公开(公告)号：US20150021479A1

公开(公告)日：2015-01-22

申请号：US14353020

申请日：2012-07-25

Applicant: Jian Cai ,  Qian Wang ,  Ziyu Liu ,  Yang Hu

Inventor： Jian Cai ,  Qian Wang ,  Ziyu Liu ,  Yang Hu

IPC: H05K1/11 ,  G01J5/24 ,  H01L27/146 ,  G01J5/10

CPC classification number: H05K1/115 ,  G01J5/00 ,  G01J5/02 ,  G01J5/10 ,  G01J5/20 ,  G01J5/24 ,  H01L21/6835 ,  H01L23/481 ,  H01L27/1443 ,  H01L27/14683 ,  H01L31/02005 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2224/11002 ,  H05K2201/032 ,  H05K2201/0329

Abstract: A bolometer and a preparation method thereof. The bolometer includes: an infrared detection element (1) and a readout circuit (2), wherein the infrared detection element (1) is formed on one side of a first substrate (100), and an edge of the infrared detection element (1) is provided with an electrode hole (9), and the readout circuit (2) is formed on one side of a second substrate (200) and the readout circuit (2) has an electrode, the first substrate (100) is formed thereon with a silicon via (8) passing through the first substrate (100) and filed with a conductive material, the electrode hole (9) of the infrared detection element (1) is electrically connected to the electrode of the readout circuit (2) via the conductive material filled in the silicon via (8). The following defects are overcome: bolometers in the prior art need to flatten the silicon wafer surface with a suitable chemical-mechanical polishing process after a readout circuit thereof has been manufactured, the circuit is large in area, and the requirements of the system integration process are high.

Abstract translation: 测辐射热谱仪及其制备方法。 测辐射热计包括：红外线检测元件（1）和读出电路（2），其中红外线检测元件（1）形成在第一基板（100）的一侧，红外线检测元件（1）的边缘 ）设置有电极孔（9），读出电路（2）形成在第二基板（200）的一侧，读出电路（2）具有电极，第一基板（100）形成在其上 通过硅通孔（8）穿过第一衬底（100）并放置导电材料，红外线检测元件（1）的电极孔（9）经由读出电路（2）的电极经由 填充在硅通孔（8）中的导电材料。 克服了以下缺陷：现有技术中的辐射热测量仪在其制造的读出电路之后需要用合适的化学机械抛光工艺来平坦化硅晶片表面，电路面积大，并且系统集成工艺的要求 很高

公开(公告)号：US08927394B2

公开(公告)日：2015-01-06

申请号：US14042869

申请日：2013-10-01

Applicant: AU Optronics Corporation

Inventor： Tsung-Ying Ke

IPC: H01L21/46 ,  H01L21/78 ,  H01L21/301 ,  H01L29/04 ,  H01L29/12 ,  H01L33/02

CPC classification number: H01L51/0097 ,  H01L21/78 ,  H01L21/7813 ,  H01L27/1266 ,  H01L27/3246 ,  H01L29/04 ,  H01L29/12 ,  H01L33/02 ,  H01L51/003 ,  H01L51/5237 ,  H01L51/5253 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/181 ,  H05K2201/032 ,  Y02E10/549 ,  Y02P70/521

Abstract: An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.

Abstract translation: 有源器件衬底包括柔性衬底，无机去结合层和至少一个有源器件。 柔性基板具有与第一表面相对的第一表面和第二表面，其中第一表面是平坦表面。 无机去结合层覆盖柔性基板的第一表面，无机去结合层的材料是金属，金属氧化物或其组合。 有源器件设置在柔性衬底的第二表面上或上方。

公开(公告)号：US20140369017A1

公开(公告)日：2014-12-18

申请号：US14364085

申请日：2013-01-25

Applicant: Electrolux Home Products Corporation N.V.

Inventor： Laurent Jeanneteau ,  Thibaut Rigolle ,  Alex Viroli ,  Andrea Fattorini

IPC: H05K1/14 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/142 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/14 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0183 ,  H05K2201/032 ,  H05K2201/041 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.

Abstract translation: 本发明涉及包括印刷电路板（20），至少一个单独的电路板（10）和用于所述印刷电路板（20）的至少一个电力连接器（12）的电气和/或电子电路。 所述至少一个电源连接器（12）被连接或连接到相应的对应物。 在单独的电路板（10）处销售许多电和/或电子部件（22）。 所述至少一个单独的电路板（10）通过多个焊点（16）连接到所述印刷电路板（20）。 焊点（16）通过通孔技术连接到单独的电路板（10）。 焊接接头（16）通过SMD（表面安装器件）技术连接到印刷电路板（20）。 至少一个电源连接器（12）通过通孔技术紧固在单独的电路板（10）处。

公开(公告)号：US08704105B2

公开(公告)日：2014-04-22

申请号：US12981196

申请日：2010-12-29

Applicant: Kumaran Manikantan Nair ,  Scott E Gordon ,  Mark Frederick McCombs

Inventor： Kumaran Manikantan Nair ,  Scott E Gordon ,  Mark Frederick McCombs

IPC: H05K1/09 ,  H05K1/11

CPC classification number: H05K3/0094 ,  H01B1/22 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/032 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1126

Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

Abstract translation: 公开了一种用于形成过渡通孔和过渡管线导体的组合物，用于最小化异种金属组合物之间电连接处的界面效应。 该组合物具有（a）选自（i）20-45wt％金和80-55wt％银和（ii）100wt％银 - 金固溶体合金的无机成分，和（b）有机 中。 该组合物还可以含有（c）基于组合物重量的1-5重量％的选自Cu，Co，Mg和Al的金属的氧化物或混合氧化物和/或主要含有 难熔氧化物。 组合物可以用作通孔填充物中的多层组合物。 也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。