Abstract:
A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.
Abstract:
A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.
Abstract:
Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.
Abstract:
A mold structure for molding a circuitry comprises a cavity to which a plurality of bus bars are juxtaposedly inserted provided with gap portions to which a resin material to be injected therethrough; and a plurality of holder pins provided on the respective gap portions and arranged alternatively in the juxtaposition direction of the plural bus bars to hold the respective bus bar to be inserted therebetween.
Abstract:
A novel method and apparatus for indicating a degree of manufacture of an insert molded component useable in an end use assembly by forming a removable appendage protruding from the insert molded component, or article, manufactured to an intermediate degree, the insert molded component having a lead frame at least partially embedded in a molded housing member, and the removable appendage coupled to at least one or both of the lead frame and the molded housing member, the lead frame having at least two electrical conductors coupled separably by a tie member, the removable appendage removable upon or after electrical isolation of the electrical conductors in a subsequent processing step, whereby the presence of the removable appendage is indicative that the electrical conductors are not electrically isolated, or that the insert molded component has not been tested or inspected subsequent to electrical isolation of the electrical conductors, and whereby the removable appendage is configured to prevent use of the article manufactured to the intermediate degree in the end use assembly.
Abstract:
Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.
Abstract:
Apparatus is provided for connecting the rear termination ends (32, 34) of connector contacts (12, 14) to wires (42, 44) of a cable (40) in a design where the solder connections are encased in molded plastic, which maintains the contacts so their axes (20, 22) extend precisely along forward-rearward directions. This is accomplished by providing a mold with an alignment mold part (110) with holders (114, 120) that either directly engage shoulders (160, 162) of the contacts or that engage shoulders (140, 142) formed on a circuit board (54) with holes (62) that closely receive rear termination ends (32) of a contact.
Abstract:
A method of simultaneously manufacturing a plurality of connectors involves:molding a resin to form a connector member assembly containing multiple connector members, each member having one or two opposite longitudinally elongated through-holes extending between front and rear faces of the member along opposite sides thereof;forming a first metal coating on the front and rear faces and on an inner surface of each through-hole;providing metal-platable and non-metal-platable regions on each first-metal-coated front and rear face;forming a second metal coating on the metal-platable regions to form conductive patterns and on each first-metal-plated inner surface to form a conductive inner surface;removing the first metal coating from the non-metal-platable regions to form non-conductive patterns;then detaching each connector member from the connector assembly, each detached member having one or two side faces containing the metal-plated inner surface of the one or two through-holes; andremoving the first and second metal coatings from a portion of each side face to form a side-face conductive pattern disposed in electrical communication with the conductive patterns of the front and rear faces.
Abstract:
The preferred embodiment apparatus employs an interior trim panel and an electrical harness for use in an automotive vehicle. In one aspect of the present invention, the interior trim panel has a generally rigid substrate covered by an aesthetically pleasing covering material. In another aspect of the present invention, an electrical harness is provided with integrally created switch contacts and integrally created connector terminals.
Abstract:
A gas assisted injection molded part includes internal cavities extending between two surfaces of the part. The cavities are plated for electrical conductivity after a surface cleaning and etching process. The part may be an automobile instrument panel wherein the internal cavities are plated to create a series of "bus" conductor lines. These lines carry power, ground and/or electrical signals over relatively large distances, allowing other components to attach at points along the structure eliminating the need for discrete wiring and wire harness interconnect assemblies.