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    Magnetic head suspension with single layer preshaped trace interconnect
    132.
    发明授权
    Magnetic head suspension with single layer preshaped trace interconnect 失效
    具有单层预形状跟踪互连的磁头悬架

    公开(公告)号：US6134075A

    公开(公告)日：2000-10-17

    申请号：US674342

    申请日：1996-07-02

    Applicant: Jeffry S. Bennin ,  Todd Boucher ,  Jeffrey W. Green ,  Gary E. Gustafson ,  Ryan Jurgenson ,  Brent D. Lien

    Inventor： Jeffry S. Bennin ,  Todd Boucher ,  Jeffrey W. Green ,  Gary E. Gustafson ,  Ryan Jurgenson ,  Brent D. Lien

    IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/20 ,  H05K3/36

    CPC classification number: G11B5/486 ,  G11B5/4833 ,  H05K1/118 ,  H05K1/09 ,  H05K2201/0311 ,  H05K2201/10924 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/202 ,  H05K3/365 ,  Y10T29/49224

    Abstract: A trace interconnect assembly is designed for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

    Abstract translation: 轨迹互连组件设计用于将电信号传送到硬盘驱动器中的头组件和从头组件传输电信号。 互连组件包括一个或多个单层薄的，细长的和基本上平坦的无基板的迹线互连。 迹线互连是从优选高拉伸和高屈服强度金属（例如铍铜）的平面长度上蚀刻的新导体。 它们被成形为匹配悬架组件的表面拓扑。 跟踪互连具有刚性区域和与悬挂组件中的刚性区域和柔性区域匹配的柔性区域。 不同的附加元件包括支撑支架，支座，跟踪脚，接合垫和堆叠互连。 将头部组件耦合到互连组件产生头部互连线束。 公开了用于迹线互连组件，多导体堆叠版本，磁头悬挂组件和磁头互连线束的制造方法。

    HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET
    138.
    发明公开
    HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET 审中-公开

    公开(公告)号：US20230156917A1

    公开(公告)日：2023-05-18

    申请号：US17983107

    申请日：2022-11-08

    Applicant: Amphenol Corporation

    Inventor： Paul R. Taylor ,  Jim Hileman ,  Trent K. Do

    IPC: H05K1/11 ,  H01L23/498

    CPC classification number: H05K1/113 ,  H01L23/49838 ,  H05K2201/10378 ,  H05K2201/0311 ,  H05K2201/10628 ,  H05K2201/10325

    Abstract: An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

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