公开(公告)号：US09478960B2

公开(公告)日：2016-10-25

申请号：US14540138

申请日：2014-11-13

Applicant: Sercomm Corporation

Inventor： Chin-Chang Chiang ,  Chin-Liang Wang

IPC: H05K7/02 ,  H02G3/30 ,  H05K3/34 ,  H05K5/00 ,  H05K5/02 ,  H02G3/10

CPC classification number: H02G3/30 ,  H02G3/10 ,  H05K3/3447 ,  H05K5/0017 ,  H05K5/0204 ,  H05K5/0247 ,  H05K7/02 ,  H05K2201/10386 ,  H05K2201/10393 ,  H05K2201/10863

Abstract: A mounting plate and a security device using the same are provided. The mounting plate is for being fixed to a surface, wherein a mounting device is hanged up on the mounting plate, and the mounting plate comprises a first conductive sheet and a second conductive sheet electrically connected to a first electrode of an exterior power and a second electrode of the exterior power respectively. When the mounting device is hanged up on the mounting plate, the exterior power is electrically connected to the mounting device through the first conductive sheet and the second conductive sheet.

Abstract translation: 提供安装板和使用其的安全装置。 安装板用于固定到表面，其中安装装置悬挂在安装板上，并且安装板包括电连接到外部电源的第一电极的第一导电片和第二导电片，第二导电片 电源的外部电源。 当安装装置悬挂在安装板上时，外部电源通过第一导电片和第二导电片与安装装置电连接。

公开(公告)号：US09453978B2

公开(公告)日：2016-09-27

申请号：US14293548

申请日：2014-06-02

Applicant: FUJIKURA LTD.

Inventor： Takayuki Tanaka ,  Sawako Yamai ,  Osamu Kikuchi ,  Susumu Okabe

IPC: G02B6/42 ,  G02B6/43 ,  H05K1/02 ,  H05K1/14

CPC classification number: G02B6/4292 ,  G02B6/42 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4284 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/10393 ,  H05K2201/10598

Abstract: An optical module includes: a transparent substrate through which light can pass; a photoelectric conversion element mounted on the transparent substrate and emitting light toward the transparent substrate or receiving light having passed through the transparent substrate; and a support member supporting an optical fiber for transmitting light, the support member and the transparent substrate forming an optical path between the photoelectric conversion element and the optical fiber. A positioning hole is formed in the transparent substrate. A positioning pin having a tapered surface is formed on the support member. The transparent substrate and the support member are positioned with respect to one another by inserting the positioning pin into the positioning hole along the optical axis direction of light between the transparent substrate and the support member and by making the tapered surface of the positioning pin contact the edge of the positioning hole without leaving any space therebetween.

Abstract translation: 光学模块包括：光可通过的透明基板; 安装在透明基板上的光电转换元件，朝向透明基板发射光，或接收透过透明基板的光; 以及支撑部件，其支撑用于透光的光纤，所述支撑部件和所述透明基板在所述光电转换元件与所述光纤之间形成光路。 在透明基板中形成定位孔。 具有锥形表面的定位销形成在支撑构件上。 通过将透明基板和支撑部件之间的光轴方向的定位销插入定位孔，并且通过使定位销的锥形表面接触定位销，透明基板和支撑部件相对于彼此定位 定位孔的边缘，而不在其间留下任何空间。

公开(公告)号：US09332627B2

公开(公告)日：2016-05-03

申请号：US13958628

申请日：2013-08-05

Applicant: Jia-Yu Hung ,  Chang-Yuan Wu ,  I-Feng Hsu ,  Ting-Wei Hsu

Inventor： Jia-Yu Hung ,  Chang-Yuan Wu ,  I-Feng Hsu ,  Ting-Wei Hsu

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/367 ,  H01L23/473 ,  H01L23/40 ,  H01L23/427

CPC classification number: H05K1/0203 ,  H01L23/367 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K2201/10393 ,  H01L2924/00

Abstract: A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.

Abstract translation: 提供了一种适于从布置在电路板上的加热元件去除热量的散热模块。 散热模块包括导热结构，粘合剂层和弹性构件。 导热结构适于设置在加热元件上。 粘合剂层适合于布置在电路板上并与加热元件相邻。 弹性部件通过粘合剂层胶合到电路板上，并且弹性部件施加力以使导热结构附着到加热元件。

公开(公告)号：US09125313B2

公开(公告)日：2015-09-01

申请号：US14548805

申请日：2014-11-20

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H01R12/70 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20140060894A1

公开(公告)日：2014-03-06

申请号：US13726544

申请日：2012-12-25

Applicant: CHAMP TECH OPTICAL (FOSHAN) CORPORATION ,  FOXCONN TECHNOLOGY CO., LTD.

Inventor： MING-WEI CHEN ,  JING ZHANG ,  TAO LI

IPC: F16B2/24 ,  H05K1/02

CPC classification number: F16B2/248 ,  F16B5/02 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/10393 ,  H05K2201/10409 ,  Y10T24/4406 ,  H01L2924/00

Abstract: An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes two wire clips and two fasteners engaging with the wire clips, respectively. The wire clip includes two opposite engaging arms, and an engaging section interconnecting the two engaging arms. Each engaging arm includes a connecting section extending outwardly from the engaging section, and a hook bent outwardly from a free end of the connecting section. The hooks of each wire clip are hooked in the heat sink, each fastener extends through the engaging section of the corresponding wire clip, the engaging section of the wire clip is resiliently pressed by the fastener, and the heat sink is pressed downwardly by the connecting section of the wire clip.

Abstract translation: 示例性的散热装置包括散热器和跨过散热器的夹子组件。 夹子组件分别包括两个线夹和两个与线夹相配合的紧固件。 线夹包括两个相对的接合臂，以及将两个接合臂互连的接合部。 每个接合臂包括从接合部分向外延伸的连接部分和从连接部分的自由端向外弯曲的钩子。 每个线夹的钩钩在散热器中，每个紧固件延伸穿过相应线夹的接合部分，线夹的接合部分被紧固件弹性压制，并且散热器被连接 线夹的一部分。

公开(公告)号：US20130201701A1

公开(公告)日：2013-08-08

申请号：US13365801

申请日：2012-02-03

Applicant: Christopher George Daily ,  Matthew Edward Mostoller ,  Ronald Martin Weber

Inventor： Christopher George Daily ,  Matthew Edward Mostoller ,  Ronald Martin Weber

IPC: F21V21/08

CPC classification number: F21V19/004 ,  F21V19/0055 ,  F21Y2115/10 ,  H05K3/0061 ,  H05K2201/10393

Abstract: A socket assembly includes a light emitting diode (LED) package having an LED printed circuit board (PCB) with an LED mounted thereto. The socket assembly also includes a clamp for holding the LED package to a support structure. The clamp includes a base that is configured to be mounted to the support structure such that the base engages the support structure. The clamp also includes a spring finger that extends from the base such that the base and the spring finger define a unitary body of the clamp. The spring finger is configured to engage the LED PCB of the LED package and apply a clamping force to the LED PCB that acts in a direction toward the support structure.

Abstract translation: 插座组件包括具有安装有LED的LED印刷电路板（PCB）的发光二极管（LED）封装。 插座组件还包括用于将LED封装保持到支撑结构的夹具。 夹具包括被构造成安装到支撑结构的基部，使得基部接合支撑结构。 夹具还包括从基部延伸的弹簧指，使得基部和弹簧手指限定夹具的整体。 弹簧手指配置成接合LED封装的LED PCB，并向朝向支撑结构的方向作用的LED PCB施加夹紧力。

公开(公告)号：US08450620B2

公开(公告)日：2013-05-28

申请号：US13050599

申请日：2011-03-17

Applicant: You-Hua Cai

Inventor： You-Hua Cai

IPC: H05K1/16 ,  H01R12/72

CPC classification number: H01R12/721 ,  H01R4/027 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/1034 ,  H05K2201/10393

Abstract: An electronic assembly is provided, which includes a circuit board, in which a solder pad is disposed at a position close to an end edge on at least one surface of the circuit board, and a depression is disposed between the solder pad and the end edge; and, an electronic element, including an insulating body and a plurality of terminals fixed to the insulating body, in which each of the terminals has a protruding portion and a soldering portion respectively corresponding to the depression and the solder pad. A method for manufacturing the electronic assembly is also provided.

Abstract translation: 提供了一种电子组件，其包括电路板，其中焊盘设置在靠近电路板的至少一个表面上的端边缘的位置处，并且凹陷设置在焊盘和端边缘之间 ; 以及电子元件，其包括绝缘体和固定到所述绝缘体的多个端子，其中每个所述端子具有分别对应于所述凹陷部的所述突出部分和焊接部分以及所述焊盘。 还提供了一种用于制造电子组件的方法。

公开(公告)号：US08416579B2

公开(公告)日：2013-04-09

申请号：US12532434

申请日：2008-03-26

Applicant: Mark Biesheuvel ,  Martijn Krans ,  Rabin Bhattacharya

Inventor： Mark Biesheuvel ,  Martijn Krans ,  Rabin Bhattacharya

IPC: H05K7/02 ,  H05K7/04

CPC classification number: H01R12/613 ,  A41D1/002 ,  H01R4/06 ,  H01R4/58 ,  H05K1/00 ,  H05K1/038 ,  H05K1/189 ,  H05K3/325 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10393 ,  Y10T29/49002

Abstract: An electronic assembly (20; 30; 40; 50) for attachment to a fabric substrate (60; 82, 102) having a conductor pattern (62a-b; 85a-b; 107a-c) on a first side (63; 86; 108) thereof. The electronic assembly comprises an electronic device (23; 42; 64), and at least a first clamping member (21; 41; 65). The electronic assembly is, furthermore, adapted to clamp the electronic device (23; 42; 64) to the first side (63; 86; 108) of the fabric substrate (60; 82, 102) in such a way that the electronic device (23; 42; 64) is electrically connected to the conductor pattern (62a-b; 85a-b; 107a-c).

Abstract translation: 一个电子组件（20; 30; 40; 50），用于连接到在第一侧（63; 86）上具有导体图案（62a-b; 85a-b; 107a-c）的织物衬底（60; ; 108）。 电子组件包括电子设备（23; 42; 64）和至少第一夹紧构件（21; 41; 65）。 此外，电子组件适于将电子设备（23; 42; 64）夹紧到织物基底（60; 82,102）的第一侧（63; 86; 108）上，使得电子设备 （23; 42; 64）电连接到导体图案（62a-b; 85a-b; 107a-c）。

公开(公告)号：US08385082B2

公开(公告)日：2013-02-26

申请号：US12849820

申请日：2010-08-04

Applicant: Yen-Chih Chang ,  Ke-Hao Chen

Inventor： Yen-Chih Chang ,  Ke-Hao Chen

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K7/1069 ,  H01R12/7082 ,  H01R12/714 ,  H05K3/308 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10704

Abstract: An electrical connection arrangement includes an IC package, and a PCB having a plurality of receiving holes for receiving a plurality of contacts therein. The contact having a contacting portion engaged with the IC package that seated upon the PCB. A retaining device is provided for securing the IC package onto the PCB. Since there is no socket utilized in the present invention, the total profile of the arrangement and the cost are effectively reduced.

Abstract translation: 电连接装置包括IC封装和具有用于在其中接收多个触点的多个接收孔的PCB。 接触件具有与安装在PCB上的IC封装相接合的接触部分。 提供保持装置用于将IC封装固定到PCB上。 由于在本发明中没有使用插座，所以可以有效地减少布置的总体轮廓和成本。

公开(公告)号：US08379390B2

公开(公告)日：2013-02-19

申请号：US12869843

申请日：2010-08-27

Applicant: Yoshihiko Inoue

Inventor： Yoshihiko Inoue

IPC: H05K7/20

CPC classification number: H01L23/552 ,  H01L23/3675 ,  H01L23/4006 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/167 ,  H05K1/0203 ,  H05K9/0026 ,  H05K2201/10371 ,  H05K2201/10393

Abstract: A package substrate includes a circuit board, an electronic component, an electromagnetic shield cover, and a heat conducting member. The electronic component is disposed on the circuit board. The electromagnetic shield cover is fixedly coupled to the circuit board. The electromagnetic shield cover houses the electronic component within an inside space defined between the electromagnetic shield cover and the circuit board. The heat conducting member is disposed between the electronic component and the electromagnetic shield cover within the inside space. The heat conducting member contacts both of the electronic component and the electromagnetic shield cover such that the heat conducting member establishes a thermal connection between the electronic component and the electromagnetic shield cover.

Abstract translation: 封装基板包括电路板，电子部件，电磁屏蔽罩和导热部件。 电子部件设置在电路板上。 电磁屏蔽罩固定在电路板上。 电磁屏蔽罩将电子部件容纳在电磁屏蔽罩和电路板之间限定的内部空间内。 导热构件设置在内部空间内的电子部件和电磁屏蔽罩之间。 导热构件接触电子部件和电磁屏蔽罩两者，使得导热构件在电子部件和电磁屏蔽罩之间建立热连接。