Abstract:
A glass ceramic composition which can be fired at a low temperature and which has a high dielectric constant, a relatively small thermal expansion coefficient and a small temperature coefficient of dielectric constant is provided. The glass ceramic composition contains about 5% to 75% by weight of TiO2 powder, about 5% to 75% by weight of CaTiSiO5 powder and about 15% to 50% by weight of glass powder.
Abstract:
The invention relates to a filter arrangement for separating radio frequency energy from signal energy in a signal line. The signal line extends at least partly in a first layer of a multi-layer printed circuit board. A grounded surface is arranged in a second layer of the printed circuit board. The signal line to be filtered is interrupted in the first layer in the filter region and continued in a third layer, the second and the third layers being located on opposite sides of the first layer. Due to the skin effect the radio frequency energy will be concentrated on the side of the signal line facing the grounded surface. The side of the signal line remote from the grounded surface is then to a large extent decoupled from radio frequency energy, such that the actual signal path can be continued without being disturbed by radio frequency energy.
Abstract:
An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise.
Abstract:
A solid image pickup apparatus comprises a flexible printed circuit board. A solid image pickup element and an optical lens held in a casing are disposed on the flexible printed circuit board. The flexible printed circuit board has a surface on which a capacitor is formed.
Abstract:
A printed circuit board (1) includes a plane substrate (10) having several insulated layers (11, 12, 13) used to dispose with conductive material. A row of footprints (2) used to connect to other electrical devices is disposed on an outer insulated layer (11) of the printed circuit board (1). These footprints (2) are paired and each is connected to a medial trace (5) formed on one of the intermediate layers (12) by a metalized hole (14). And the medial traces (C1, C1null) respectively connected to footprints (2) of the same pair (T1, R1) are formed on different intermediate layers (12) and aligned with each other for a predetermined distance. At least two traces (C3, C3null) connected to the chosen pair (T3, R3) are detoured to pass through a corresponding area aligned with the footprints (2) of their adjacent pair (T2, R2) mounted on the upper face (11) and are formed a corresponding footprint (R3null, T3null) over there respectively, so that the corresponding footprint (R3null, T3null) can be coupled with the footprints (T3, R3) to improve the noised signals received by the chosen pair (T3, R3) and its adjacent pair (T2, R2).
Abstract:
Multilayer circuit boards include compensator networks configured in one or more conductor layers. A signal trace is configured in one or more layers to transmit an electrical signal from an input to an output and the compensator network is situated at at least one location on the trace to provide compensation for frequency dependent signal propagation losses or distortions such as those due to dielectric loss. In one example, the compensator includes a high frequency path provided by a series capacitance formed by conductor layers that include interleaved digits. Transmitters that include such compensators provide predistorted signals that can be matched or otherwise associated with anticipated propagation losses and distortions. Methods of evaluating dielectric losses include propagating electrical signals through such compensators and along a trace defined with respect to a dielectric under test and determining an associated compensation.
Abstract:
A wiring board includes a signal transmission circuit designed as a distributed constant circuit. The signal transmission circuit includes a first transmission line connecting a first electric component and a second electric component, and a second transmission line connecting the second electric component to a terminator resistor of the distributed constant circuit. At least the first transmission line includes a plurality of signal lines arranged in parallel, which transmit a signal in parallel.
Abstract:
A variable capacitor is formed by a multilayer circuit board having a plurality of dielectric layers; a first conductive plate, provided within the multilayer circuit board, for serving as one electrode of the variable capacitor; a second conductive plate, provided within the multilayer circuit board, for serving as the other electrode of the variable capacitor; a plurality of third conductive plates provided between the first conductive plate and the second conductive plate; and a plurality of switching means provided for grounding the third conductive plates selectively.
Abstract:
An improved delay line with an input and an output is disclosed wherein a signal passing through the delay line from the input to the output can be optimized regarding the delay line component size, delay time, and signal configuration. The design and use of more than one impedance conductor is taught. The impedance conductors are arranged in specific alignments with each other and with dielectric bases to result in reduced component size, increased delay time, and to adjust the signal configuration. Further optimization of these features is taught through the use of a shield cover in specific alignment to the impedance conductors and dielectric bases.
Abstract:
The object of this invention is to minimize a simultaneous switching noise of the mutual inductor on PCB and a noise generated by large buffers' simultaneous switching. An instant large current in the power line is half-divided flowing through two different but closely coupled layers in opposite directions. This configuration is effective to minimize the simultaneous switching noise. This mutual inductance between two power layers enables us to significantly minimize the switching noise.