公开(公告)号：US11824260B2

公开(公告)日：2023-11-21

申请号：US16972111

申请日：2019-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sewoong Kim ,  Chaeup Yoo ,  Sumin Yun ,  Woosuk Kang ,  Inyoung Lee

IPC: H01Q1/38 ,  H01Q1/24 ,  H05K1/02 ,  H05K5/00 ,  H05K7/14

CPC classification number: H01Q1/38 ,  H01Q1/24 ,  H05K1/02 ,  H05K1/0243 ,  H05K5/00 ,  H05K5/0017 ,  H05K5/0086 ,  H05K7/14 ,  H05K7/1427 ,  H05K2201/10037

Abstract: According to an embodiment, an electronic device may include a display including a first conductive plate, a printed circuit board interposed between a rear surface of housing and the display and including a second conductive plate, a first conductive pattern and a second conductive pattern that are interposed between the display and the printed circuit board, a wireless communication circuit electrically connected to the first conductive pattern and transmitting or receiving an RF signal of a first frequency or an RF signal of a second frequency, and at least one processor electrically connected to the wireless communication circuit. Besides, various embodiments as understood from the specification are also possible.

公开(公告)号：US20230262897A1

公开(公告)日：2023-08-17

申请号：US18109750

申请日：2023-02-14

Applicant: BLACK & DECKER INC.

Inventor： Michael SIKORA ,  Abraham LOZIER ,  Craig ARMACOST

IPC: H05K1/14 ,  H01M50/204 ,  H01M10/42 ,  H01M50/284

CPC classification number: H05K1/144 ,  H01M50/204 ,  H01M10/425 ,  H01M50/284 ,  H05K2201/042 ,  H05K2201/10037 ,  H01M2010/4271

Abstract: A battery pack including a first printed circuit board, a second printed circuit board, and a PCB spacer, the PCB spacer including a housing and at least two board-to-board terminals, the PCB spacer housing injection molded around the board-to-board terminals, wherein the first printed circuit board coupled to a first side of the PCB spacer and the second printed circuit board coupled to a second side of the PCB spacer, the first side of the PCB spacer being opposed to the second side of the PCB spacer.

公开(公告)号：US20230224394A1

公开(公告)日：2023-07-13

申请号：US17794218

申请日：2021-08-30

Applicant: HONOR DEVICE CO., LTD.

Inventor： Bin YAN ,  Kangle XUE ,  Xiulan LIU ,  Jiuliang GAO

IPC: H04M1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11

CPC classification number: H04M1/0277 ,  H04M1/0262 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10037 ,  H05K2201/10128

Abstract: An electronic device includes a middle frame, a first flexible printed circuit FPC, a second FPC and a battery. Projections of the first FPC and the second FPC on the middle frame have a first overlapping region. The first overlapping region is located inside a projection of the battery on the middle frame and is far away from an edge of the battery. A first through hole is disposed on the middle frame. The first overlapping region is located in the first through hole. The electronic device provided in this application can implement reduction of an overall thickness, so that the electronic device provides better user experience.

公开(公告)号：US11700693B2

公开(公告)日：2023-07-11

申请号：US17716009

申请日：2022-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong Woo ,  Jungchul An ,  Seungki Choi

IPC: H05K1/14 ,  H01R12/79 ,  H01R12/77 ,  H05K5/02 ,  H05K5/00 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/147 ,  H01R12/777 ,  H01R12/79 ,  H05K1/0281 ,  H05K1/118 ,  H05K5/0017 ,  H05K5/0086 ,  H05K5/0226 ,  H05K2201/10037 ,  H05K2201/10128

Abstract: According to an embodiment, it is possible to provide an electronic device including: a housing; a first printed circuit board disposed in the housing; a second printed circuit board disposed in the housing and spaced apart from the first printed circuit board; a first flexible printed circuit board electrically connecting the first printed circuit board and the second printed circuit board; and a second flexible printed circuit board electrically connecting the first printed circuit board and the second printed circuit board, in which the second flexible printed circuit board may be longer than the first flexible printed circuit board. Other embodiments are also disclosed.

公开(公告)号：US20230141357A1

公开(公告)日：2023-05-11

申请号：US18083033

申请日：2022-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gidae KIM

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/145 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10325 ,  H05K2201/10446

Abstract: An electronic device includes a first printed circuit board; a second printed circuit board spaced apart from the first printed circuit board; a connection member electrically connecting the first printed circuit board and the second printed circuit board, the connection member including a first connection part connected to the first printed circuit board and a second connection part connected to the second printed circuit board; and a first intermediate member including: a first connector provided on a first surface of the first intermediate member facing the first printed circuit board and electrically connected to the first printed circuit board; and a second connector provided on a second surface of the first intermediate member opposite to the first surface and electrically connected to the connection member and the first connector, wherein the first connector and the second connector are separated from each other in a first direction.

公开(公告)号：US20190044197A1

公开(公告)日：2019-02-07

申请号：US16048554

申请日：2018-07-30

Applicant: Yazaki Corporation

Inventor： Takao OTA ,  Kazuya HARAKAWA

IPC: H01M10/48 ,  H01R12/59 ,  H01R12/69 ,  H05K1/02 ,  H05K1/18 ,  H01M10/42

CPC classification number: H01M10/482 ,  H01M2/206 ,  H01M10/425 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01R4/30 ,  H01R11/288 ,  H01R12/592 ,  H01R12/69 ,  H05K1/0263 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/052 ,  H05K2201/10037 ,  H05K2201/10181 ,  H05K2201/10272

Abstract: A conductor module includes a wiring member, a plurality of bus bars, and a plurality of locking pieces. The wiring member is formed in a film shape with flexibility, and a plurality of wirings and through-holes are formed therein. The bus bar is electrically connected to one of two electrode terminals. The two through-holes are formed in a first opposing region opposing one end face between both end faces of the bus bar opposing each other in a width direction of the bus bar with an electrical connection portion where the bus bar and the wiring are electrically connected interposed therebetween when viewed from the width direction. The locking piece is formed integrally with the bus bar, is arranged in the through-hole, has a distal end positioned radially outward of the through-hole when viewed from an axial direction of the through-hole, and fixes the bus bar to the wiring member.

公开(公告)号：US20180270943A1

公开(公告)日：2018-09-20

申请号：US15695991

申请日：2017-09-05

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Akitoshi SUZUKI ,  Yoshiharu MATSUDA ,  Kazuhiro YOSHIDA

IPC: H05K1/02 ,  H05K1/18 ,  H05K5/00

CPC classification number: H05K1/0203 ,  G06F1/187 ,  G06F1/20 ,  H05K1/18 ,  H05K5/0008 ,  H05K2201/10015 ,  H05K2201/10037

Abstract: An electronic apparatus includes a top plate, a bottom plate provided under the top plate, a circuit board provided between the top plate and the bottom plate, an electronic component disposed on the circuit board, and an intermediate plate provided between the top plate and the circuit board. The intermediate plate is configured to provide a clearance between the top plate and intermediate plate, or between the circuit board and the intermediate plate. The intermediate plate is further configured to allow an air flow from a first end portion to a second end portion of the top plate.

公开(公告)号：US20180269371A1

公开(公告)日：2018-09-20

申请号：US15761485

申请日：2016-09-07

Applicant: Siemens Aktiengesellschaft

Inventor： Martin Franke ,  Peter Frühauf ,  Rüdiger Knofe ,  Bernd Müller ,  Stefan Nerreter ,  Michael Niedermayer ,  Ulrich Wittreich ,  Manfred Zäske

IPC: H01L35/30 ,  H02H5/04 ,  H05K1/02 ,  F04D33/00 ,  F04D25/06

CPC classification number: H01L35/30 ,  F04D25/06 ,  F04D33/00 ,  H01L23/38 ,  H01L23/467 ,  H01L35/28 ,  H02H5/04 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10219

Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.

公开(公告)号：US20180242454A1

公开(公告)日：2018-08-23

申请号：US15900031

申请日：2018-02-20

Applicant: LG CHEM, LTD.

Inventor： Jin Oh Yang ,  Suk Jin Song ,  Young Su Son ,  Jae Young Jang

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/18 ,  H05K1/0204 ,  H05K1/111 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10901

Abstract: The present disclosure relates to a printed circuit board connected to a battery, and more particularly, to a printed circuit board having an improved structure connected to an electrode led out from a battery.

公开(公告)号：US20180236368A1

公开(公告)日：2018-08-23

申请号：US15886884

申请日：2018-02-02

Applicant: Yu-Wei CHEN

Inventor： Yu-Wei CHEN ,  Lin-Yu KAO

IPC: A63H33/04 ,  H05K1/14 ,  H05K1/18 ,  H02J50/10 ,  H05K1/11 ,  A63H33/08 ,  G09B23/18

CPC classification number: A63H33/042 ,  A63H33/08 ,  A63H33/086 ,  G09B23/185 ,  H02J50/10 ,  H05K1/115 ,  H05K1/144 ,  H05K1/18 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/1056

Abstract: An electronic building block set with a metal layer on the outer surface of each building block includes a main and an auxiliary building block. The top of the main building block includes plural main hollow posts, each with a main sensing contact, and has a main metal layer on the outer surface. The main sensing contacts and the main metal layer are electrically connected to opposite-polarity main electrode circuits respectively. The bottom of the auxiliary building block includes a first sensing element and has an auxiliary metal layer on the outer surface. The first sensing element and the auxiliary metal layer are electrically connected to opposite-polarity auxiliary electrode circuits respectively. When the building blocks are engaged, the first sensing element is electrically connected to the corresponding main sensing contact, and the auxiliary metal layer, to the main metal layer to enable electricity or signal transmission between the building blocks.