/0061 ,  H05K3/429 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/09618 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175

Abstract: A method of manufacturing a printed circuit board through-hole connection includes forming a through-hole by removing material from the first side of the printed circuit board until the backing and then slightly into the first side of the backing providing a hole. Next, plating through the hole connecting the backing layer, ground layer, and signal layer. Now the plating of the signal layer is removed without removing the connection from the ground layer to the backing. Finally, the hole is filled from the first side of the printed circuit board. A method of manufacturing a MMIC printed circuit board through-hole connection includes forming a through-hole by removing material from the first side of the MMIC printed circuit board through the first signal layer, through the MMIC until the second signal layer, and then slightly into the top side of the second signal layer. Once the material is removed, an electrical connection is provided to the first signal layer, the MMIC and the second signal layer. A printed circuit board through-hole connection that includes an assembled layout of a printed circuit board and formed through holes by material removed from the first side of the printed circuit board up to the backing and then slightly into the top portion of the backing. It further includes plated through-holes that connect the backing, a ground layer and a signal layer, removed plating from the signal layer without the connection removed from the ground layer to the backing and filled through-holes from the first side with a non conductive filler.

Abstract translation: 制造印刷电路板通孔连接的方法包括通过从印刷电路板的第一侧去除材料形成通孔，直到背衬，然后略微进入背衬的第一侧，提供孔。 接下来，通过连接背衬层，接地层和信号层的孔进行电镀。 现在，消除信号层的电镀，而不需要从接地层到背衬的连接。 最后，从印刷电路板的第一侧填充孔。一种制造MMIC印刷电路板通孔连接的方法包括：通过从MMIC印刷电路板的第一面去除材料，形成通孔 第一个信号层，通过MMIC直到第二个信号层，然后稍微进入第二个信号层的顶端。 一旦材料被去除，就向第一信号层，MMIC和第二信号层提供电连接。一种印刷电路板通孔连接，其包括印刷电路板的组装布局并且通过被去除材料形成的孔 从印刷电路板的第一侧直到背衬，然后稍微进入背衬的顶部。 它还包括连接背衬，接地层和信号层的电镀通孔，从信号层移除镀层，而不将接地层从接地层移除到背衬，并从第一侧填充具有非导电性的通孔 填料。

公开(公告)号：US06703564B2

公开(公告)日：2004-03-09

申请号：US09812817

申请日：2001-03-21

Applicant: Shigeru Mori

Inventor： Shigeru Mori

IPC: H05K103

CPC classification number: H05K1/0271 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/0278 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/0959

Abstract: A printed wiring board is formed by a printed wiring substrate having a plurality of a wiring layer, and a thermal expansion buffering sheet having lower coefficient of thermal expansion than that of said printed wiring substrate, which is integrally laminated on a surface of the printed wiring substrate.

Abstract translation: 印刷布线板由具有多个布线层的印刷布线基板和热膨胀系数比所述印刷布线基板的热膨胀系数低的热膨胀缓冲片形成，该片材整体层压在印刷布线的表面上 基质。

公开(公告)号：US20030215567A1

公开(公告)日：2003-11-20

申请号：US10241459

申请日：2002-09-12

Applicant: SAN-EI KAGAKU CO., LTD.

Inventor： Kiyoshi Sato ,  Kazunori Kitamura

IPC: B05D005/12 ,  B05D007/22

CPC classification number: H05K3/0094 ,  C08F283/10 ,  C08F290/00 ,  C08F290/06 ,  C08F290/064 ,  C08L63/00 ,  C08L63/10 ,  G03F7/038 ,  H05K3/287 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  C08L2666/22

Abstract: A photo-setting and thermosetting resin composition comprises (I) a partial adduct of epoxy resin with unsaturated aliphatic acid, (II) (meth)acrylates, (III) a photocrosslinking agent, (IV) liquid epoxy resin, and (V) a latent curing agent. The resin composition can be easily charged and plugged into a through-hole, does not drip down, and can be effectively photo-set and thermoset. A photo-set product prepared of the resin composition can be easily polished. A plugged-through-hole printed wiring (substrate) board prepared of the resin composition does not cause defects such as hollows, cracks, blisters, peelings and so on, is excellent in solder-resistance, does not corrode a metal part, and can produce an appliance of high reliability and long life which does not occur short circuit and poor electrical connection.

Abstract translation: 光固性和热固性树脂组合物包含（I）环氧树脂与不饱和脂肪酸的部分加合物，（II）（甲基）丙烯酸酯，（III）光交联剂，（IV）液体环氧树脂和（V） 潜在固化剂。 树脂组合物可以容易地充填并堵塞到通孔中，不会滴落，并且可以有效地进行光固化和热固化。 可以容易地研磨由树脂组合物制备的光固化剂产品。 通过树脂组合物制成的通孔印刷布线（基板）板不会引起中空，裂纹，起泡，剥离等缺陷，耐焊接性优异，不会腐蚀金属部，能够 生产高可靠性，长寿命的电器，不会发生短路和电连接不良。