公开(公告)号：US20090213563A1

公开(公告)日：2009-08-27

申请号：US12380089

申请日：2009-02-23

Applicant: De-Jin Chen ,  Yu-San Hsiao ,  Meng-Xia Shang

Inventor： De-Jin Chen ,  Yu-San Hsiao ,  Meng-Xia Shang

IPC: H05K1/14 ,  H01R12/00

CPC classification number: H05K3/366 ,  H01R12/52 ,  H01R12/57 ,  H05K3/3421 ,  H05K2201/1034 ,  H05K2201/10424

Abstract: A device for connecting printed circuit boards. The device comprises an insulative housing and a plurality of conductive terminals arranged in the insulative housing. The insulative housing defines a first mounting surface, a second mounting surface, and flat pickup portions respectively disposed on opposite faces of the first mounting face and the second mounting face; each terminal includes a first leg on the first mounting surface, and a second leg on the second mounting surface.

Abstract translation: 用于连接印刷电路板的装置。 该装置包括绝缘壳体和布置在绝缘壳体中的多个导电端子。 绝缘壳体限定分别设置在第一安装面和第二安装面的相对面上的第一安装面，第二安装面和平面拾取部; 每个端子包括在第一安装表面上的第一腿部和在第二安装表面上的第二腿部。

公开(公告)号：US07491894B2

公开(公告)日：2009-02-17

申请号：US11085342

申请日：2005-03-21

Applicant: Takeshi Suzuki ,  Toshiyuki Ilmura ,  Kazushige Osumi ,  Shinichi Tsuyuki

Inventor： Takeshi Suzuki ,  Toshiyuki Ilmura ,  Kazushige Osumi ,  Shinichi Tsuyuki

IPC: H05K1/16

CPC classification number: H05K1/141 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0218 ,  H05K1/056 ,  H05K3/284 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A hybrid integrated circuit device of the present invention includes: a circuit board having a front surface subjected to an insulation process; a conductive pattern formed on the front surface of the circuit board; a circuit element placed at a desired position on the conductive pattern and electrically connected to the conductive pattern; and a plurality of leads fixed to the conductive pattern and led to the outside. End portions of the leads which are led to the outside extend approximately parallel to the circuit board in a plane different from that of the front surface of the circuit board.

Abstract translation: 本发明的混合集成电路器件包括：具有经过绝缘处理的正面的电路板; 形成在所述电路板的前表面上的导电图案; 电路元件放置在导电图案上的期望位置并电连接到导电图案; 以及多个引线固定到导电图案并被引导到外部。 引导到外部的引线的端部在与电路板的前表面的平面不同的平面中大致平行于电路板延伸。

公开(公告)号：US07413468B1

公开(公告)日：2008-08-19

申请号：US12001686

申请日：2007-12-12

Applicant: Terrance F. Little ,  Kevin E. Walker ,  Stephen Sedio

Inventor： Terrance F. Little ,  Kevin E. Walker ,  Stephen Sedio

IPC: H01R3/00

CPC classification number: H01R13/7172 ,  H01R13/6658 ,  H01R13/7175 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/1034 ,  H05K2201/10424

Abstract: A connector assembly (100) adapted for being mounted to a circuit board, includes a jack member, a contact module (5) defining a number of recesses (54), a substrate (6), a number of LEDs (40) disposed on the substrate and inserted into the recesses of the contact module, and an upper conduit module (41) engaged with the jack member and inserted into a corresponding recess of the contact module and aligned with a corresponding LED for transmitting light produced from the LED.

Abstract translation: 适于安装到电路板的连接器组件（100）包括插座构件，限定多个凹部（54）的接触模块（5），衬底（6），多个LED（40） 基板并插入到接触模块的凹部中，以及与插座构件接合并插入到接触模块的相应凹部中的上导管模块（41），并与对应的LED对准，用于透射从LED产生的光。

公开(公告)号：US20080149380A1

公开(公告)日：2008-06-26

申请号：US11663699

申请日：2005-08-09

Applicant: Seitaro Mizuhara

Inventor： Seitaro Mizuhara

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H01L25/162 ,  H01L21/4853 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/305 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/1034 ,  H05K2203/0169 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/49149 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections 1 on each of which an electronic component 2 is mounted and a metallic terminal plate 3 for external connection is bonded so as to project from the hybrid circuit board section. A frame portion 6 is defined between the hybrid circuit board sections, and the hybrid circuit board sections are integrally connected to the frame portion via a thin strip 8 provided at an intermediate portion of grooves 7 each surrounding a respective one of the hybrid circuit board sections entirely. In bonding the terminal plate 3 to the hybrid circuit board by soldering, the terminal plate is temporarily bonded to the frame portion 6 with an adhesive 9. The adhesive is prevented from spreading toward the end of the terminal plate. A hole or a recess 10 is formed in the frame portion 6 at a region with which the terminal plate 3 is to overlap and which is closer to an end of the terminal plate than a portion to which the adhesive 9 for temporarily bonding the terminal plate to the frame portion is to be applied is.

Abstract translation: 用于制造混合电路板的材料板包括多个混合电路板部分1，每个混合电路板部分1安装有电子部件2，并且用于外部连接的金属端子板3从混合电路板部分突出。 框架部分6限定在混合电路板部分之间，并且混合电路板部分经由设置在凹槽7的中间部分处的细条8一体地连接到框架部分，每个沟槽7围绕相应的一个混合电路板部分 完全。 在通过焊接将端子板3接合到混合电路板上时，端子板用粘合剂9暂时地接合到框架部分6.防止粘合剂向端子板的端部扩散。 在端子板3重叠的区域处，在框架部6中形成有孔或凹部10，并且比将端子板临时接合的粘合剂9更靠近端子板的端部 要施加到框架部分。

公开(公告)号：US20070222046A1

公开(公告)日：2007-09-27

申请号：US11568293

申请日：2005-11-08

Applicant: Shigetomi Tokunaga

Inventor： Shigetomi Tokunaga

IPC: H01L23/02

CPC classification number: H05K1/141 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/284 ,  H05K3/366 ,  H05K2201/1034 ,  H05K2201/1056 ,  H05K2201/10689 ,  H01L2924/00

Abstract: An electronic circuit device includes a sub-board disposed upright on a main board. The sub-board is electrically coupled to the main board via a board terminal) disposed at sub-board edge. A semiconductor element is mounted on the sub-board facing the sub-board in parallel. A temperature sensor is also mounted on the sub-board. A heat sink is formed so as to surround the sub-board and the semiconductor element. A resin material is injected inside a heat sink so as to cover the sub-board, the temperature sensor, and the semiconductor element.

Abstract translation: 电子电路装置包括直立设置在主板上的子板。 子板通过设置在子板边缘处的板端子电耦合到主板。 半导体元件平行地安装在面向子板的子板上。 温度传感器也安装在子板上。 形成散热器，以便围绕子板和半导体元件。 将树脂材料注入散热器内部以覆盖子板，温度传感器和半导体元件。

公开(公告)号：US07213741B2

公开(公告)日：2007-05-08

申请号：US10963504

申请日：2004-10-14

Applicant: Atsushi Oohashi

Inventor： Atsushi Oohashi

IPC: B23K31/02

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K26/22 ,  B23K2101/36 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45147 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19107 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/4015 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10757 ,  H01L2224/48 ,  H01L2924/00

Abstract: After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are bonded to terminals of the case. Since the lead wires are processed before the substrate is brought into the case, this eliminates the necessity to perform formation of the bent portions of the lead wires and fixing of the lead wires to the substrate in a narrow space of the case and allows simplification of bonding operation. Thus provided is a lead wire bonding method for bonding lead wires with bent portions to the substrate, which simplifies a bonding operation.

Abstract translation: 在导线的相应一端固定到印刷电路板上之后，导线弯曲，将印刷电路板带入壳体中，引线的另一端结合到壳体的端子。 由于在基板进入壳体之前处理引线，所以这消除了在引线的弯曲部分的形成和在壳体的狭窄空间内将引线固定到基板上的必要性，并且允许简化 粘接操作。 因此，提供了一种用于将引线与弯曲部分接合到基板的引线接合方法，这简化了接合操作。

公开(公告)号：US20070090513A1

公开(公告)日：2007-04-26

申请号：US11371562

申请日：2006-03-09

Applicant: Chin Kuo ,  Yi Hsieh

Inventor： Chin Kuo ,  Yi Hsieh

IPC: H01L23/053

CPC classification number: H01L23/49568 ,  H01L23/49531 ,  H01L23/49551 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/3405 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A power module fabrication method and structure thereof is disclosed. The method includes steps of: providing a metal plate and defining a pattern on the metal plate; cutting the metal plate according to the pattern to form a plurality of pins and the heat-conducting plate, wherein the pin is coupled to each other or to the metal plate via a connection part and the heat-conducting plate is coupled to the connection part via a fixing part; bending a first end of the pin to form an extension part and bending the fixing part to dispose the heat-conducting plate and the metal plate at different levels; providing a circuit board with a plurality of via holes and inserting the extension part into the via hole correspondingly and fixing the pin on the circuit board; forming a housing to encapsulate the circuit board therein, wherein the heat-conducting plate is inlaid on the housing and a second end of the pin is extended out of the housing; and cutting the connection part and the fixing part to separate the pin from each other and from the metal plate and isolate the pin and the heat-conducting plate.

Abstract translation: 公开了一种功率模块的制造方法及其结构。 该方法包括以下步骤：提供金属板并在金属板上限定图案; 根据图案切割金属板以形成多个销和导热板，其中销通过连接部彼此连接或连接到金属板，并且导热板联接到连接部分 通过固定部分; 弯曲销的第一端以形成延伸部分并弯曲固定部分以将导热板和金属板设置在不同的水平; 提供具有多个通孔的电路板，并将所述延伸部分相应地插入所述通孔中并将所述销固定在所述电路板上; 形成壳体以将电路板封装在其中，其中导热板镶嵌在壳体上，并且销的第二端延伸出壳体; 以及切割连接部分和固定部分，以将销彼此分开并与金属板分离，并使引脚和导热板隔离。

公开(公告)号：US07177143B1

公开(公告)日：2007-02-13

申请号：US11033931

申请日：2005-01-11

Applicant: Leonardo Gomez

Inventor： Leonardo Gomez

IPC: G06F1/16 ,  H04B7/185

CPC classification number: H05K5/0095 ,  H05K1/023 ,  H05K3/284 ,  H05K2201/1034 ,  H05K2203/1316

Abstract: Techniques for making robust but precise electrical components, such as molded equalizers designed for interface with amplifiers in CATV or other communications equipment, are disclosed. An exemplary embodiment of an electrical component includes an injection-molded housing encapsulating an equalizer circuit and with pins protruding from one end. The housing and pins are designed for interface with predetermined locations in CATV amplifiers or optic nodes. The addition of the molten plastic changes the performance of the equalizer circuit, requiring pre-mold adjustments to the circuit design to be made in order for the final molded equalizer to achieve the desired operating characteristics.

Abstract translation: 公开了用于制造鲁棒但精确的电气部件的技术，例如设计用于与CATV或其它通信设备中的放大器接口的模制均衡器。 电气部件的示例性实施例包括注射成型的壳体，其封装均衡器电路和从一端突出的销。 外壳和引脚设计用于与CATV放大器或光纤节点中的预定位置相连接。 熔融塑料的添加改变均衡器电路的性能，需要对电路设计进行预模型调整，以使最终模制均衡器达到期望的操作特性。

公开(公告)号：US07060912B2

公开(公告)日：2006-06-13

申请号：US10310803

申请日：2002-12-06

Applicant: Mitsunori Nagashima ,  Tomoyoshi Hiei

Inventor： Mitsunori Nagashima ,  Tomoyoshi Hiei

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/3405 ,  H05K1/113 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/1028 ,  H05K2201/1034 ,  Y10T29/49165

Abstract: A circuit board comprises a board substrate including a substrate layer formed with a pad on an upper surface thereof, and a metal piece soldered on the pad. At least one through-hole including an internal wall formed with a conductive film is provided at a portion corresponding to the pad on the substrate layer. The through-hole is filled with a predetermined filler for closing at least an open mouth of the through-hole at the upper surface of the substrate layer. The pad is connected integrally with the conductive film on the internal wall of the through-hole.

Abstract translation: 一种电路板包括一个板基板，该基板包括一个在其上表面上形成有一个焊盘的基板层，以及一个焊接在焊盘上的金属片。 至少一个包括形成有导电膜的内壁的通孔设置在与衬底层上的衬垫相对应的部分。 填充有用于在基材层的上表面封闭通孔的至少一个开放口的预定填料。 衬垫与通孔内壁上的导电膜一体连接。

公开(公告)号：US20050218505A1

公开(公告)日：2005-10-06

申请号：US10708935

申请日：2004-04-01

Applicant: Todd Oman ,  Thomas Degenkolb

Inventor： Todd Oman ,  Thomas Degenkolb

IPC: H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14

CPC classification number: H01L25/162 ,  H01L23/367 ,  H01L23/49833 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0187 ,  H05K2201/1034 ,  H05K2201/10977 ,  Y10T428/24917

Abstract: Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together.

Abstract translation: 通过使用包括陶瓷衬底和有机衬底的电路组件来热管理大功率IC器件。 陶瓷基板在其第一表面上具有至少一个电路元件，限定围绕第一表面的侧表面的周边。 有机基底还包括限定围绕第一表面的侧表面的第一表面和外围。 有机衬底的侧表面的一部分与陶瓷衬底的侧表面的一部分相邻，从而在其间形成界面。 陶瓷和有机衬底共同的至少一个导体和桥接它们之间的界面用于将陶瓷和有机衬底物理连接在一起。