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    STORAGE DEVICE
    132.
    发明申请
    STORAGE DEVICE 审中-公开
    储存设备

    公开(公告)号：US20100009560A1

    公开(公告)日：2010-01-14

    申请号：US12341386

    申请日：2008-12-22

    Applicant: Kab Qyu YOUN

    Inventor： Kab Qyu YOUN

    IPC: H01R13/60

    CPC classification number: H01R13/4538 ,  H01R12/62 ,  H01R13/6658 ,  H05K1/028 ,  H05K3/181 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/0344

    Abstract: A storage device is provided. The storage device includes a case; a connector arranged in the case so to be able to be slidingly moved; a printed circuit board (PCB) and a memory disposed in the case; and a flexible film arranged between the connector and the PCB to connect the connector to the PCB, wherein the flexible film includes a dielectric film and a metal layer disposed on the dielectric film. Thus, it is possible to easily accommodate the connector in the case and to properly protect the connector.

    Abstract translation: 提供存储设备。 存储装置包括壳体; 布置在所述壳体中以使得能够滑动地移动的连接器; 印刷电路板（PCB）和布置在壳体中的存储器; 以及布置在连接器和PCB之间以将连接器连接到PCB的柔性膜，其中柔性膜包括介电膜和设置在电介质膜上的金属层。 因此，可以容易地将连接器容纳在壳体中并适当地保护连接器。

    FLEXIBLE FILM AND DISPLAY DEVICE INCLUDING THE SAME
    133.
    发明申请
    FLEXIBLE FILM AND DISPLAY DEVICE INCLUDING THE SAME 审中-公开
    柔性膜和包括其的显示装置

    公开(公告)号：US20090295685A1

    公开(公告)日：2009-12-03

    申请号：US12359118

    申请日：2009-01-23

    Applicant: Jungsup YUM ,  Dongki KO

    Inventor： Jungsup YUM ,  Dongki KO

    IPC: G09G3/20 ,  B32B3/10

    CPC classification number: H05K3/426 ,  H05K1/0393 ,  H05K3/181 ,  H05K2201/0344 ,  H05K2201/09827 ,  H05K2201/10681 ,  Y10T428/24331

    Abstract: A flexible film and a display device including the same are provided. The flexible film includes an insulating film including a hole, an inner surface surrounding the hole, a first surface, and a second surface opposite to the first surface and a metal layer covering the inner surface and at least one of the first and second surfaces. The metal layer includes a first layer and a second layer. The metal layer has a first portion on the inner surface and a second portion on the first surface or the second surface. The first portion has a thickness smaller than a thickness of the second portion.

    Abstract translation: 提供了一种柔性膜和包括该柔性膜的显示装置。 柔性膜包括绝缘膜，包括孔，围绕孔的内表面，第一表面和与第一表面相对的第二表面以及覆盖内表面和第一表面和第二表面中的至少一个的金属层。 金属层包括第一层和第二层。 金属层在内表面上具有第一部分，在第一表面或第二表面上具有第二部分。 第一部分的厚度小于第二部分的厚度。

    MANUFACTURING METHOD OF A WIRING BOARD CONTAINING A SEED LAYER HAVING A ROUGHENED SURFACE
    134.
    发明申请
    MANUFACTURING METHOD OF A WIRING BOARD CONTAINING A SEED LAYER HAVING A ROUGHENED SURFACE 审中-公开
    含有粗糙表面的籽粒层的接线板的制造方法

    公开(公告)号：US20090238956A1

    公开(公告)日：2009-09-24

    申请号：US12406161

    申请日：2009-03-18

    Applicant: Hironari KOJIMA

    Inventor： Hironari KOJIMA

    IPC: H05K3/00

    CPC classification number: H05K3/108 ,  H05K3/181 ,  H05K3/383 ,  H05K3/384 ,  H05K2201/0344

    Abstract: A seed layer is formed on a top surface of an insulating layer so that a top surface of the seed layer has a predetermined roughness. A resist film is formed on the top surface of the seed layer, the resist film having an opening part through which a portion of the top surface of the seed layer corresponding to an area where a wire is formed is exposed. The wire is formed on the top surface of the seed layer by an electrolytic plating method using the seed layer as an electric supply layer. The resist film is removed after forming the wire. A portion of the seed layer on which the wire is not formed is removed.

    Abstract translation: 种子层形成在绝缘层的顶表面上，使种子层的顶表面具有预定的粗糙度。 在种子层的顶面上形成抗蚀剂膜，该抗蚀膜具有开口部，通过该开口部露出与形成有导线的区域对应的种子层的上表面的一部分。 通过使用种子层作为供电层的电解电镀法，在种子层的顶面上形成线。 形成导线后去除抗蚀剂膜。 除去未形成线的种子层的一部分。

    Method of forming resistors
    139.
    发明授权
    Method of forming resistors 失效
    形成电阻的方法

    公开(公告)号：US6136512A

    公开(公告)日：2000-10-24

    申请号：US325668

    申请日：1999-05-26

    Applicant: Wallace Dean Doeling

    Inventor： Wallace Dean Doeling

    IPC: H01C17/24 ,  H05K1/16 ,  H05K3/18 ,  G03F7/00

    CPC classification number: H05K1/167 ,  H01C17/2416 ,  H05K2201/0344 ,  H05K2203/073 ,  H05K3/181

    Abstract: A method is disclosed for forming resistors that are low cost, easy to manufacture and substantially within 5 percent of their desired value. In one aspect of the method, an electrically resistive material, such as nickel, is deposited directly on an insulating layer, such as a substrate. In preferred embodiments a conductive material, such as copper, is then deposited on the resistive material only at a location where a signal trace is desired. Using photo-imaging, signal traces are formed in the conductive and resistive materials. A resistor is created by forming a gap in the conductive material at a location where the resistor is desired. Current is thereby forced to flow through the resistive material at the location of the gap.

    Abstract translation: 公开了一种用于形成低成本，易于制造并且基本上在其所需值的5％内的电阻器的方法。 在该方法的一个方面，诸如镍的电阻材料直接沉积在诸如基底的绝缘层上。 在优选的实施例中，导电材料（例如铜）然后仅在需要信号迹线的位置上沉积在电阻材料上。 使用光成像技术，在导电和电阻材料中形成信号迹线。 通过在需要电阻器的位置处在导电材料中形成间隙来产生电阻器。 因此，电流在间隙的位置被迫流过电阻材料。

    Method for forming conductive traces and printed circuits made thereby
    140.
    发明授权
    Method for forming conductive traces and printed circuits made thereby 失效
    用于形成由此制成的导电迹线和印刷电路的方法

    公开(公告)号：US6117300A

    公开(公告)日：2000-09-12

    申请号：US113043

    申请日：1998-07-09

    Applicant: Derek Carbin ,  Wendy A. Herrick

    Inventor： Derek Carbin ,  Wendy A. Herrick

    IPC: B32B15/08 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46 ,  C25D5/02

    CPC classification number: H05K3/025 ,  H05K3/108 ,  H05K3/384 ,  H05K2201/0317 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2201/10477 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K3/4652 ,  Y10T29/49155

    Abstract: A method of forming circuit lines on a substrate by applying a roughened conductive metal layer using a copper foil carrier. The copper foil is etched away, leaving the roughened conductive metal embedded in the surface of the substrate. The conductive metal may be treated to remove an oxide layer. A photoresist may also be applied over the treated conductive metal layer to define a fine line circuit pattern. The photoresist defining the fine line circuit pattern is then removed to expose trenches in accordance with the desired circuit pattern. Copper is applied into the trenches over the exposed conductive metal, and the remaining photoresist, and conductive metal underlying the remaining photoresist, is removed to finish the fine line circuit pattern.

    Abstract translation: 通过使用铜箔载体涂布粗糙化的导电金属层，在基板上形成电路线的方法。 蚀刻掉铜箔，留下粗糙的导电金属嵌入衬底的表面。 可以处理导电金属以除去氧化物层。 还可以在经处理的导电金属层上施加光致抗蚀剂以限定细线电路图案。 然后去除限定细线电路图案的光致抗蚀剂，以根据期望的电路图案露出沟槽。 将铜施加到暴露的导电金属上的沟槽中，并且剩余的光致抗蚀剂和剩余光致抗蚀剂下面的导电金属被去除以完成细线电路图案。

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