公开(公告)号：US20060013722A1

公开(公告)日：2006-01-19

申请号：US11178551

申请日：2005-07-11

Applicant: Alexander Brand ,  Steffen Grebner ,  Wolfgang Schmitt ,  Jorg Trodler

Inventor： Alexander Brand ,  Steffen Grebner ,  Wolfgang Schmitt ,  Jorg Trodler

IPC: C22C13/00

CPC classification number: B23K35/025 ,  B23K35/262 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0272

Abstract: The introduction of undesired intermetallic phases (IMP) is reduced in lead-free solder joints. For this purpose, solder pastes are prepared, which have a metal powder mixture that generates a melting range of at least about 5° Kelvin and preferably less than about 30° Kelvin. Suitable for this purpose are metal powder mixtures, in which the melting points of the metal powder components lie apart from each other more than about 5° Kelvin, particularly more than about 10° Kelvin, preferably more than about 15° K, and optionally less than about 30° Kelvin, particularly up to about 25° Kelvin. However, metal powder mixtures are also possible, in which the melting point spread can equal about 100° Kelvin and more, if the higher melting component dissolves in the melt below the melting point of this component, so that the melting range can be held under about 30° Kelvin. With these solder pastes undesired intermetallic phases can be held nearly arbitrarily low.

Abstract translation: 在无铅焊点中引入不期望的金属间相（IMP）。 为此，制备焊膏，其具有产生至少约5开氏度，优选小于约30开氏度的熔融范围的金属粉末混合物。 适合于此目的的是金属粉末混合物，其中金属粉末组分的熔点彼此分开超过约5°开尔文，特别是大于约10°开尔文，优选大于约15°K，并且任选地较少 高于约30°开尔文，特别高达约25°开氏度。 然而，金属粉末混合物也是可能的，其中熔点扩散可以等于约100开氏度和更高，如果较高熔点的组分溶解在低于该组分的熔点的熔体中，使得熔融范围可以保持在 约30°开尔文 对于这些焊膏，不期望的金属间相可以几乎任意低。

公开(公告)号：US20050230667A1

公开(公告)日：2005-10-20

申请号：US11073099

申请日：2005-03-03

Applicant: Michinori Komagata ,  Yukio Shirai ,  Kenichi Suzuki ,  Katsuaki Suganuma

Inventor： Michinori Komagata ,  Yukio Shirai ,  Kenichi Suzuki ,  Katsuaki Suganuma

IPC: C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/32 ,  H01B1/00

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09J9/02 ,  C09J2205/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention provides a conductive adhesive comprising conductive particles and a resin wherein 30% by weight or more of the conductive particles substantially comprise silver and tin, and a molar ratio of silver and tin in the metal components of the conductive adhesive is in the range of 77.5:22.5 to 0:100; and a circuit connected by using the conductive adhesive.

Abstract translation: 本发明提供一种导电性粘合剂，其包含导电性粒子和树脂，其中导电性粒子的30重量％以上基本上含有银和锡，并且导电性粘合剂的金属成分中的银和锡的摩尔比在该范围内 为77.5:22.5至0：100; 以及通过使用导电粘合剂连接的电路。

公开(公告)号：US06916433B2

公开(公告)日：2005-07-12

申请号：US10030235

申请日：2001-02-27

Applicant: Tsutomi Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

Inventor： Tsutomi Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

IPC: C09J9/02 ,  H05K3/32 ,  H01B1/22 ,  H01L23/04

CPC classification number: H05K3/321 ,  C09J9/02 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0278 ,  H05K2203/0307 ,  Y02P70/611 ,  Y10T428/2982

Abstract: A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.

Abstract translation: 导电粘合剂包括导电填料和粘合剂树脂的主要组分，并且导电填料的含量在20重量％至70重量％的范围内。 导电填料的至少一部分优选具有突起。 特别优选枝晶金属填料。 当该粘合剂被压缩时，树脂组分被挤出，而导电填料组分保留在内部。 结果，导电填料组分的浓度升高到内部，并且这通过划伤电极的表面来连接电极是有用的。 在电路基板1的基板电极2上形成导电性粘接剂3也需要焊料，也可以包装电子元件4。 还提供了使用导电粘合剂的电子元件的包装，其具有改善的初始和长期可靠性，以及包装该电子元件的方法。

公开(公告)号：US20050147522A1

公开(公告)日：2005-07-07

申请号：US11074729

申请日：2005-03-09

Applicant: Isao Watanabe ,  Kaoru Hashimoto ,  Osamu Taniguchi

Inventor： Isao Watanabe ,  Kaoru Hashimoto ,  Osamu Taniguchi

IPC: H05K1/09 ,  H01B1/02 ,  H01L21/283 ,  H01L21/288 ,  H01L21/768 ,  H01L23/52 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  C22C12/00 ,  C22C28/00

CPC classification number: H01L21/76898 ,  H05K1/0306 ,  H05K3/4061 ,  H05K2201/0272 ,  H05K2201/0347 ,  H05K2203/0425 ,  H05K2203/085 ,  H05K2203/1105 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.

Abstract translation: 导电材料包括熔点不超过250℃的第一金属材料和熔点不低于500℃的第二金属材料，并且在不高于250℃的温度下是糊状物 由此导电材料的导电率可以高于树脂浆料。 导电材料可以用于糊料，由此导电材料可以以与树脂浆料相同的方式埋在通孔中。

公开(公告)号：US06800223B2

公开(公告)日：2004-10-05

申请号：US10223907

申请日：2002-08-20

Applicant: Hiroki Kojo ,  Hisashi Matsuno

Inventor： Hiroki Kojo ,  Hisashi Matsuno

IPC: H01B122

CPC classification number: H05K3/4069 ,  H01B1/22 ,  H05K1/095 ,  H05K3/4614 ,  H05K2201/0272 ,  H05K2203/1189

Abstract: The invention is directed to a thermosetting electroconductive paste for forming electroconductive bumps at predetermined locations on at least one circuit layer that is laminated to an insulating layer. Upon lamination the electroconductive bumps penetrate the insulating layer forming an electrical connection to a second circuit layer. The paste comprises, based on total composition, 80 to 90 wt % electroconductive powders comprising at least a first and second electroconductive metal powder of which packing densities are in the range of 20% or less of the average density (sp. gr.) of metal for the first powder and 20 to 40% of the average density (sp. gr.) of metal for the second powder; and 10 to 20 wt % epoxy resin, curing agent, and solvent.

Abstract translation: 本发明涉及一种热固性导电浆料，用于在至少一层层压到绝缘层上的电路层上的预定位置处形成导电凸块。 在层叠时，导电凸块穿透绝缘层，形成与第二电路层的电连接。 基于总组合，糊状物包含80-90重量％的导电粉末，其包含至少第一和第二导电金属粉末，其中填充密度在平均密度（sp。gr。）的20％或更小的范围内 用于第一粉末的金属和用于第二粉末的金属的平均密度（sp。gr。）的20至40％; 和10〜20重量％的环氧树脂，固化剂和溶剂。

公开(公告)号：US20040066633A1

公开(公告)日：2004-04-08

申请号：US10662368

申请日：2003-09-16

Inventor： Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

IPC: H05K001/00 ,  H05K001/18 ,  H05K007/02 ,  H05K007/06 ,  H05K007/08

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

Abstract translation: 含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。 当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。 同时，通孔周围的树脂膜突出到通孔中。 因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。 因此，可以防止由于板的变形引起的应力集中。

公开(公告)号：US06713687B2

公开(公告)日：2004-03-30

申请号：US10022222

申请日：2001-12-20

Applicant: Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

Inventor： Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

IPC: H05K111

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

Abstract translation: 含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。 当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。 同时，通孔周围的树脂膜突出到通孔中。 因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。 因此，可以防止由于板的变形引起的应力集中。

公开(公告)号：US06641898B2

公开(公告)日：2003-11-04

申请号：US10024470

申请日：2001-12-21

Applicant: Yoshitaro Yazaki ,  Yoshihiko Shiraishi ,  Koji Kondo ,  Toshikazu Harada ,  Tomohiro Yokochi

Inventor： Yoshitaro Yazaki ,  Yoshihiko Shiraishi ,  Koji Kondo ,  Toshikazu Harada ,  Tomohiro Yokochi

IPC: B32B300

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T428/24917

Abstract: A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

公开(公告)号：US20030116756A1

公开(公告)日：2003-06-26

申请号：US10309426

申请日：2002-12-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani ,  Tousaku Nishiyama

IPC: B32B005/16 ,  H01C001/00

CPC classification number: H01B1/22 ,  C09J9/02 ,  H01L2924/181 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0272 ,  H05K2201/0769 ,  Y10T428/12069 ,  Y10T428/1209 ,  Y10T428/12111 ,  Y10T428/12139 ,  Y10T428/12528 ,  Y10T428/25 ,  H01L2924/00012

Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

公开(公告)号：US06447898B1

公开(公告)日：2002-09-10

申请号：US09440337

申请日：1999-11-15

Applicant: Ronald Pfaff

Inventor： Ronald Pfaff

IPC: B32B712

CPC classification number: H01L24/83 ,  C09J7/10 ,  H01B1/22 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0329 ,  H05K2201/2036 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2996 ,  H01L2924/00

Abstract: Electrically conductive, thermoplastic and heat-activatable adhesive sheet comprising i) a thermoplastic polymer in a proportion of at least 30% by weight, ii) one or more tackifying resins in a proportion of from 5 to 50% by weight and/or iii) epoxy resins with hardeners, with or without accelerators, in a proportion of from 5 to 40% by weight, iv) metallized particles in a proportion of from 0.1 to 40% by weight, v) non-deformable or virtually non-deformable spacer particles, in a proportion of from 1 to 10% by weight, which do not melt at the bonding temperature of the adhesive sheet.

Abstract translation: 导电性，热塑性和热可活化的粘合片，其包含：i）至少30重量％的热塑性聚合物，ii）5重量％至50重量％的一种或多种增粘树脂和/或iii）环氧树脂 硬化剂，有或没有促进剂，其含量为5-40重量％，iv）0.1-40重量％的金属化颗粒，v）不可变形或实际上不可变形的间隔颗粒， 在粘合片的粘合温度下不熔化的比例为1〜10重量％。