Method and apparatus for forming a metallic feature on a substrate
    131.
    发明申请
    Method and apparatus for forming a metallic feature on a substrate 失效
    在基板上形成金属特征的方法和装置

    公开(公告)号:US20020119251A1

    公开(公告)日:2002-08-29

    申请号:US10081768

    申请日:2002-02-22

    Abstract: A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.

    Abstract translation: 一种在基板上形成金属特征的方法,包括以下步骤:提供具有凸起区域的印模; 在包括其凸起区域的印模的选定区域上沉积催化剂颗粒; 提供衬底; 将印模施加到基板上,使得印模的凸起区域在基板中引起相应的凹入区域,并且至少一些催化颗粒被转移到基板的选定区域; 并镀覆所述基板的所选区域。

    Methods of producing resin moldings
    133.
    发明授权
    Methods of producing resin moldings 失效
    生产树脂模制品的方法

    公开(公告)号:US06274070B1

    公开(公告)日:2001-08-14

    申请号:US09589068

    申请日:2000-06-08

    Abstract: Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.

    Abstract translation: 提供对环境几乎没有负面影响的导电树脂组合物,包括导电树脂组合物的导电部分和绝缘部分的树脂模制品及其制备方法。 树脂成型的生产成本低。 导电树脂组合物通过将热塑性或热固性树脂与低熔点合金捏合而形成,其中低熔点合金可与树脂成型并且基本上由锡组成并且不含铅。 通过热塑性或热固性树脂的初级成型形成绝缘体,并通过二次成型与导电性树脂组合物的导电性部分一体化; 或者,通过导电树脂组合物的一次成型形成导电部件,并且通过二次成型与导电部件一体形成绝缘体。

    Mold structure used in method of molding circuitry
    134.
    发明授权
    Mold structure used in method of molding circuitry 有权
    用于模制电路的模具结构

    公开(公告)号:US06273700B1

    公开(公告)日:2001-08-14

    申请号:US09291746

    申请日:1999-04-14

    Abstract: A mold structure for molding a circuitry comprises a cavity to which a plurality of bus bars are juxtaposedly inserted provided with gap portions to which a resin material to be injected therethrough; and a plurality of holder pins provided on the respective gap portions and arranged alternatively in the juxtaposition direction of the plural bus bars to hold the respective bus bar to be inserted therebetween.

    Abstract translation: 用于模制电路的模具结构包括一个空腔,多个汇流条并置到其上,设有间隙部分,待注入的树脂材料穿过该间隙; 以及设置在各个间隙部分上的多个保持器销,并且以多个母线的并置方向交替布置,以保持相应的母线插入其间。

    Method and apparatus for indicating degree of manufacture of an article
    135.
    发明授权
    Method and apparatus for indicating degree of manufacture of an article 失效
    用于指示制品的制造程度的方法和装置

    公开(公告)号:US06248424B1

    公开(公告)日:2001-06-19

    申请号:US08819589

    申请日:1997-03-17

    Abstract: A novel method and apparatus for indicating a degree of manufacture of an insert molded component useable in an end use assembly by forming a removable appendage protruding from the insert molded component, or article, manufactured to an intermediate degree, the insert molded component having a lead frame at least partially embedded in a molded housing member, and the removable appendage coupled to at least one or both of the lead frame and the molded housing member, the lead frame having at least two electrical conductors coupled separably by a tie member, the removable appendage removable upon or after electrical isolation of the electrical conductors in a subsequent processing step, whereby the presence of the removable appendage is indicative that the electrical conductors are not electrically isolated, or that the insert molded component has not been tested or inspected subsequent to electrical isolation of the electrical conductors, and whereby the removable appendage is configured to prevent use of the article manufactured to the intermediate degree in the end use assembly.

    Abstract translation: 一种新型的方法和装置,用于通过形成从中间程度制造的插入成型部件或制品突出的可移除附件来指示可用于最终使用组件的嵌入成型部件的制造程度,所述插入成型部件具有引线 框架至少部分地嵌入在模制的壳体构件中,并且可移除的附属物联接到引线框架和模制的壳体构件中的至少一个或两个,引线框架具有至少两个电连接构件可分离的电导体, 在随后的处理步骤中,在电导体的电绝缘之后或之后可移除的附件,由此可移除附件的存在指示电导体不是电隔离的,或者插入模制部件在电气之后未被测试或检查 电导体的隔离,并且由此可移除的附件是配置的 以防止在最终使用组件中使用制造成中等程度的制品。

    Resin compositions, resin moldings and their methods of production
    136.
    发明授权
    Resin compositions, resin moldings and their methods of production 有权
    树脂组合物,树脂模制品及其生产方法

    公开(公告)号:US6096245A

    公开(公告)日:2000-08-01

    申请号:US131337

    申请日:1998-08-07

    Abstract: Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.

    Abstract translation: 提供对环境几乎没有负面影响的导电树脂组合物,包括导电树脂组合物的导电部分和绝缘部分的树脂模制品及其制备方法。 树脂成型的生产成本低。 导电树脂组合物通过将热塑性或热固性树脂与低熔点合金捏合而形成,其中低熔点合金可与树脂成型并且基本上由锡组成并且不含铅。 通过热塑性或热固性树脂的初级成型形成绝缘体,并通过二次成型与导电性树脂组合物的导电性部分一体化; 或者,通过导电树脂组合物的一次成型形成导电部件,并且通过二次成型与导电部件一体形成绝缘体。

    Connector contact mold-positioning
    137.
    发明授权
    Connector contact mold-positioning 失效
    连接器接触模具定位

    公开(公告)号:US6083039A

    公开(公告)日:2000-07-04

    申请号:US87697

    申请日:1998-06-01

    Abstract: Apparatus is provided for connecting the rear termination ends (32, 34) of connector contacts (12, 14) to wires (42, 44) of a cable (40) in a design where the solder connections are encased in molded plastic, which maintains the contacts so their axes (20, 22) extend precisely along forward-rearward directions. This is accomplished by providing a mold with an alignment mold part (110) with holders (114, 120) that either directly engage shoulders (160, 162) of the contacts or that engage shoulders (140, 142) formed on a circuit board (54) with holes (62) that closely receive rear termination ends (32) of a contact.

    Abstract translation: 提供了用于将连接器触头(12,14)的后端接端(32,34)连接到电缆(40)的导线(42,44)的设备,其中焊料连接被封装在模塑塑料中,该模制塑料保持 触点使得它们的轴线(20,22)沿前后方向精确地延伸。 这通过为模具提供具有保持器(114,120)的对准模具部件(110)来实现,所述保持器直接接合触头的肩部(160,162)或接合形成在电路板上的肩部(140,142) 54),其具有紧密接收触点的后端接端(32)的孔(62)。

    Method of manufacturing connectors
    138.
    发明授权
    Method of manufacturing connectors 失效
    制造连接器的方法

    公开(公告)号:US5979048A

    公开(公告)日:1999-11-09

    申请号:US813893

    申请日:1997-03-07

    Abstract: A method of simultaneously manufacturing a plurality of connectors involves:molding a resin to form a connector member assembly containing multiple connector members, each member having one or two opposite longitudinally elongated through-holes extending between front and rear faces of the member along opposite sides thereof;forming a first metal coating on the front and rear faces and on an inner surface of each through-hole;providing metal-platable and non-metal-platable regions on each first-metal-coated front and rear face;forming a second metal coating on the metal-platable regions to form conductive patterns and on each first-metal-plated inner surface to form a conductive inner surface;removing the first metal coating from the non-metal-platable regions to form non-conductive patterns;then detaching each connector member from the connector assembly, each detached member having one or two side faces containing the metal-plated inner surface of the one or two through-holes; andremoving the first and second metal coatings from a portion of each side face to form a side-face conductive pattern disposed in electrical communication with the conductive patterns of the front and rear faces.

    Abstract translation: 同时制造多个连接器的方法包括:模制树脂以形成包含多个连接器构件的连接器构件组件,每个构件具有一个或两个相对的纵向细长的通孔,其在构件的相对侧的前后面之间延伸 ; 在每个通孔的前表面和后表面以及内表面上形成第一金属涂层; 在每个第一金属涂覆的前后表面上提供金属镀层和非金属镀层区域; 在所述金属镀层区域上形成第二金属涂层以形成导电图案,并在每个第一金属镀覆的内表面上形成导电内表面; 从非金属可镀区域去除第一金属涂层以形成非导电图案; 然后将每个连接器元件从连接器组件分离,每个分离元件具有一个或两个侧面,该侧面包含一个或两个通孔的金属镀覆的内表面; 以及从每个侧面的一部分去除所述第一和第二金属涂层以形成设置成与所述前表面和所述后表面的导电图案电连通的侧面导电图案。

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