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    FLEXIBLE SUBSTRATE AND ELECTRIC CIRCUIT STRUCTURE
    122.
    发明申请
    FLEXIBLE SUBSTRATE AND ELECTRIC CIRCUIT STRUCTURE 有权
    柔性基板和电路结构

    公开(公告)号：US20110139493A1

    公开(公告)日：2011-06-16

    申请号：US13058268

    申请日：2009-08-03

    Applicant: Yukihiro Sumida ,  Takeshi Muraoka

    Inventor： Yukihiro Sumida ,  Takeshi Muraoka

    IPC: H05K1/00

    CPC classification number: H05K3/361 ,  G02F1/13452 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/09936

    Abstract: Provided is a flexible substrate wherein a connection portion between the flexible substrate and an electric circuit board meets requirements of narrow wiring pitch and low resistance at the connection portion. An electric circuit structure, which has the flexible substrate and the electric circuit board to which the flexible substrate is connected, is also provided. A wiring pattern (22) is formed on a flexible base film (21), a connection terminal (25) connected electrically to an electrode terminal of another electric circuit board is arranged at an end portion of the wiring pattern (22), and the connection terminal (25) includes wide connection terminals (25b, 25c) having a terminal width extending across plural lines of the wiring pattern (22).

    Abstract translation: 提供了柔性基板，其中柔性基板和电路板之间的连接部分满足连接部分处的窄布线间距和低电阻的要求。 还提供了具有柔性基板和连接柔性基板的电路板的电路结构。 布线图案（22）形成在柔性基膜（21）上，与布线图案（22）的端部配置有与电极基板的电极端子电连接的连接端子（25） 连接端子（25）包括具有延伸穿过布线图案（22）的多条线的端子宽度的宽连接端子（25b，25c）。

    Substrate strip and substrate structure and method for manufacturing the same
    124.
    发明授权
    Substrate strip and substrate structure and method for manufacturing the same 有权
    基板条和基板结构及其制造方法

    公开(公告)号：US07795722B2

    公开(公告)日：2010-09-14

    申请号：US11617138

    申请日：2006-12-28

    Applicant: Shu-Luan Chan ,  Chi-Chih Huang ,  Shuo-Hsun Chang

    Inventor： Shu-Luan Chan ,  Chi-Chih Huang ,  Shuo-Hsun Chang

    IPC: H01L23/053

    CPC classification number: H05K1/0266 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09927 ,  H05K2201/09936

    Abstract: A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask. The core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed on the surface dielectric layer. The surface circuit layer is electrically connected to the circuit pattern. The solder mask is disposed on the interconnection portion; herein the solder mask includes a hole to identify the substrate structure. Besides, a method for manufacturing the substrate structure is disclosed.

    Abstract translation: 公开了一种衬底结构。 基板结构包括芯基板，互连部分和焊接掩模。 核心基板包括顶表面和与顶表面相对的底表面。 电路图案设置在顶表面上。 互连部分设置在顶表面上; 这里的互连部分包括表面电介质层和设置在表面电介质层上的表面电路层。 表面电路层电连接到电路图案。 焊接掩模设置在互连部分上; 这里，焊料掩模包括用于识别衬底结构的孔。 此外，公开了一种用于制造衬底结构的方法。

    LABEL ASSEMBLY AND CIRCUIT BOARD USING THE SAME
    125.
    发明申请
    LABEL ASSEMBLY AND CIRCUIT BOARD USING THE SAME 失效
    标签组件和电路板使用相同

    公开(公告)号：US20100181103A1

    公开(公告)日：2010-07-22

    申请号：US12409527

    申请日：2009-03-24

    Applicant: Lei Liu ,  Zheng-Heng Sun

    Inventor： Lei Liu ,  Zheng-Heng Sun

    IPC: H05K1/11 ,  B32B3/06 ,  H05K1/00

    CPC classification number: G09F3/0297 ,  G09F3/12 ,  H05K1/0266 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10204 ,  H05K2201/10598 ,  Y10T428/24008

    Abstract: A label assembly includes a support and a label body. The label body is configured to allow a label to be attached thereto. The support includes an upright post, and a fixing portion formed at a distal end of the post opposite to the label body. The fixing portion is configured to removably attach the label assembly to a circuit board. A circuit board supporting the label assembly is further provided.

    Abstract translation: 标签组件包括支撑件和标签主体。 标签主体被配置为允许附加标签。 支撑件包括立柱，和形成在与标签体相对的柱的远端处的固定部。 固定部分构造成将标签组件可移除地附接到电路板。 还提供了支撑标签组件的电路板。

    Cable connector with signal type indicator
    126.
    发明授权
    Cable connector with signal type indicator 失效
    带信号类型指示器的电缆连接器

    公开(公告)号：US07752788B1

    公开(公告)日：2010-07-13

    申请号：US12479865

    申请日：2009-06-08

    Applicant: Zheng-Heng Sun

    Inventor： Zheng-Heng Sun

    IPC: H01R3/00

    CPC classification number: H01R13/465 ,  H01R12/716 ,  H05K1/0266 ,  H05K2201/09936 ,  H05K2201/10189 ,  H05K2201/10356

    Abstract: A cable connector includes a base formed on a circuit board, a plurality of pins extending from the base and electrically connected to the circuit board, and a signal type indicator. A plurality of through holes is defined in the signal type indicator to receive the pins, and an emblem is arranged on the signal type indicator to indicate the signal type of the cable connector. The diameter of each through hole is greater than the diameter of each pin so that the pins can pass through the through holes of the signal type indicator for mounting the signal type indicator on the base.

    Abstract translation: 电缆连接器包括形成在电路板上的基座，从基座延伸并电连接到电路板的多个引脚和信号型指示器。 在信号型指示器中限定多个通孔以接收引脚，并且在信号类型指示器上布置标志以指示电缆连接器的信号类型。 每个通孔的直径大于每个销的直径，使得销可以穿过信号类型指示器的通孔，以将信号类型指示器安装在基座上。

    SEMICONDUCTOR PACKAGE CIRCUIT BOARD AND METHOD OF FORMING THE SAME
    128.
    发明申请
    SEMICONDUCTOR PACKAGE CIRCUIT BOARD AND METHOD OF FORMING THE SAME 审中-公开
    半导体封装电路板及其形成方法

    公开(公告)号：US20090126979A1

    公开(公告)日：2009-05-21

    申请号：US12270591

    申请日：2008-11-13

    Applicant: Ka-Eun CHAE ,  Wang-Jae LEE ,  Yong-Jin JUNG ,  Kun-Ho SONG

    Inventor： Ka-Eun CHAE ,  Wang-Jae LEE ,  Yong-Jin JUNG ,  Kun-Ho SONG

    IPC: H05K1/02 ,  H05K3/00 ,  G02B5/12

    CPC classification number: H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10204 ,  Y10T29/49124

    Abstract: A semiconductor package circuit board has an indicator for specifying a location of a defective circuit board unit. The semiconductor package circuit board includes circuit board units arranged in an m-by-n matrix pattern. The indicator has marking areas arranged in an m-by-n matrix pattern so that the marking areas are marked in correspondence to locations of identified defective circuit board units of the circuit board units. An operator can readily put a defective mark on the indicator without any confusion. The operator or a sensor can readily recognize the defective mark. Since the indicator can be formed on the circuit board unit, the integration of the semiconductor package circuit board can be increased, and the productivity can be substantially improved. Furthermore, a pathway of the sensor can be reduced, and interferences that might occur if the sensor moves can be hindered.

    Abstract translation: 半导体封装电路板具有用于指定有缺陷的电路板单元的位置的指示器。 半导体封装电路板包括以逐个矩阵图案排列的电路板单元。 指示器具有以逐一矩阵图案排列的标记区域，使得标记区域对应于电路板单元的识别的有缺陷的电路板单元的位置被标记。 操作员可以很容易地在指示器上放置有缺陷的标记，而不会有任何混淆。 操作员或传感器可以容易地识别缺陷标记。 由于可以在电路板单元上形成指示器，因此可以提高半导体封装电路板的集成度，并且可以显着提高生产率。 此外，可以减小传感器的路径，并且如果传感器移动可能会发生干扰。

    RECONFIGURABLE CONTROL PANEL
    129.
    发明申请
    RECONFIGURABLE CONTROL PANEL 有权
    可重构控制面板

    公开(公告)号：US20080037232A1

    公开(公告)日：2008-02-14

    申请号：US11836671

    申请日：2007-08-09

    Applicant: Jamie D. Schroetlin

    Inventor： Jamie D. Schroetlin

    IPC: H05K1/16 ,  A47J31/00 ,  H05K7/00

    CPC classification number: A47J31/52 ,  H05K1/029 ,  H05K3/281 ,  H05K2201/09936 ,  H05K2201/10053 ,  H05K2201/10098 ,  H05K2201/10106

    Abstract: A control panel for use with a beverage brewing device is provided. The control panel includes a circuit board and connector assembly in combination with a least one overlay. The circuit board, board includes at least one and commonly a plurality of devices which may include switches and lights. A plurality of overlays are configured for use with control areas. The control areas are analogous to switch controls or light areas which are provided on the circuit board. The overlays may have but are not required to have a one-to-one correspondence with the components on the circuit board. The multiple overlays in combination with a single circuit board allows for a many-to-one combination of overlays to circuit board. Additionally, the circuit board may be programmed to activate or deactivate selected components so that components underlying an overlay without a corresponding control area cannot be activated. Reprogramming may be done in a variety of situation and may be provided in a self programmable configuration which may include, but is not limited to and RFID device carried on at least one of the circuit board and overlay.

    Abstract translation: 提供了一种用于饮料冲泡装置的控制面板。 控制面板包括与至少一个覆盖层组合的电路板和连接器组件。 电路板，板包括至少一个且通常多个可包括开关和灯的装置。 多个叠层被配置为与控制区一起使用。 控制区域类似于电路板上提供的开关控制或亮区。 覆盖层可以具有但不需要与电路板上的部件一一对应。 与单个电路板组合的多重覆盖允许与电路板的多重叠加组合。 此外，电路板可以被编程为激活或去激活所选择的组件，使得不具有相应控制区域的覆盖层下方的组件不能被激活。 可以在各种情况下进行重新编程，并且可以以自编程配置来提供，其可以包括但不限于携带在电路板和覆盖层中的至少一个上的RFID设备。

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