Printed circuit board vibration stiffener
    121.
    发明授权
    Printed circuit board vibration stiffener 失效
    印刷电路板振动加强筋

    公开(公告)号:US5136470A

    公开(公告)日:1992-08-04

    申请号:US546329

    申请日:1990-06-29

    Abstract: A stiffener in the form of a metal-cored stiffener plate is temporarily secured to the underside of a printed circuit (PC) board having a series of integrated circuit (IC) chips and other electronic components and metallization interconnect traces on the upper or top surface of the board. Securing of the stiffening plate and PC board is provided by segments of a hook/mushrooms-containing flexible tape adhered to the PC board underside by suitable adhesive. A complementary sheet of a hooks-containing flexible material is adhered to the stiffening plate such that upon pressing of the complementary material and segments together the respective hooks and loops interlock binding the PC board assembly and stiffening plate assembly together. The securement can be easily undone by grasping and levering the edge of the stiffening plate from the PC board and breaking the interlock of the hooks and loops. The hooks and loops may be reversed on the stiffener plate and on the solder-side of the PC board. They may be the well-known complementary Velcro.RTM. materials.

    Abstract translation: 金属芯加强板形式的加强件临时固定在具有一系列集成电路(IC)芯片的印刷电路板(PC)板的下侧,并且在上表面或上表面上具有其它电子部件和金属化互连迹线 的董事会。 加强板和PC板的固定由通过合适的粘合剂粘附到PC板下面的钩/蘑菇的柔性带的部分提供。 互补的含钩的柔性材料片被粘附到加强板上,使得在将互补材料和节段压在一起时,相应的钩和环将PC板组件和加强板组件互锁地结合在一起。 通过从PC板抓住并拉紧加强板的边缘并破坏钩和环的互锁,可以容易地松开固定。 钩子和环可以在加强板和PC板的焊接侧反转。 它们可能是众所周知的互补Velcro TM材料。

    Conforming heat sink assembly
    123.
    发明授权
    Conforming heat sink assembly 失效
    符合散热器组件

    公开(公告)号:US4974119A

    公开(公告)日:1990-11-27

    申请号:US533957

    申请日:1990-05-29

    Inventor: Jacob H. Martin

    Abstract: A conforming heat sink assembly including a heat dispersive element is mounted in spaced relationship to a surface from which heat is to be conducted. A thermal interface is provided for coupling the heat dispersive element to the surface from which heat is to be conducted. The thermal interface includes an elastomeric member which occupies only a portion of a volume defined by mounting the heat dispersive element proximate the surface from which heat is to be conducted. The unoccupied volume allows the elastomeric member to easily conform to the irregular surface from which heat is to be conducted to enhance thermal conductivity from the surface to the heat dispersive member.

    Abstract translation: 包括散热元件的合适的散热器组件以与待传导热量的表面隔开的关系安装。 提供了一个热界面,用于将热分散元件耦合到要传导热量的表面上。 热界面包括弹性体构件,该弹性体构件仅占据通过将热分散元件安装在靠近待传导热的表面的体积所限定的一部分。 未占据的体积允许弹性体构件容易地符合要从其传导热量的不规则表面,以增强从表面到散热构件的导热性。

    Interconnection mechanisms for electronic components
    124.
    发明授权
    Interconnection mechanisms for electronic components 失效
    电子元件互连机制

    公开(公告)号:US4885126A

    公开(公告)日:1989-12-05

    申请号:US170444

    申请日:1988-03-18

    Inventor: John D. Polonio

    Abstract: An electronic circuit component housing assembly adapted to be mounted mechanically on a printed circuit, using a single mechanical fastener to attach the circuit component housing assembly in a unique alignment with the printed circuit, and simultaneously using the fastener to provide force to press physically compliant electrical contacts included in the circuit component housing assembly into electrical contact with terminal contact pads on the printed circuit. Several electronic circuit components may be housed in separate hermetically sealed cavities and can be biased independently of one another. Thermal conductors are included in the base member and a convection cooler is mounted atop the assembly. The mechanical fastener also acts as a thermal conductor. A test probe assembly including multiple contacts mounts on the electronic circuit component housing.

    Abstract translation: 一种电子电路部件壳体组件,其适于机械地安装在印刷电路上,使用单个机械紧固件将电路部件壳体组件以独特的对准方式与印刷电路连接,并且同时使用紧固件提供力以按压物理上顺应的电气 包括在电路部件壳体组件中的触点与印刷电路上的端子接触焊盘电接触。 几个电子电路组件可以容纳在单独的气密密封空腔中并且可以彼此独立地偏置。 热导体包括在基座构件中,并且对流冷却器安装在组件顶部。 机械紧固件也用作热导体。 包括多个触点的测试探针组件安装在电子电路部件壳体上。

    Inlet type noise filter directly mounted to a PC board
    125.
    发明授权
    Inlet type noise filter directly mounted to a PC board 失效
    进口型噪音滤波器直接安装在PC板上

    公开(公告)号:US4795991A

    公开(公告)日:1989-01-03

    申请号:US002483

    申请日:1987-01-12

    Abstract: An inlet type noise filter which can be directly mounted to a substrate or the like includes a casing, a pair of output terminals, a ground terminal projecting from a surface of the casing and a retaining portion projecting from the same surface of the casing that the terminals project from. The retaining portion extends through bores in the substrate and engage the substrate to secure the noise filter to the substrate. The terminals can then be operatively electrically connected by soldering or the like to conductive patterns on the substrate.

    Abstract translation: 可以直接安装到基板等的入口型噪声滤波器包括壳体,一对输出端子,从壳体的表面突出的接地端子和从壳体的相同表面突出的保持部分, 终端项目。 保持部分延伸穿过衬底中的孔并且接合衬底以将噪声滤波器固定到衬底。 然后,端子可以通过焊接等与基板上的导电图案可操作地电连接。

    Package for rugged electronics
    127.
    发明授权
    Package for rugged electronics 失效
    用于坚固电子产品的包装

    公开(公告)号:US4513064A

    公开(公告)日:1985-04-23

    申请号:US450617

    申请日:1982-12-17

    Applicant: Ira R. Marcus

    Inventor: Ira R. Marcus

    Abstract: A substrate which serves as an element for building an electronic module for ordnance applications comprising a body portion, for receiving electronic components, and a plurality of tab means extending therefrom for interlocking with complementary tab means on another similar substrate. The tab means may extend from the top, bottom, and/or sides of the substrate, and serve to mechanically and electrically interconnect with complementary tab means or apertures on adjacent substrates to form an electronic module of high mechanical strength and reliability. Such an electronic module may be assembled from at least three substrates. Each substrate has at least two tab means on each side edge thereof.

    Abstract translation: 用作构建用于军事应用的电子模块的元件的基板,包括用于接收电子部件的主体部分和从其延伸的多个突出部件,用于与另一相似基板上的互补突片装置互锁。 突片装置可以从基板的顶部,底部和/或侧面延伸,并且用于与相邻基板上的互补的接片装置或孔机械地和电气地互连,以形成具有高机械强度和可靠性的电子模块。 这样的电子模块可以由至少三个基板组装。 每个基板在其每个侧边缘上具有至少两个拉片装置。

    Method of making an electrical assembly fastened with thermoplastic eyelet
    128.
    发明授权
    Method of making an electrical assembly fastened with thermoplastic eyelet 失效
    制造用热塑性眼罩紧固的电气装置的方法

    公开(公告)号:US3754310A

    公开(公告)日:1973-08-28

    申请号:US3754310D

    申请日:1971-07-29

    Inventor: SHEA G

    Abstract: The assembly includes at least two pieces of material, each having a hole therein aligned with the hole in the other piece of material, and a plastic eyelet positioned in the holes and having a radially extending flange on one end thereof which engages one piece of material and a rolled over rim at the other end thereof which engages the other piece of material to hold the pieces of material together. The method includes the steps of: assembling the pieces of material with a plastic sleeve positioned in the holes, the sleeve having the radially extending flange on one end with the other end of the sleeve extending beyond one piece of material; holding the flange against one piece of material while raising the temperature of the extending end of the sleeve above its softening temperature; and simultaneously shaping at least a part of the extending end of the sleeve into the rolled over rim which extends radially from the extending end of the sleeve and in abutment with the other piece of material.

    Abstract translation: 组件包括至少两块材料,每个材料都具有与另一块材料中的孔对准的孔,以及定位在孔中的塑料孔眼,并在其一端上具有径向延伸的凸缘,其接合一片材料 和在其另一端的翻边缘,其与另一块材料接合,以将这些材料块保持在一起。 该方法包括以下步骤:用定位在孔中的塑料套筒组装材料块,套筒在一端具有径向延伸的凸缘,套筒的另一端延伸超过一块材料; 将凸缘保持在一件材料上,同时将套筒延伸端的温度提高到其软化温度以上; 并且同时将套筒的延伸端的至少一部分成形为从套筒的延伸端径向延伸并且与另一块材料邻接的卷绕的边缘。

    Method of making packages
    129.
    发明授权
    Method of making packages 失效
    制作包的方法

    公开(公告)号:US3712840A

    公开(公告)日:1973-01-23

    申请号:US3712840D

    申请日:1969-09-08

    Inventor: MILLER M

    Abstract: A package including at least one hole extending through the entire package and hermetically isolated from the package contents, the package being formed by stacking a plurality os subassemblies between two face sheets of impervious material and aligning the contents by at least one vertical pin through which the hole passes. The package is bonded subsequent to stacking and is clamped together during bonding by a pair of pressure plates, the plates being removed upon completion of bonding to allow the final package to be positioned and aligned in an external apparatus.

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