公开(公告)号：US20130213707A1

公开(公告)日：2013-08-22

申请号：US13401028

申请日：2012-02-21

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: H05K7/06 ,  C07F9/50

CPC classification number: C07F9/5022 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09872 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T428/23986

Abstract: A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring.

Abstract translation: 公开了一种包含改性多孔二氧化硅颗粒的保形涂层。 诸如MCM-14或SBA-15的多孔二氧化硅颗粒用硫吸收官能团改性，例如与多孔二氧化硅颗粒中的硅原子共价结合的膦化合物。 包含改性多孔二氧化硅颗粒的保形涂层可以施加到电路部件的金属布线区域，硫吸气功能可以防止大气中的硫渗透到金属布线的保形涂层。

公开(公告)号：US08493749B2

公开(公告)日：2013-07-23

申请号：US12777775

申请日：2010-05-11

Applicant: Scott Myers ,  Douglas Weber

Inventor： Scott Myers ,  Douglas Weber

IPC: H05K9/00

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K9/0024 ,  H05K2201/09872 ,  H05K2203/1311 ,  Y10T29/49146

Abstract: This is directed to an EMI shield constructed from a conformal coating. A circuit board can include electronic components for which EMI shielding is required. To provide such shielding in a space-efficient manner, a first non-conductive conformal coating can be placed over the circuit board and the electronic components. A second conductive conformal coating can then be placed over the first such that at least portions of the second coating around the periphery of the electronic components are electrically coupled to the circuit board.

Abstract translation: 这是针对由保形涂层构成的EMI屏蔽。 电路板可以包括需要EMI屏蔽的电子部件。 为了以空间有效的方式提供这种屏蔽，可以在电路板和电子部件上放置第一非导电保形涂层。 然后可以将第二导电保形涂层放置在第一导电保形涂层上，使得围绕电子部件的周边的第二涂层的至少一部分电耦合到电路板。

公开(公告)号：US08276268B2

公开(公告)日：2012-10-02

申请号：US12263874

申请日：2008-11-03

Applicant: Christopher James Kapusta ,  Donald Paul Cunningham

Inventor： Christopher James Kapusta ,  Donald Paul Cunningham

IPC: H05K3/30 ,  H05K3/10

CPC classification number: H05K1/0218 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

Abstract translation: 公开了一种形成用于电气系统的图案化保形结构的系统和方法。 共形结​​构包括形成为符合电气系统的表面的电介质涂层，其中电介质涂层具有位于电气系统表面上的接触焊盘上的多个开口。 共形结​​构还包括层叠在电介质涂层上和接触焊盘上的图案化导电涂层，使得在图案化的导电涂层和接触焊盘之间形成电连接。 图案化导电涂层包括互连系统，屏蔽结构和热路径中的至少一个。

公开(公告)号：US20120091456A1

公开(公告)日：2012-04-19

申请号：US13211131

申请日：2011-08-16

Applicant: Matthew KELLEY ,  Christian Adams ,  Richard Reim

Inventor： Matthew KELLEY ,  Christian Adams ,  Richard Reim

IPC: H01L31/0368

CPC classification number: H01L23/573 ,  H01L27/305 ,  H01L27/308 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0275 ,  H05K3/284 ,  H05K2201/09872 ,  H01L2924/00

Abstract: A conformal electro-magnetic (EM) detector and a method of applying such a detector are provided herein as well as variations thereof Variations include, but are not limited to, single-element, area detectors; an array of multiple active elements.

Abstract translation: 本文提供了适形电磁（EM）检测器和应用这种检测器的方法及其变型。变化包括但不限于单元件区域检测器; 多个活动元素的数组。

公开(公告)号：US20120069523A1

公开(公告)日：2012-03-22

申请号：US13301941

申请日：2011-11-22

Applicant: Christopher James Kapusta ,  Donald Paul Cunningham

Inventor： Christopher James Kapusta ,  Donald Paul Cunningham

IPC: H05K7/20 ,  H05K7/10

CPC classification number: H05K1/0218 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

Abstract translation: 公开了一种形成用于电气系统的图案化保形结构的系统和方法。 共形结​​构包括形成为符合电气系统的表面的电介质涂层，其中电介质涂层具有位于电气系统表面上的接触焊盘上的多个开口。 共形结​​构还包括层叠在电介质涂层上和接触焊盘上的图案化导电涂层，使得在图案化的导电涂层和接触焊盘之间形成电连接。 图案化导电涂层包括互连系统，屏蔽结构和热路径中的至少一个。

公开(公告)号：US20120020039A1

公开(公告)日：2012-01-26

申请号：US13163533

申请日：2011-06-17

Applicant: Romain Coffy ,  Jean-François Sauty

Inventor： Romain Coffy ,  Jean-François Sauty

IPC: H05K7/02 ,  H05K3/00 ,  H05K9/00

CPC classification number: H05K9/0022 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/388 ,  H05K2201/0179 ,  H05K2201/09872 ,  Y10T29/49124 ,  H01L2224/81 ,  H01L2924/00

Abstract: A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.

Abstract translation: 一种表面安装的屏蔽多组件组件，包括其上组装有几个电子部件的晶片; 绝缘层，其以厚度小于所述电子部件的高度的方式平坦地沉积在所述结构上，包括在所述晶片的触点上露出的至少一个开口; 覆盖绝缘层和所述至少一个开口的导电屏蔽层; 以及覆盖导电层的树脂层。

公开(公告)号：US20110198115A1

公开(公告)日：2011-08-18

申请号：US13025658

申请日：2011-02-11

Applicant: Yukihiro AZUMA ,  Seiichi TAJIMA ,  Shigeru ASAMI ,  Hiroki HARA ,  Shuichi TAKIZAWA ,  Kenichi KAWABATA

Inventor： Yukihiro AZUMA ,  Seiichi TAJIMA ,  Shigeru ASAMI ,  Hiroki HARA ,  Shuichi TAKIZAWA ,  Kenichi KAWABATA

IPC: H05K1/16 ,  H05K3/34

CPC classification number: H05K3/284 ,  H01L23/3135 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0209 ,  H05K3/3431 ,  H05K2201/0116 ,  H05K2201/0715 ,  H05K2201/09872 ,  Y10T29/49144

Abstract: An electronic component built-in module includes an electronic component, a substrate on which the electronic component is mounted, a first resin covering the electronic component and the substrate, and a second resin covering the surface of the first resin. The first resin is formed of a resin including pores. The first resin is formed so that the thickness of the first resin on an area where the electronic component is not mounted is larger than that on an area where the electronic component is mounted on the surface of the substrate. A porosity of the second resin is smaller than that of the first resin.

Abstract translation: 电子部件内置模块包括电子部件，安装有电子部件的基板，覆盖电子部件和基板的第一树脂和覆盖第一树脂的表面的第二树脂。 第一树脂由包括孔的树脂形成。 第一树脂形成为使得未安装电子部件的区域上的第一树脂的厚度大于在电子部件安装在基板的表面上的区域的厚度。 第二树脂的孔隙率小于第一树脂的孔隙率。

公开(公告)号：US20110189381A1

公开(公告)日：2011-08-04

申请号：US12696328

申请日：2010-01-29

Applicant: Dylan Joseph Boday ,  Joseph Kuczynski ,  Mark Anthony Marnell ,  Robert Ernst Meyer, III ,  Timothy Jerome Tofil

Inventor： Dylan Joseph Boday ,  Joseph Kuczynski ,  Mark Anthony Marnell ,  Robert Ernst Meyer, III ,  Timothy Jerome Tofil

IPC: B05D3/00 ,  B32B15/08 ,  B32B27/38 ,  B32B27/30 ,  C09D5/08 ,  C08G77/395

CPC classification number: H05K3/284 ,  B32B15/08 ,  B32B27/30 ,  B32B27/38 ,  C08G77/395 ,  C08K5/5313 ,  C09D5/086 ,  C09D7/63 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09872 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T428/31504 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31699 ,  Y10T428/31935

Abstract: An apparatus includes an electronic component mounted on a substrate and metal conductors electrically connecting the electronic component. A conformal coating overlies the metal conductors and comprises a polymer into which a phosphine compound is impregnated and/or covalently bonded. Accordingly, the conformal coating is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. That is, the phosphine compound in the polymer reacts with any corrosion inducing sulfur component in the air and prevents the sulfur component from reacting with the underlying metal conductors. Preferably, the phosphine compound in the polymer does not react with other components in the air (e.g., carbon dioxide) which would otherwise deplete its availability for the target reaction. The phosphine compound may be rendered completely non-volatile by covalently bonding it directly into the polymer backbone.

Abstract translation: 一种装置包括安装在基板上的电子部件和电连接电子部件的金属导体。 保形涂层覆盖在金属导体上并且包含聚合物，磷化合物被浸渍和/或共价键合到该聚合物中。 因此，保形涂层能够保护金属导体免受空气中的硫成分（例如元素硫，硫化氢和/或硫氧化物）引起的腐蚀。 也就是说，聚合物中的膦化合物与空气中的任何腐蚀诱导硫成分反应，并防止硫成分与下面的金属导体反应。 优选地，聚合物中的膦化合物不与空气中的其它组分（例如二氧化碳）反应，否则其将耗尽其用于目标反应的可用性。 膦化合物可以通过将其直接共价键合到聚合物主链中而使其完全不挥发。

公开(公告)号：US07981730B2

公开(公告)日：2011-07-19

申请号：US12169964

申请日：2008-07-09

Applicant: Jinbang Tang ,  Darrel R. Frear ,  Scott M. Hayes ,  Douglas G. Mitchell

Inventor： Jinbang Tang ,  Darrel R. Frear ,  Scott M. Hayes ,  Douglas G. Mitchell

IPC: H01L23/552 ,  H05K3/10

CPC classification number: H05K1/185 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/05 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2203/0152 ,  H05K2203/1322 ,  H05K2203/1469 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/53548 ,  H01L2224/82 ,  H01L2924/00

Abstract: An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive tape (2), and then sequentially depositing an insulating layer (15) and a conductive shielding layer (16) before encapsulating the modules with a molding compound (17). After removing the adhesive tape (2) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (100) is formed over the exposed surface, where the circuit substrate includes shielding via structures (101-112) that are aligned with and electrically connected to the conductive shielding layer (16), thereby encircling and shielding the circuit module(s).

Abstract translation: 通过使用双面胶带（2）将多个模块（30-33）附接到处理载体（1）上而在多个封装模块上形成集成的保形电磁干扰（EMI）和/或电磁辐射屏蔽， 然后在用模塑料（17）封装模块之前依次沉积绝缘层（15）和导电屏蔽层（16）。 在去除粘合带（2）以暴露封装的模块的表面之后，在暴露的表面上形成多层电路基板（100），其中电路基板包括屏蔽通孔结构（101-112） 并且电连接到导电屏蔽层（16），从而环绕和屏蔽电路模块。

公开(公告)号：US20090242263A1

公开(公告)日：2009-10-01

申请号：US12058912

申请日：2008-03-31

Applicant: Christopher James Kapusta ,  Donald Cunningham ,  Richard Joseph Saia

Inventor： Christopher James Kapusta ,  Donald Cunningham ,  Richard Joseph Saia

IPC: H05K9/00 ,  B05D5/12 ,  C23C14/34

CPC classification number: H05K9/0039 ,  C23C14/046 ,  H01L23/29 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/09872 ,  H05K2203/1311 ,  H05K2203/1361 ,  H05K2203/1366 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.

Abstract translation: 公开了一种用于向电气系统提供屏蔽的系统和方法。 通过将适形绝缘涂层施加到电气系统来形成保形屏蔽。 在绝缘涂层中在所需位置处形成多个开口，并且第一金属层沉积在绝缘涂层上方，并且在多个开口中的每一个中，第一金属层在所需位置处与电路板电连接。 然后将第二金属层沉积到第一金属层上以增加金属层的厚度。