公开(公告)号：US20050233611A1

公开(公告)日：2005-10-20

申请号：US10921462

申请日：2004-08-19

Applicant: Kuang-Tao Sung ,  Jun-Hsian Lao

Inventor： Kuang-Tao Sung ,  Jun-Hsian Lao

IPC: H01R4/02 ,  G02F1/13 ,  G09F9/00 ,  H01R12/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

CPC classification number: G02F1/13452 ,  H01R12/61 ,  H05K1/147 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09918 ,  H05K2203/166

Abstract: A signal transmission device. The signal transmission device comprises a first and a second flexible printed circuit boards, connecting an display module and a system. The first flexible printed circuit board electrically connects the display module and the system. The second flexible printed circuit board electrically connects the display module and the first flexible printed circuit board, wherein the first and second flexible printed circuit boards are joined by hot bar soldering or anisotropic conductive film (ACF) bonding.

Abstract translation: 信号传输装置。 信号传输装置包括连接显示模块和系统的第一和第二柔性印刷电路板。 第一柔性印刷电路板电连接显示模块和系统。 第二柔性印刷电路板将显示模块和第一柔性印刷电路板电连接，其中第一和第二柔性印刷电路板通过热棒焊接或各向异性导电膜（ACF）接合连接。

公开(公告)号：US20050213806A1

公开(公告)日：2005-09-29

申请号：US10513058

申请日：2003-05-01

Applicant: Golan Hanina ,  Hanan Gino ,  Steffen Ruecker ,  Ido Ben-Tov

Inventor： Golan Hanina ,  Hanan Gino ,  Steffen Ruecker ,  Ido Ben-Tov

IPC: G03F7/20 ,  G03F9/00 ,  G06K9/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/0082 ,  G03F7/2051 ,  G03F9/00 ,  H05K1/0237 ,  H05K1/0269 ,  H05K3/0005 ,  H05K3/0008 ,  H05K2201/09918 ,  H05K2203/107

Abstract: A system and method for fabricating an electrical circuit in which a digital control image (46) is generated by non-uniformly modifying (44) a representation of an electrical circuit (40), such that an electrical circuit pattern (72) recorded on a substrate (12) using the digital control image (46) precisely fits an already formed electrical circuit portion (62).

Abstract translation: 一种用于制造电路的系统和方法，其中通过不均匀地修改（44）电路（40）的表示来产生数字控制图像（46），使得记录在电路（40）上的电路图案（72） 使用数字控制图像（46）的基板（12）精确地配合已经形成的电路部分（62）。

公开(公告)号：US20050201670A1

公开(公告)日：2005-09-15

申请号：US11124814

申请日：2005-05-09

Applicant: Kenji Uchiyama

Inventor： Kenji Uchiyama

IPC: G02F1/1345 ,  G02F1/13 ,  G09F9/00 ,  H01L21/60 ,  H05K1/02 ,  H05K3/32 ,  H05K3/36 ,  G02B6/12

CPC classification number: G02F1/13452 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/068 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate 6a having terminals 9 thereon is bonded to a wiring board 11 having output terminals 11c thereon through an ACF 20. The pitch P2 of the output terminals 11c is different from the pitch P1 of the terminals 9 taking into account deformation of the substrate 6a or the wiring board 11 during bonding. When the substrate 6a or the wiring board 11 deforms during the bonding, the both terminals are connected with the pitch P1′ of the terminals 9 and the pitch P2′ of the output terminals 11c becoming approximately equal to each other.

Abstract translation: 其上具有端子9的基板6a通过ACF 20与其上具有输出端子11c的布线板11接合。 输出端子11c的间距P 2考虑到接合期间基板6a或布线板11的变形，与端子9的间距P 1不同。 当接合时基板6a或布线基板11发生变形时，两端子与端子9的间距P 1'和输出端子11c的间距P 2'连接变得大致相等。

公开(公告)号：US06935232B2

公开(公告)日：2005-08-30

申请号：US10641082

申请日：2003-08-15

Applicant: Hiroaki Onishi ,  Toshinori Mimura ,  Naoichi Chikahisa ,  Ken Takahashi ,  Toshiyuki Murakami ,  Hitoshi Nakahira ,  Sadayuki Nagashima

Inventor： Hiroaki Onishi ,  Toshinori Mimura ,  Naoichi Chikahisa ,  Ken Takahashi ,  Toshiyuki Murakami ,  Hitoshi Nakahira ,  Sadayuki Nagashima

IPC: B41F15/46 ,  H05K1/02 ,  H05K3/00 ,  H05K3/12 ,  H05K3/26 ,  B05C17/06 ,  B05C17/08 ,  B41L13/00 ,  B41M1/12

CPC classification number: B41F15/46 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/26 ,  H05K2201/09918 ,  H05K2203/0139 ,  H05K2203/0278 ,  H05K2203/082 ,  H05K2203/163 ,  H05K2203/167

Abstract: When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

Abstract translation: 当焊膏在焊膏印刷期间通过位于加压构件和印刷掩模之间的第一间隙时，从加压构件向焊膏施加朝向印刷掩模的压力。

公开(公告)号：US06930255B2

公开(公告)日：2005-08-16

申请号：US10351501

申请日：2003-01-27

Applicant: Yoshinori Wakihara ,  Kazuhito Yamada

Inventor： Yoshinori Wakihara ,  Kazuhito Yamada

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34 ,  H05K3/38 ,  H05K3/46 ,  H05K1/00

CPC classification number: H05K3/108 ,  H05K1/0269 ,  H05K3/067 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4661 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T156/1056 ,  Y10T428/24917

Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

Abstract translation: 印刷电路板是通过在基板的导体电路上层叠层间绝缘层而形成的，其中导体电路由无电解电镀膜和电解电镀膜构成，并且在至少一部分上形成有粗糙层 导体电路的表面。

公开(公告)号：US20050138802A1

公开(公告)日：2005-06-30

申请号：US11071833

申请日：2005-03-03

Applicant: Darryl Gamel ,  Kreg Hines

Inventor： Darryl Gamel ,  Kreg Hines

IPC: H05K1/02 ,  H05K3/30 ,  H05K13/02

CPC classification number: H05K3/303 ,  H05K1/0269 ,  H05K13/022 ,  H05K2201/09918 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53022 ,  Y10T29/53052 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53261

Abstract: Apparatuses and methods are disclosed for determining the alignment of leads on components. Physical and/or superficial fiducial markers on components are used to distinguishes the alignment of leads on the component. The alignment of fiducial markers on the component are detected. A predetermined fiducial alignment is provided that corresponds to a predetermined lead alignment. The detected fiducial alignment is compared to a predetermined fiducial alignment to determine the lead alignment. When used in conjunction with a pick and place machine, the methods and apparatuses provide a means for verifying and correcting the lead alignment of components prior to placement and attachment to a substrate.

Abstract translation: 公开了用于确定部件上引线对准的装置和方法。 组件上的物理和/或表面基准标记用于区分组件上引线的对齐。 检测到元件上基准标记的对齐。 提供对应于预定引线对准的预定的基准对准。 将检测到的基准对准与预定的基准对准进行比较以确定引线对准。 当与拾取和放置机器一起使用时，所述方法和装置提供用于在放置和附接到基板之前验证和校正部件的引线对准的装置。

公开(公告)号：US06911620B2

公开(公告)日：2005-06-28

申请号：US10214755

申请日：2002-08-09

Applicant: Eliezer Lipman ,  Zvi Kotler ,  Yehiam Prior

Inventor： Eliezer Lipman ,  Zvi Kotler ,  Yehiam Prior

IPC: B23K26/04 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  B23K26/36

CPC classification number: H05K3/0035 ,  B23K26/042 ,  H05K1/0269 ,  H05K3/4638 ,  H05K2201/09918 ,  H05K2201/10151 ,  H05K2203/0207

Abstract: A system for unveiling embedded targets in printed circuit board substrates includes a micro-machining device, a sensor, and a controller. The micro-machining device removes portions of an opaque layer overlaying an alignment target in a general region in which the target should be located, and the sensor senses whether the alignment target is located at selected locations where portions of the opaque layer have been removed. In response to sensing the presence or absence of an alignment target at the selected locations, the controller directs the micro-machining device to remove additional portions of the opaque layer.

Abstract translation: 用于在印刷电路板基板上揭开嵌入式目标的系统包括微加工装置，传感器和控制器。 微加工装置移除在目标物应位于其中的一般区域中覆盖对准靶的不透明层的部分，并且传感器感测对准靶是否位于不透明层的部分被去除的选定位置。 响应于感测在所选位置处的对准目标的存在或不存在，控制器引导微加工装置去除不透明层的附加部分。

公开(公告)号：US06895661B1

公开(公告)日：2005-05-24

申请号：US09466521

申请日：1999-12-17

Applicant: Darryl Gamel ,  Kreg W. Hines

Inventor： Darryl Gamel ,  Kreg W. Hines

IPC: H05K1/02 ,  H05K3/30 ,  H05K13/02 ,  B23P19/00

CPC classification number: H05K3/303 ,  H05K1/0269 ,  H05K13/022 ,  H05K2201/09918 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53022 ,  Y10T29/53052 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53261

Abstract: A component transfer apparatus is provided. The component transfer apparatus comprises a pick and place machine having a component feed source and a movable pick head having access to the component feed source. A component alignment detector is directed toward the component feed source and a controller is coupled to the component alignment detector. The controller contains instructions which, when executed by the controller, cause the controller to compare the detected component alignment with a known component alignment.

Abstract translation: 提供了一种组件传送装置。 部件传送装置包括具有部件供给源的拾取和放置机器，以及具有进入部件供给源的可动拾取头。 部件对准检测器指向部件馈送源，并且控制器耦合到部件对准检测器。 控制器包含指令，当由控制器执行控制器时，控制器将检测到的组件对准与已知组件对齐进行比较。

公开(公告)号：US20050106775A1

公开(公告)日：2005-05-19

申请号：US10927072

申请日：2004-08-27

Applicant: Hironori Hasei

Inventor： Hironori Hasei

IPC: G02B5/20 ,  B05D5/12 ,  B05D7/00 ,  H01L21/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/46

CPC classification number: H05K1/0269 ,  H05K3/0008 ,  H05K3/125 ,  H05K3/4664 ,  H05K3/4679 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/013

Abstract: Exemplary embodiments of the present invention provide a pattern forming method that secures sufficient alignment accuracy when a pattern is formed by droplet ejection. Exemplary embodiments provide a pattern on a substrate by placing a liquid material including a pattern forming material onto the substrate by droplet ejection, including placement of the liquid material including an alignment mark forming material, onto the substrate by the droplet ejection prior to forming the pattern; and placement of the pattern forming material by making use of a placed alignment mark.

Abstract translation: 本发明的示例性实施例提供了当通过液滴喷射形成图案时确保足够的对准精度的图案形成方法。 示例性实施例通过在形成图案之前通过液滴喷射将包括图案形成材料的液体材料通过液滴喷射（包括将包括对准标记形成材料的液体材料包括对准标记形成材料）放置在基板上而通过液滴喷射而在衬底上提供图案 ; 以及通过使用放置的对准标记来放置图案形成材料。

公开(公告)号：US06878901B2

公开(公告)日：2005-04-12

申请号：US10850021

申请日：2004-05-19

Applicant: Morgan T. Johnson ,  William A. Miller

Inventor： Morgan T. Johnson ,  William A. Miller

IPC: B23K26/073 ,  B23K26/38 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/00 ,  H05K3/02 ,  B23K26/00 ,  B23K26/14

CPC classification number: B23K26/073 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0269 ,  H05K1/0393 ,  H05K1/165 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/027 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09918

Abstract: A unified process of making an electrical structure includes performing a plurality of laser etching operations on a workpiece, without removing the workpiece from a laser processing system. The workpiece includes a conductive material disposed on an electrically insulating substrate, and the plurality of laser etching operations include, but are not limited to, two or more of forming a fiducial, forming thick metal traces separated by high aspect ratio spaces, cutting an alignment hole, cutting a folding line, and singulating the electrical structure. In another aspect of the invention, a database is prepared, and communicatively coupled to the laser processing system to provide control signals that direct a portion of the plurality of operations of the laser processing system, wherein each plurality of etching operations is defined with respect to a common coordinate system.

Abstract translation: 制造电气结构的统一过程包括在工件上执行多个激光蚀刻操作，而不从激光处理系统移除工件。 工件包括设置在电绝缘基板上的导电材料，并且多个激光蚀刻操作包括但不限于形成基准，形成由高纵横比空间分开的厚金属迹线的两个或更多个，切割对准 孔，切割折叠线，并分割电气结构。 在本发明的另一方面中，准备数据库，并且通信地耦合到激光处理系统以提供控制信号，该控制信号指导激光处理系统的多个操作的一部分，其中对于多个蚀刻操作相对于 一个共同的坐标系。