公开(公告)号：US20090001388A1

公开(公告)日：2009-01-01

申请号：US12087680

申请日：2006-12-22

Applicant: Takayuki Ishihara ,  Satohiro Kigoshi

Inventor： Takayuki Ishihara ,  Satohiro Kigoshi

IPC: H01L33/00 ,  H01L21/00

CPC classification number: G09F9/33 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K1/0289 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To provide a semiconductor display device capable of being easily manufactured and a method for manufacturing the semiconductor display device.The semiconductor display unit 1 includes: a printed circuit board 3 with a display section 2 formed thereon; a protection member 4; a embankment member 5; X lines 6; and Y lines 7. The embankment member 5 is composed of silicon resin which is capable of repelling epoxy resin constituting the protection member 4. Even when the embankment member 5 is lower than the protection member 4 or even when potting is performed to make the liquid epoxy resin 21 higher than the embankment member 5 at a manufacturing process, the epoxy resin 21 is repelled by the embankment member 5 and dose not spill.

Abstract translation: 提供能够容易制造的半导体显示装置及其制造方法。 半导体显示单元1包括：印刷电路板3，其上形成有显示部分2; 保护构件4; 路堤5; X线6; 路线构件5由能够排斥构成保护构件4的环氧树脂的硅树脂构成。即使当路堤构件5比保护构件4低时，或者即使在进行灌封以使液体 环氧树脂21在制造过程中高于路堤构件5时，环氧树脂21被路堤构件5排斥并且不会溢出。

公开(公告)号：US07466210B2

公开(公告)日：2008-12-16

申请号：US11436816

申请日：2006-05-18

Applicant: Thomas A. Knecht ,  Robert A. Jacobson

Inventor： Thomas A. Knecht ,  Robert A. Jacobson

IPC: H03B5/36

CPC classification number: H05K1/165 ,  H03B5/32 ,  H03B5/326 ,  H05K1/0237 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/09181 ,  H05K2201/09263 ,  H05K2201/10371

Abstract: A module for a surface acoustic wave oscillator includes a substrate having a top surface, a bottom surface and peripheral side faces. Several castellations are located about the outer peripheral side faces thereof. The castellations form an electrical connection between the top and bottom surfaces of the substrate. Connection pads are mounted on the top surface and are adapted for connection to the castellations. An oscillator circuit and a surface acoustic wave device are mounted on the top surface and connected to the connection pads. A cover is mounted over the substrate and has at least one tab adapted to be fitted within a respective one of the castellations. The overall module with the cover has a dimension of approximately 5 mm in width, 7 mm in length, and 2.7 mm in height.

Abstract translation: 用于表面声波振荡器的模块包括具有顶表面，底表面和周边侧面的基板。 几个城堡围绕其外周侧面设置。 蓖麻形成在基底的顶表面和底表面之间的电连接。 连接垫安装在顶部表面上，适用于连接到城堡。 振荡器电路和表面声波装置安装在顶表面上并连接到连接焊盘。 盖子安装在衬底上并且具有至少一个适于安装在相应的一个蓖体内的突片。 具有盖的总体模块的尺寸为宽度约5mm，长度为7mm，高度为2.7mm。

公开(公告)号：US07396591B2

公开(公告)日：2008-07-08

申请号：US11454412

申请日：2006-06-16

Applicant: Takuya Miyashita ,  Masafumi Okada ,  Kenji Matsumoto

Inventor： Takuya Miyashita ,  Masafumi Okada ,  Kenji Matsumoto

IPC: B32B3/00

CPC classification number: H05K3/282 ,  H05K3/325 ,  H05K2201/0162 ,  H05K2201/0179 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: In a wiring substrate having a metal wiring pattern that is formed on a substrate and includes a contact portion for providing connection to an external element, an organic thin film containing silane is formed to cover the metal wiring pattern and the contact portion is electrically connected to the external element through the organic thing film. Unlike conventional wiring substrates in which a contact portion is uncovered by ripping open or cutting away a protective resin film formed on the contact portion, the wiring substrate can be electrically connected with an external element having a low contact pressure, for example.

Abstract translation: 在具有形成在基板上并且包括用于提供与外部元件的连接的接触部分的金属布线图案的布线基板中，形成含有硅烷的有机薄膜以覆盖金属布线图案，并且该接触部分电连接到 外部元素通过有机物膜。 与通过撕开或切除形成在接触部分上的保护树脂膜不接触接触部分的传统布线基板不同，布线基板可以例如与具有低接触压力的外部元件电连接。

公开(公告)号：US20080044591A1

公开(公告)日：2008-02-21

申请号：US11924752

申请日：2007-10-26

Applicant: Lucien Laude ,  Robert Greenberg

Inventor： Lucien Laude ,  Robert Greenberg

IPC: B05D3/00

CPC classification number: H05K3/185 ,  C23C18/1612 ,  C23C18/1639 ,  C23C18/1641 ,  C23C18/1692 ,  C23C18/1868 ,  C23C18/204 ,  C25D5/02 ,  C25D5/56 ,  H05K1/032 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/421 ,  H05K3/4661 ,  H05K2201/0162

Abstract: The present invention provides a flexible electrode array, comprising a silicone containing body, at least one metal trace layer and at least one electrode pad on the surface. The present invention further provides a process of manufacturing a flexible electrode array, comprising: a) irradiating a surface area of a molded silicone containing layer yielding traces with a light beam emitted by a pulsed UV laser source, b) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal traces, c) applying a silicone containing layer on said silicone containing layer and said metal traces, d) irradiating the surface for drilling holes into the surface of the molded silicone containing layer, and e) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal electrode pads.

Abstract translation: 本发明提供了一种柔性电极阵列，其包括硅氧烷容纳体，至少一个金属迹线层和表面上的至少一个电极焊盘。 本发明还提供一种制造柔性电极阵列的方法，包括：a）照射模制的含硅氧烷层的表面积，产生具有由脉冲UV激光源发射的光束的痕迹，b）将所述照射的模制硅氧烷层 用于诱导金属离子的沉积以形成金属迹线，c）在所述含硅层和所述金属迹线上施加含硅氧烷层，d）将所述表面照射到所述模制的含硅氧烷层的表面中，e） 浸渍所述照射的模制的硅氧烷层以诱导金属离子的沉积形成金属电极焊盘。

公开(公告)号：US20080029923A1

公开(公告)日：2008-02-07

申请号：US11872580

申请日：2007-10-15

Applicant: Kyoung-Sei CHOI ,  Sa-Yoon KANG ,  Yong-Hwan KWON ,  Chung-Sun LEE

Inventor： Kyoung-Sei CHOI ,  Sa-Yoon KANG ,  Yong-Hwan KWON ,  Chung-Sun LEE

IPC: C04B35/00

CPC classification number: H05K3/28 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/101 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0129 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/0759 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916

Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Abstract translation: 根据本发明的制造带布线板的方法可以在形成布线图案中采用压印工艺，从而减少制造带布线板的工艺的数量，并允许制造工艺在单个生产线中进行。 因此，制造时间和成本可能降低。 布线图案的轮廓可以通过模具的印模图案的形状来确定。 这可以建立内部和外部引线的顶部宽度并且结合细小的垫间距。 虽然ILB和OLB过程可能使用NCP，但是由于软和弹性布线图案可能建立连接可靠性。

公开(公告)号：US20070292697A1

公开(公告)日：2007-12-20

申请号：US10598967

申请日：2005-03-08

Applicant: Kazumi Nakayoshi ,  Katsutoshi Mine ,  Akihiko Kobayashi

Inventor： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Akihiko Kobayashi

IPC: H01L33/00

CPC classification number: H05K1/056 ,  H01L33/64 ,  H05K2201/0162 ,  H05K2201/10106

Abstract: A metal base circuit substrate for an optical device, which effectively reflects the generated light and radiates heat from the substrate, comprises a metal base substrate made from aluminum or aluminum alloy that supports an electric circuit via an insulation layer, wherein the insulation layer is formed from a transparent cross-linked silicone body, and the electric circuit is formed directly on the insulation layer. And an efficient method for manufacturing the aforementioned substrate comprises the steps of: a) applying a cross-linkable silicone onto the surface of a metal base substrate made from aluminum or aluminum alloy, b) cross-link

Abstract translation: 一种用于光学器件的金属基底电路基板，其有效地反射所产生的光并从基板辐射热量，包括由铝或铝合金制成的金属基底，其通过绝缘层支撑电路，其中形成绝缘层 由透明的交联硅氧烷体构成，电路直接形成在绝缘层上。 并且制造上述基板的有效方法包括以下步骤：a）将可交联的硅氧烷涂覆在由铝或铝合金制成的金属基底的表面上，b）交联

公开(公告)号：US20070278623A1

公开(公告)日：2007-12-06

申请号：US11806675

申请日：2007-06-01

Applicant: Tohru Nomura

Inventor： Tohru Nomura

IPC: H01L29/40

CPC classification number: H05K3/284 ,  H01L23/24 ,  H01L23/3135 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K2201/0162 ,  H05K2201/10015 ,  H05K2201/10272 ,  H05K2201/2045 ,  H05K2203/1322 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electric circuit device and related manufacturing method are disclosed as having a case incorporating therein a substrate on which electric circuit elements are mounted. A sealant is filled in the case to cover the electric circuit elements and the substrate and is composed of a lower layer gel and an upper layer gel formed in a two-layer structure. The upper layer gel has a penetration equal to or less than 90 and the lower layer gel has a penetration greater than that of the upper layer gel to allow the upper layer gel to suppress vibration of a surface of the lower gel for thereby suppressing the deformation of the lower layer gel even in the presence of a tendency causing the electric circuit elements or the substrate to vibrate, preventing a degraded function in insulation, waterproof and vibrational relaxation of the lower layer gel.

Abstract translation: 公开了一种电路装置及相关的制造方法，其具有其中安装有电路元件的基板的壳体。 在壳体中填充密封剂以覆盖电路元件和基板，并且由下层凝胶和形成为两层结构的上层凝胶组成。 上层凝胶具有等于或小于90的渗透性，并且下层凝胶的穿透力大于上层凝胶的渗透，以允许上层凝胶抑制下凝胶表面的振动，从而抑制变形 即使存在导致电路元件或基板振动的趋势，防止下层凝胶的绝缘，防水和振动松弛的功能降低。

公开(公告)号：US07282257B2

公开(公告)日：2007-10-16

申请号：US10875278

申请日：2004-06-25

Applicant: Hiroshi Orikabe ,  Kenji Kawai

Inventor： Hiroshi Orikabe ,  Kenji Kawai

IPC: B32B7/02

CPC classification number: B32B27/20 ,  B32B27/08 ,  B32B2309/105 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/36 ,  H05K3/4661 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/066 ,  H05K2203/124 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24959 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/254 ,  Y10T428/259

Abstract: The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent.

Abstract translation: 本发明涉及可用于制备粘合剂膜的树脂组合物，其又可用于形成具有优异机械强度且能够被氧化剂粗糙化的多层印刷线路板的层间绝缘层。

公开(公告)号：US20070104967A1

公开(公告)日：2007-05-10

申请号：US11270907

申请日：2005-11-10

Applicant: Lucien Laude ,  Robert Greenberg

Inventor： Lucien Laude ,  Robert Greenberg

IPC: B32B15/04 ,  B05D1/38 ,  B05D1/36

CPC classification number: H05K3/185 ,  C08J7/12 ,  C08J2383/04 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1657 ,  C23C18/204 ,  C23C18/206 ,  H05K3/28 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T428/26 ,  Y10T428/31663

Abstract: The present invention provides a process for embedding at least one layer of at least one metal trace in a silicone-containing polymer, comprising: a) applying a polymer layer on a substrate; b) thermally treating the polymer; c) irradiating at least one surface area of the polymer with a light beam emitted by an excimer laser; d) immersing the irradiated polymer in at least one autocatalytic bath containing ions of at least one metal, and metallizing the polymer; e) thermally treating the metallized polymer; f) applying a polymer layer covering the thermally treated metallized polymer; and g) thermally treating the metallized covered polymer. The present invention further provides a polymer layer comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer. The present invention further provides a flexible electrode array comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.

Abstract translation: 本发明提供了一种在含硅酮聚合物中嵌入至少一层至少一种金属痕迹的方法，包括：a）在基底上施加聚合物层; b）热处理聚合物; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将经辐射的聚合物浸入至少一种含有至少一种金属的离子的自催化浴中，并对聚合物进行金属化; e）热处理金属化聚合物; f）涂覆覆盖热处理的金属化聚合物的聚合物层; 和g）热处理金属化被覆聚合物。 本发明还提供一种聚合物层，其包含含硅氧烷的SiO 2，TiO 2，Sb 2 O 3， N 2，N 2 O 3，N 2，N 2 O 3， Fe 3 O 3，滑石，羟基磷灰石或其混合物，以及嵌入所述聚合物层中的至少一种金属迹线。 本发明还提供了一种柔性电极阵列，其包括含硅氧烷的SiO 2，TiO 2，Sb 2 O 3， / SUB>，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，3 < Fe 3 O 3，滑石，羟基磷灰石或其混合物，以及嵌入所述聚合物层中的至少一种金属迹线。

公开(公告)号：US20060279367A1

公开(公告)日：2006-12-14

申请号：US11436816

申请日：2006-05-18

Applicant: Thomas Knecht ,  Robert Jacobson

Inventor： Thomas Knecht ,  Robert Jacobson

IPC: H03B5/32

CPC classification number: H05K1/165 ,  H03B5/32 ,  H03B5/326 ,  H05K1/0237 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/09181 ,  H05K2201/09263 ,  H05K2201/10371

Abstract: A module for a surface acoustic wave oscillator includes a substrate having a top surface, a bottom surface and peripheral side faces. Several castellations are located about the outer peripheral side faces thereof. The castellations form an electrical connection between the top and bottom surfaces of the substrate. Connection pads are mounted on the top surface and are adapted for connection to the castellations. An oscillator circuit and a surface acoustic wave device are mounted on the top surface and connected to the connection pads. A cover is mounted over the substrate and has at least one tab adapted to be fitted within a respective one of the castellations. The overall module with the cover has a dimension of approximately 5 mm in width, 7 mm in length, and 2.7 mm in height.

Abstract translation: 用于表面声波振荡器的模块包括具有顶表面，底表面和周边侧面的基板。 几个城堡围绕其外周侧面设置。 蓖麻形成在基底的顶表面和底表面之间的电连接。 连接垫安装在顶部表面上，适用于连接到城堡。 振荡器电路和表面声波装置安装在顶表面上并连接到连接焊盘。 盖子安装在衬底上，并且具有至少一个适于安装在相应的一个蓖体内的突片。 具有盖的总体模块的尺寸为宽度约5mm，长度为7mm，高度为2.7mm。