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    Electric component
    131.
    发明授权
    Electric component 失效
    电气部件

    公开(公告)号：US4991059A

    公开(公告)日：1991-02-05

    申请号：US241597

    申请日：1988-09-08

    Applicant: Tomohito Kiyose

    Inventor： Tomohito Kiyose

    IPC: H05K3/34

    CPC classification number: H05K3/3426 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613

    Abstract: An electronic component with leads each having a bonding portion is disclosed. Each bonding portion is formed with a through hole or a notch to provide for satisfactory soldering and reduce the possibility of defective soldering.

    Abstract translation: 公开了一种具有各自具有接合部分的引线的电子部件。 每个结合部分形成有通孔或凹口以提供令人满意的焊接并且减少焊接不良的可能性。

    Surface mountable integrated circuit packages having solder bearing leads
    132.
    发明授权
    Surface mountable integrated circuit packages having solder bearing leads 失效
    具有焊锡轴承引线的表面贴装集成电路封装

    公开(公告)号：US4661887A

    公开(公告)日：1987-04-28

    申请号：US793414

    申请日：1985-10-31

    Applicant: Paul T. Lin

    Inventor： Paul T. Lin

    IPC: H01L23/50 ,  H05K1/18 ,  H05K3/34 ,  H05K13/04 ,  H01R9/09

    CPC classification number: H05K3/3426 ,  H05K13/0465 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/1084 ,  H05K2201/10984 ,  Y02P70/613 ,  Y10T29/49144

    Abstract: An integrated circuit package having a plurality of leads capable of holding a quantity of solder paste prior to bonding to a printed circuit board or other substrate. The solder paste bearing structure may be straight or spiral grooves, or even a slot or roughened surface, running down at least the lower length of the leads as long as some mechanism is present which will first hold the solder paste or other electrically conductive binder on the lead and then deliver the binder to the end of the lead to produce an electrical and structural bond in a binder flowing operation. Application of the solder paste to the leads is accomplished by simply dipping the package leads into the paste thereby eliminating the need to make a solder mask for the substrate as well as the task of aligning the mask to the substrate.

    Abstract translation: 一种集成电路封装，其具有多个引线，其能够在与印刷电路板或其它基板接合之前保持一定量的焊膏。 焊膏支承结构可以是直的或螺旋形的沟槽，或者甚至是槽或粗糙表面，只要存在一些将首先将焊膏或其它导电粘合剂保持在其上的机构，至少沿着引线的较低长度向下延伸 引线，然后将粘合剂输送到引线的末端，以在粘合剂流动操作中产生电和结构粘合。 通过将封装引线简单地浸入糊料中，可以将焊膏施加到引线上，从而不需要为衬底制造焊接掩模以及将掩模对准衬底的任务。

    PRINTED CIRCUIT BOARD UNIT
    135.
    发明申请
    PRINTED CIRCUIT BOARD UNIT 有权
    印刷电路板单元

    公开(公告)号：US20120181077A1

    公开(公告)日：2012-07-19

    申请号：US13346085

    申请日：2012-01-09

    Applicant: Kazuya MIYASAKA ,  Kouji KOBAYASHI ,  Akihito FUKUZAWA

    Inventor： Kazuya MIYASAKA ,  Kouji KOBAYASHI ,  Akihito FUKUZAWA

    IPC: H05K1/11

    CPC classification number: H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/1084

    Abstract: A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board.

    Abstract translation: 印刷电路板单元包括：印刷电路板，包括具有彼此相对的第一和第二内表面的通孔; 终端销，其包括插入到所述通孔中的插入部; 焊料填充到通孔中，并且将印刷电路板与端子销接合，其中插入部分包括抵靠第一内表面的基部，以及突出部分，包括：从基部突出到第二内部的突出表面 表面并邻接第二内表面; 以及位于所述突起表面的后侧并与所述第一内表面间隔开的凹陷表面，并且所述突出部分的所述印刷电路板的厚度方向的长度大于所述印刷电路板的厚度。

    PLANAR CONTACT WITH SOLDER
    138.
    发明申请
    PLANAR CONTACT WITH SOLDER 有权
    平面与焊接接触

    公开(公告)号：US20100236815A1

    公开(公告)日：2010-09-23

    申请号：US12727146

    申请日：2010-03-18

    Applicant: Jack Seidler

    Inventor： Jack Seidler

    IPC: H01B5/00 ,  H05K3/00

    CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

    Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

    Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。

    Two-level mounting board and crystal oscillator using the same
    139.
    发明授权
    Two-level mounting board and crystal oscillator using the same 有权
    两级安装板和使用相同的晶体振荡器

    公开(公告)号：US07791425B2

    公开(公告)日：2010-09-07

    申请号：US11975753

    申请日：2007-10-22

    Applicant: Takeshi Uchida ,  Manabu Ito ,  Tomotaka Kuroda

    Inventor： Takeshi Uchida ,  Manabu Ito ,  Tomotaka Kuroda

    IPC: H03B1/00 ,  H03B5/32

    CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/09463 ,  H05K2201/10303 ,  H05K2201/1084 ,  H05K2201/10871 ,  H05K2203/1178 ,  Y10T428/24612

    Abstract: The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.

    Abstract translation: 本发明涉及一种二级安装板，其中第二基板由位于外基座表面上的具有安装电极的第一基板上的金属销水平支撑，金属销的自由下端插入 并且所述金属销通过焊料固定到设置在所述第一基板的表面上的环形电极焊盘，以形成所述孔的外周，其中所述环形电极的环的一部分 被切开打开一样。 这提供了两级安装板，其中金属引脚可以可靠地连接到第一基板以水平地支撑第二基板，以及使用其的晶体振荡器。

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