公开(公告)号：US20040178508A1

公开(公告)日：2004-09-16

申请号：US10763267

申请日：2004-01-26

Applicant: Fujitsu Limited

Inventor： Takao Nishimura ,  Kazuyuki Aiba ,  Akira Takashima

IPC: H01L023/48

CPC classification number: H05K1/141 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/144 ,  H05K1/145 ,  H05K1/16 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked semiconductor device is disclosed that has a three-dimensional structure using general-purpose semiconductor device units (semiconductor devices) that are stacked with an interposer substrate being provided between an upper device unit and a lower device unit. The upper device unit includes a semiconductor device, a first wiring substrate, and an external connection terminal. The lower device unit includes a semiconductor device, a second wiring substrate, and a connection electrode that is prepared on the upper surface of the second wiring substrate. The interposer substrate includes a circuit board, a first conductive material connecting to the connection electrode, a second conductive material formed in a form position of the external connection terminal that is electrically connected to the second conductive material, and a third conductive material for electrically connecting the first conductive material and the second conductive material.

Abstract translation: 公开了一种堆叠半导体器件，其具有使用通用半导体器件单元（半导体器件）的三维结构，其中中间体衬底被堆叠设置在上部器件单元和下部器件单元之间。 上部装置单元包括半导体装置，第一布线基板和外部连接端子。 下部器件单元包括半导体器件，第二布线基板和准备在第二布线基板的上表面上的连接电极。 插入器基板包括电路板，连接到连接电极的第一导电材料，形成在电连接到第二导电材料的外部连接端子的形状位置的第二导电材料和用于电连接的第三导电材料 第一导电材料和第二导电材料。

公开(公告)号：US06727766B2

公开(公告)日：2004-04-27

申请号：US09971973

申请日：2001-10-05

Applicant: Tsutomu Ieki ,  Yutaka Ida

Inventor： Tsutomu Ieki ,  Yutaka Ida

IPC: H03B500

CPC classification number: H03B5/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0237 ,  H05K1/141 ,  H05K1/162 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/049 ,  H01L2924/00014

Abstract: A dielectric substrate, a transistor, which is an active device, a varactor diode, which is a frequency-variable device, are mounted on one main surface of a package substrate to configure an oscillator. The dielectric substrate is made from a large-dielectric-constant dielectric having high temperature stability. A microstrip-line resonator is formed by thin-film-electrode forming. The microstrip-line resonator and the transistor constitute an oscillating circuit.

Abstract translation: 作为有源器件的电介质基板，作为可变频器件的变容二极管，安装在封装基板的一个主表面上以构成振荡器。 电介质基板由具有高温度稳定性的大介电常数电介质制成。 微带线谐振器通过薄膜电极形成形成。 微带线谐振器和晶体管构成振荡电路。

公开(公告)号：US20040007384A1

公开(公告)日：2004-01-15

申请号：US10384308

申请日：2003-03-07

Applicant: Hitachi, Ltd.

Inventor： Tasao Soga ,  Hanae Hata ,  Tetsuya Nakatsuka ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H05K001/16

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/262 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/045 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05669

Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract translation: 在实现温度分级接合中的高温侧焊接的电子设备中，半导体器件与衬底之间的接合部分由Cu等金属球形成，并且由金属球和Sn形成的化合物 ，金属球通过化合物结合在一起。

公开(公告)号：US20030107444A1

公开(公告)日：2003-06-12

申请号：US09971973

申请日：2001-10-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsutomu Ieki ,  Yutaka Ida

IPC: H03B005/00

CPC classification number: H03B5/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0237 ,  H05K1/141 ,  H05K1/162 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/049 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a voltage controlled oscillator providing a strip line resonator in the inside layer of a multilayer substrate and less in the dispersion of oscillation frequency by humidity. SOLUTION: Polytetrafluoroethylene is used as the core material of the multilayer substrate. Since the polytetrafluoroethylene has smaller water absorptivity than glass epoxy, the change of dielectricity to the change of humidity. As a result, also the change of the resonant frequency of the strip line resonator formed in the inside layer of the multilayer substrate is small, as a result, also the change of oscillation frequency becomes small. Then, since the change of the oscillation frequency is small, control voltage sensitivity can be reduced, and thus, C/N characteristics is improved. Then, since also the property of the polytetrafluoroethylene material itself is small in dielectric loss comparing with the glass epoxy and also specific dielectricity is small, the Q of resonant system is improved, and thereby, the C/N characteristics is improved too.

Abstract translation: 要解决的问题：提供一种在多层基板的内层中提供带状线谐振器的压控振荡器，并且在通过湿度的振荡频率的分散中较少。 解决方案：使用聚四氟乙烯作为多层基板的芯材。 由于聚四氟乙烯具有比玻璃环氧树脂更小的吸水率，因此介电性变化对湿度的变化。 结果，形成在多层基板的内层中的带状线谐振器的谐振频率的变化也小，结果也振荡频率的变化也变小。 然后，由于振荡频率的变化小，所以可以降低控制电压灵敏度，从而提高C / N特性。 而且，与玻璃环氧树脂相比，由于聚四氟乙烯材料本身的介电损耗小，所以介电特性小，所以谐振系统的Q值提高，C / N特性也提高。

公开(公告)号：US20020171157A1

公开(公告)日：2002-11-21

申请号：US09880733

申请日：2001-06-13

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L023/48 ,  H01L029/40

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/10135 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81139 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract translation: 形成在半导体器件和衬底之间的接合部包括Cu等的金属球，Sn和金属球的化合物，金属球通过化合物结合在一起。

公开(公告)号：US20020105791A1

公开(公告)日：2002-08-08

申请号：US10091807

申请日：2002-03-06

Inventor： Joe A. Harrison ,  Bram Leader

IPC: H05K001/11 ,  H05K001/14

CPC classification number: G06F1/189 ,  H05K1/0263 ,  H05K1/141 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

公开(公告)号：US06392899B1

公开(公告)日：2002-05-21

申请号：US09676238

申请日：2000-09-29

Applicant: Joe A. Harrison ,  Bram Leader

Inventor： Joe A. Harrison ,  Bram Leader

IPC: H05K114

CPC classification number: G06F1/189 ,  H05K1/0263 ,  H05K1/141 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract translation: 用于向处理器传送电力的系统使得DC-DC转换器基板能够在Z轴方向上固定到处理器载体。 与转换器在基本上平行于母板表面的方向上插入处理器载体的系统相比，以这种方式将转换器组装到处理器的能力有助于组装。

公开(公告)号：US20020042214A1

公开(公告)日：2002-04-11

申请号：US09853279

申请日：2001-05-11

Inventor： Joe A. Harrison ,  Edward R. Stanford ,  Thomas G. Ruttan

IPC: H05K001/00 ,  H01R012/00 ,  H05K003/36

CPC classification number: H05K1/141 ,  G06F1/189 ,  H05K1/0263 ,  H05K3/325 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09345 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

公开(公告)号：US06189203B1

公开(公告)日：2001-02-20

申请号：US09288750

申请日：1999-04-08

Applicant: Randy T. Heinrich ,  Allen F. Rozman ,  Thang D. Truong ,  William L. Woods, Jr.

Inventor： Randy T. Heinrich ,  Allen F. Rozman ,  Thang D. Truong ,  William L. Woods, Jr.

IPC: H01F4106

CPC classification number: H05K1/165 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10234 ,  H05K2201/10257 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49126

Abstract: A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.

Abstract translation: 一种可表面安装的电源和一种制造电源的方法。 在一个实施例中，电源包括：（1）具有相对的上和下导电层（2）的衬底，下电气部件具有安装在下导电层上的第一焊盘上的第一引线，并受到能够分离 当电源通过回流焊接工艺时，从基板上降低电气部件，（3）具有安装在上导电层上的第二焊盘上的第二引线的上部电气部件，（4）位于第一引线附近的焊料， 较低的电气部件具有足够低的重量，使得当电源通过回流焊接工艺时，焊料的液态的表面张力足以保持较低的电气部件与下导电层接触;（5） 安装在基板上的平面磁性装置，该平面磁性装置具有由上和下导电层上的一部分导电迹线形成的绕组 以及通过所述基板的孔径并且靠近所述绕组设置的芯体，以及（6）连接到所述下导电层的衬底间导电安装件，所述衬底由具有高于焊料回流温度的熔点的材料组成，并且适于安装所述功率 供应到相邻基板并在其间提供导电路径，导电安装座分别包括在基板和相邻基板的界面处的第一和第二柔性焊接点。

公开(公告)号：US6147871A

公开(公告)日：2000-11-14

申请号：US195881

申请日：1998-11-19

Applicant: John R. DeWitt ,  Jay Henry Neer

Inventor： John R. DeWitt ,  Jay Henry Neer

IPC: G06F13/40 ,  H05K1/14 ,  H05K3/36 ,  H05K7/14 ,  G06F13/42 ,  H01R9/09 ,  H01R23/70

CPC classification number: G06F13/409 ,  H05K1/14 ,  H05K7/1445 ,  H05K7/1459 ,  H05K1/141 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K3/366

Abstract: A low profile riser card assembly for a computer system is provided by incorporating two uniaxial back to back peripheral connectors. The peripheral card connectors extend outwardly along a single axis from opposing sides of a riser card. The riser card is attached to a riser card connector mounted on the circuit board and is held in a perpendicular to the axis and in an upright position with respect to the circuit board. In the assembly of the present single invention, the uniaxial back to back peripheral card connectors are retained on the riser card in a parallel orientation with respect to the riser card connector to produce a low profile computer assembly.

Abstract translation: 通过结合两个单轴背靠背外围连接器提供了一种用于计算机系统的小型转接卡组件。 外围卡连接器沿着单个轴线从转接卡的相对侧向外延伸。 转接卡连接到安装在电路板上的转接卡连接器，并且被保持在垂直于轴线并且相对于电路板处于直立位置。 在本发明的组件中，单轴背靠背外围卡连接器以相对于转接卡连接器的平行方向保持在转接卡上，以产生低调的计算机组件。