公开(公告)号：US06829148B2

公开(公告)日：2004-12-07

申请号：US10179552

申请日：2002-06-24

Applicant: David A. Nelson ,  Tuan N. Nguyen ,  Chris L. Joseph ,  Glen M. Whiting

Inventor： David A. Nelson ,  Tuan N. Nguyen ,  Chris L. Joseph ,  Glen M. Whiting

IPC: H05K702

CPC classification number: H05K9/0039 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/10409 ,  Y10T29/49155

Abstract: A circuit on a printed circuit board transmits radio frequency (RF) signals. A modulator operatively coupled to the printed circuit board modulates a signal to be transmitted by modulating an information signal onto a carrier signal. A ground plane attaches to edges and to first and second surfaces of the printed circuit board. The ground plane electrically connects to components of the modulator. A power transistor physically attaches to the printed circuit board and electrically connects to the ground plane through a slot in the printed circuit board. The ground plane provides a suitable ground reference potential for both the modulator and the power transistor without individually constructed circuit boards for each. A ground isolation barrier formed on the ground plane may prevent “cross talk” between the modulator and the power transistor.

Abstract translation: 印刷电路板上的电路传输射频（RF）信号。 可操作地耦合到印刷电路板的调制器通过将信息信号调制到载波信号上来调制要发送的信号。 接地平面连接到印刷电路板的边缘和第一和第二表面。 接地平面电连接到调制器的组件。 功率晶体管物理地连接到印刷电路板，并通过印刷电路板中的槽电连接到接地平面。 接地平面为调制器和功率晶体管提供合适的接地参考电位，而不需要为每个电路板提供单独的电路板。 在接地平面上形成的接地隔离屏障可以防止调制器和功率晶体管之间的“串扰”。

公开(公告)号：US20040173915A1

公开(公告)日：2004-09-09

申请号：US10800058

申请日：2004-03-12

Inventor： Teck Kheng Lee

IPC: H01L023/48

CPC classification number: H05K1/112 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/28 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/0969 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A solder ball pad for mounting and connecting of electronic devices and, more particularly, apparatus and methods providing an improved solder ball pad structure on a substrate, such as a printed circuit board (nullPCBnull) or a semiconductor die, while enabling better use of the spaces between adjacent solder ball pads and at the same time providing increased surface area for bonding to a solder ball. More particularly, the inventive solder ball pad structure comprises a terminal pad exposed through an aperture in an insulative mask having a bond pad layer comprising at least another metal layer formed over, at most, a portion of the exposed portion of the terminal pad. Methods of manufacture and substrates incorporating same are also disclosed.

Abstract translation: 一种用于安装和连接电子器件的焊球垫，更具体地，在诸如印刷电路板（“PCB”）或半导体管芯之类的衬底上提供改进的焊球焊盘结构的设备和方法，同时能够更好地使用 的相邻焊球之间的空间，并且同时提供用于粘合到焊球的增加的表面积。 更具体地，本发明的焊球焊盘结构包括通过绝缘掩模中的孔暴露的端子焊盘，其具有接合焊盘层，该接合焊盘层至少包括在端子焊盘的暴露部分的至多一部分上形成的另一金属层。 还公开了制造方法和结合其的基板。

公开(公告)号：US06720501B1

公开(公告)日：2004-04-13

申请号：US09060308

申请日：1998-04-14

Applicant: Roy Henson

Inventor： Roy Henson

IPC: H05K111

CPC classification number: H05K3/4623 ,  H05K1/0262 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09663 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multilayer printed circuit board having clustered blind vias in power layers to facilitate the routing of signal traces in signal layers. A portion of the blind vias in the power layers are grouped together to form a cluster of blind vias. Corresponding signal routing channels are provided in the signal layers and aligned with the cluster of blind vias in the power layers to permit routing of signal traces or signal circuitry therethrough. A method of manufacturing the multilayered printed circuit board includes assembling a first subassembly of power layers, forming a group of clustered power vias through the first subassembly, assembling a second subassembly of signal layers, combining the first subassembly with the second subassembly such that the clustered vias in the first subassembly align with signal routing channels in the second subassembly, forming signal vias that extend through the first and second subassemblies, and seeding or plating the power and signal vias.

Abstract translation: 多层印刷电路板，其具有功率层中的聚集盲孔，以便于信号层中的信号迹线的路由。 功率层中的盲孔的一部分被分组在一起以形成一组盲孔。 相应的信号路由信道被提供在信号层中并且与电力层中的盲通道簇对齐，以允许信号迹线或信号电路通过其路由。 一种制造多层印刷电路板的方法包括组装功率层的第一子组件，通过第一子组件形成一组聚集的电源通孔，组装信号层的第二子组件，将第一子组件与第二子组件组合，使得集群 第一子组件中的通孔与第二子组件中的信号路由通道对准，形成延伸穿过第一和第二子组件的信号通孔，以及播种或电镀功率和信号通孔。

公开(公告)号：US06706974B2

公开(公告)日：2004-03-16

申请号：US10053810

申请日：2002-01-18

Applicant: Juan Chen ,  Adam J. Norman ,  Ponniah Ilavarasan

Inventor： Juan Chen ,  Adam J. Norman ,  Ponniah Ilavarasan

IPC: H05K111

CPC classification number: H05K1/0234 ,  H05K1/0227 ,  H05K1/095 ,  H05K1/167 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/0969

Abstract: A method of reducing electromagnetic interference and improving signal quality in printed circuit boards with plane splits is described. The use of a lossy slot filling is described. The lossy filling is applied above plane splits and squeezed into the slots. The lossy material helps to damp antenna resonance.

Abstract translation: 描述了一种降低电磁干扰并提高具有平面分割的印刷电路板中的信号质量的方法。 描述了使用有损插槽填充。 有损填充应用于平面分裂上方并挤压入槽中。 有损耗的材料有助于减少天线谐振。

公开(公告)号：US20040004293A1

公开(公告)日：2004-01-08

申请号：US10603812

申请日：2003-06-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD

Inventor： Kei Murayama

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H05K1/111 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/4602 ,  H05K2201/09663 ,  H05K2201/09772 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2224/0401

Abstract: A semiconductor package provided with an interconnection layer including an interconnection pattern and pad formed on an insulating substrate or insulating layer, a protective layer covering the interconnection layer except at the portion of the pad and the insulating substrate or insulating layer, and an external connection terminal bonded with the pad exposed from the protective layer, the pad to which the external connection terminal is bonded being comprised of a plurality of pad segments, sufficient space being opened for passing an interconnection between pad segments, and the pad segments being comprised of at least one pad segment connected to an interconnection and other pad segments not connected to interconnections.

公开(公告)号：US06674018B2

公开(公告)日：2004-01-06

申请号：US09951672

申请日：2001-09-13

Applicant: Hideo Yumi

Inventor： Hideo Yumi

IPC: H01R1204

CPC classification number: H05K3/341 ,  H01R4/64 ,  H01R12/57 ,  H01R13/24 ,  H01R43/0256 ,  H05K1/0215 ,  H05K2201/09663 ,  H05K2201/1031 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

Abstract: Proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Abstract translation: 通过回流焊接解决将接地端子焊接到印刷电路板上的问题，将印刷电路板正确接地到与通过焊接接地端子形成的印刷电路板上的接地端子的安装结构相关联 印刷电路板。 在接地端子的接合部分内形成具有不同表面积的两个接合表面，并且通过使用具有对应于表面积的量的焊料将接地端子焊接到与接合表面相对应的印刷电路板上的导电图案上 的每个接合面。 另外，作为接地端子的接触部的弹性变形的中心的弯曲区域形成为远离接合部的相对小的接合面的预定距离。

公开(公告)号：US06657135B2

公开(公告)日：2003-12-02

申请号：US09959482

申请日：2002-02-04

Applicant: Kenichiro Suetsugu ,  Masuo Koshi ,  Kenichiro Todoroki ,  Shunji Hibino ,  Hiroaki Takano ,  Mikiya Nakata ,  Yukio Maeda

Inventor： Kenichiro Suetsugu ,  Masuo Koshi ,  Kenichiro Todoroki ,  Shunji Hibino ,  Hiroaki Takano ,  Mikiya Nakata ,  Yukio Maeda

IPC: H01R1204

CPC classification number: H05K3/3447 ,  H05K1/0293 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0979 ,  H05K2201/099

Abstract: A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

Abstract translation: 本发明的连接结构具有贯穿孔的通孔，形成在通孔周围的台面，以及从电子部件延伸设置在通孔中的引线。 所述平台包括形成在所述通孔的壁面上的壁面陆部，以及分别形成在所述板的前后表面上的前表面和后表面接合部。 连接陆地和铅的圆角包括分别与前表面和后表面陆部接触的上下圆角部分。 上部圆角部分的轮廓小于下圆角部分的轮廓，并且不小于通孔的轮廓。 因此，使用无铅焊料材料时，有效地减少了剥离的发生。

公开(公告)号：US06648693B1

公开(公告)日：2003-11-18

申请号：US09391974

申请日：1999-09-08

Applicant: William K. Hogan ,  David Peter Gaio ,  Frank Ovanessians ,  Scott Michael Branch

Inventor： William K. Hogan ,  David Peter Gaio ,  Frank Ovanessians ,  Scott Michael Branch

IPC: H01R2400

CPC classification number: H01R13/193 ,  G02B6/4246 ,  G02B6/4284 ,  H01R12/57 ,  H01R13/2442 ,  H05K1/117 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09663 ,  Y10S439/923

Abstract: An electrical connector system has two connectors, one of which is included in a module mateable with the other connector in a pluggable manner. The other connector includes a body and two or more electrical contacts. The body of that electrical connector includes a spring that provides a combined lock-down force and kick-out force. The lock-down force biases the module against the other connector, thereby providing a secure electrical and mechanical connection. The kick-out force biases the module away from the other connector to separate or eject the module when a user actuates a release mechanism. The module also includes a slot that engages a projection on the other connector to promote alignment of the mating electrical contacts.

Abstract translation: 电连接器系统具有两个连接器，其中一个连接器被包括在可插拔方式与另一连接器配合的模块中。 另一个连接器包括主体和两个或更多个电触头。 该电连接器的主体包括提供组合的锁定力和推出力的弹簧。 锁定力将模块偏压抵靠另一个连接器，从而提供安全的电气和机械连接。 当用户致动释放机构时，推出力将模块偏离另一连接器以分离或弹出模块。 该模块还包括与另一连接器上的突起接合以促进配合电触点对准的槽。

公开(公告)号：US20030210113A1

公开(公告)日：2003-11-13

申请号：US10455454

申请日：2003-06-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Seiji Hidaka ,  Michiaki Ota ,  Shin Abe

IPC: H01P003/08 ,  H01P001/203

CPC classification number: H01P3/081 ,  H01P1/203 ,  H01P1/2039 ,  H01P7/082 ,  H05K1/0239 ,  H05K1/0242 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09781

Abstract: A transmission line, a resonator, a filter, a duplexer, and a communication apparatus efficiently minimize power losses due to edge effects, thereby having superior loss-reduction characteristics. A continuous line and a plurality of thin lines each having a predetermined length and branching from both sides of the continuous line are formed on a dielectric substrate. With this structure, edges of the individual thin lines substantially do not exist, so that losses due to edge effects can be efficiently minimized.

Abstract translation: 传输线，谐振器，滤波器，双工器和通信设备有效地最小化由于边缘效应引起的功率损耗，从而具有优异的损耗降低特性。 在电介质基板上形成连续线和多条细长线，每条细长线具有预定长度并从连续线的两侧分支。 利用这种结构，各个细线的边缘基本上不存在，从而可以有效地最小化由于边缘效应引起的损失。

公开(公告)号：US06599617B2

公开(公告)日：2003-07-29

申请号：US09891841

申请日：2001-06-26

Applicant: Yoshinari Matsuda

Inventor： Yoshinari Matsuda

IPC: B32B300

CPC classification number: H05K3/4069 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09981 ,  H05K2203/1453 ,  Y10T428/24917

Abstract: Copper foil lands provided with a through-hole filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands normally occurs to obtain a copper-plated through-hole in both sides of a printed wiring board using a paper-phenol substrate, wherein adhesion strength between the copper foil lands and the copper paste is enhanced.

Abstract translation: 设置有填充有铜膏的通孔的铜箔焊盘在通孔的周围设置有环形中空部分，其中铜膏和铜箔焊盘之间的剥离通常发生，以获得镀铜的通孔 在使用纸 - 酚基板的印刷线路板的两侧的孔中，铜箔焊盘和铜浆之间的粘合强度增强。