公开(公告)号：US20010033476A1

公开(公告)日：2001-10-25

申请号：US09798541

申请日：2001-03-02

Inventor： Joseph T. Dibene II ,  David H. Hartke ,  Wendell C. Johnson ,  Edward J. Derian

IPC: H05K007/20

CPC classification number: H05K7/20454 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/15192 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: A method, apparatus, and article of manufacture for transferring heat is disclosed. The apparatus comprises a first thermally conductive plate; a second thermally conductive plate; and an angularly corrugated member disposed between and in thermal communication first thermally conductive plate and the second thermally conductive plate. The angularly corrugated member has a contiguous periodically repeating cross section which includes a first cross section segment, disposable substantially parallel to and in thermal communication with the first thermally conductive plate, a second cross section segment, disposable substantially parallel to and in thermal communication with the second thermally conductive plate, and a third cross section segment, communicatively coupled to the first surface and the second surface, wherein the third cross section segment forming an angle with the first thermally conductive plate.

Abstract translation: 公开了一种用于传递热量的方法，设备和制品。 该装置包括第一导热板; 第二导热板; 以及设置在热连通的第一导热板和第二导热板之间并且与热连通的角形波状部件。 所述角瓦状构件具有连续的周期性重复的横截面，所述横截面包括第一横截面段，所述第一横截面段基本上平行于第一导热板并与第一导热板热连通;第二横截面段，一次性基本上平行于并与之热连通 第二导热板和与第一表面和第二表面通信地连接的第三横截面段，其中第三横截面段与第一导热板形成一角度。

公开(公告)号：US06248957B1

公开(公告)日：2001-06-19

申请号：US09276517

申请日：1999-03-25

Applicant: Hajime Murakami ,  Yoshihiro Morita

Inventor： Hajime Murakami ,  Yoshihiro Morita

IPC: H05K103

CPC classification number: H05K3/3494 ,  H05K1/0271 ,  H05K7/1461 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/087

Abstract: A printed-circuit board reinforcing member can reduce a space to be provided between an electronic part mounted on a printed-circuit board and the printed-circuit board reinforcing member fixed to the printed-circuit board. The printed-circuit board reinforcing member has a square frame shape having four side members. The electronic part having a square shape is mounted on a part of the surface of the printed-circuit board so that the part of the surface of the printed-circuit board is surrounded by the printed-circuit board reinforcing member. An inlet port is formed on a top surface of each of the side members. An outlet port is formed on an inner surface of each of the side members. A fluid passage is provided in each of the side members so as to connect the inlet port to the outlet port. Heated fluid introduced into the inlet port is discharged from the outlet port so as to heat connecting parts between the electronic part and the printed-circuit board.

Abstract translation: 印刷电路板加强构件可以减少安装在印刷电路板上的电子部件与固定到印刷电路板的印刷电路板加强件之间的空间。 印刷电路板加强构件具有四个侧构件的正方形框架形状。 具有正方形形状的电子部件安装在印刷电路板的表面的一部分上，使得印刷电路板的表面的一部分被印刷电路板加强部件包围。 入口端口形成在每个侧构件的顶表面上。 在每个侧构件的内表面上形成出口。 在每个侧构件中设置有流体通道，以将入口连接到出口。 引入入口的加热流体从出口排出，以加热电子部件和印刷电路板之间的连接部分。

公开(公告)号：US6040622A

公开(公告)日：2000-03-21

申请号：US096140

申请日：1998-06-11

Applicant: Robert F. Wallace

Inventor： Robert F. Wallace

IPC: G11C5/00 ,  H01L21/56 ,  H01L23/24 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H01L23/02

CPC classification number: G11C5/06 ,  G11C29/1201 ,  G11C29/48 ,  G11C5/04 ,  H01L21/565 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/5388 ,  H01L25/0655 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/284 ,  G11C16/04 ,  H01L24/16 ,  H01L24/32 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K2201/09127 ,  H05K2201/10689 ,  H05K2201/2018 ,  H05K3/0052

Abstract: A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.

公开(公告)号：US5883425A

公开(公告)日：1999-03-16

申请号：US647049

申请日：1996-05-09

Applicant: Eiji Kobayashi

Inventor： Eiji Kobayashi

IPC: H01L21/60 ,  H01L21/50 ,  H01L23/02 ,  H01L23/10 ,  H01L25/00 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/12 ,  H01L23/34

CPC classification number: H05K3/303 ,  H01L21/50 ,  H01L23/10 ,  H01L2224/16 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/19105 ,  H05K2201/09781 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2203/167 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3457 ,  Y02P70/613

Abstract: A circuit device, for example, a hybrid integrated circuit device, for improving the positioning accuracy of a frame element is disclosed. At least two thick film electrodes (7a) of circular configuration having a diameter of 0.3 mm or greater are formed on a component mounting surface (7S) of a thick film substrate (7) along outer wall peripheries (5OE) of a bottom surface (5B) of a frame element (5) bonded on the component mounting surface (7S) with an adhesive (6), and raised portions (4a) consisting essentially of solder are formed on the thick film electrodes (7a), respectively. The presence of the raised portions (4a) determines the position of the frame element (5) and prevents positional error of the frame element (5). The thick film electrodes (7a) may be of rectangular configuration which allows stabler positioning of the frame element (5). The thick film electrodes (7a) and raised portions (4a) may be formed along inner wall peripheries of the bottom surface (5B) of the frame element (5).

Abstract translation: 公开了一种用于提高帧单元的定位精度的电路装置，例如混合集成电路装置。 至少两个直径为0.3mm以上的圆形构造的厚膜电极（7a）沿着底面的外壁（50E）形成在厚膜基板（7）的部件安装面（7S）上 分别在粘合剂（6）上接合在部件安装表面（7S）上的框架元件（5）和基本上由焊料组成的凸起部分（4a）分别形成在厚膜电极（7a）上。 凸起部分（4a）的存在确定框架元件（5）的位置并且防止框架元件（5）的位置误差。 厚膜电极（7a）可以是矩形构造，其允许框架元件（5）的更稳定的定位。 厚膜电极（7a）和凸起部分（4a）可以沿着框架元件（5）的底面（5B）的内壁的周边形成。

公开(公告)号：US5742484A

公开(公告)日：1998-04-21

申请号：US801612

申请日：1997-02-18

Applicant: Joseph G. Gillette ,  Scott G. Potter ,  Pradeep Lall

Inventor： Joseph G. Gillette ,  Scott G. Potter ,  Pradeep Lall

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R12/52 ,  H05K1/148 ,  H05K3/363 ,  H01R12/62 ,  H05K1/118 ,  H05K2201/0909 ,  H05K2201/09709 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K3/0058 ,  H05K3/3457

Abstract: A surface mountable flexible interconnect (10) for connecting two circuit board (30, 32) consists of a flex circuit (12) with solderable runners (14) on one side, the runners traversing the flex circuit from one end to the other. There is a solderable pad (16) at the end of each runner, and each solderable pad has a solder bump (18) fused to it. A rigid carrier ring (20) is used to hold the flex circuit in position prior to placement on the PCB. The flex circuit is formed into a U-shaped loop (26), and the loop is aligned to the carrier so that the loop is situated in an aperture (24) in the carrier. The solder pads lie directly under the carrier ring and face away from it. An adhesive (22) bonds the flex circuit to the carrier ring.

Abstract translation: 用于连接两个电路板（30,32）的可表面安装的柔性互连（10）由在一侧上具有可焊接流道（14）的柔性电路（12）组成，所述滑动件从一端穿过柔性电路。 在每个流道的末端有可焊垫（16），每个可焊垫具有与其熔合的焊料凸块（18）。 刚性载体环（20）用于在放置在PCB上之前将柔性电路保持在适当的位置。 柔性电路形成为U形环（26），并且环路与载体对准，使得环路位于载体中的孔（24）中。 焊盘位于载体环的正下方，并远离其。 粘合剂（22）将柔性电路结合到载体环上。

公开(公告)号：US4687266A

公开(公告)日：1987-08-18

申请号：US763738

申请日：1985-08-08

Applicant: Junichi Tanii ,  Toshio Yamaki ,  Kiyoshi Seigenji

Inventor： Junichi Tanii ,  Toshio Yamaki ,  Kiyoshi Seigenji

IPC: H01R4/70 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0256 ,  H05K1/117 ,  H05K1/0393 ,  H05K2201/2018 ,  Y10T29/49128

Abstract: A frame member is bonded on a base plate having a plurality of electrical contacts thereon. The frame member includes a plurality of apertures corresponding to the electrical contacts. Bonding means bonding the frame member on the base plate is formed by a waterproof double faced bonding member including a waterproof sheet and waterproof bonding agent applied to both sides of the sheet, the double faced bonding member separates the electrical contacts from each other to prevent accidential conduction between the adjacent electrical contacts due to a water drop.

Abstract translation: 框架构件结合在其上具有多个电触点的基板上。 框架构件包括对应于电触头的多个孔。 接合装置是通过防水双面接合构件形成底板上的框架构件，该防水双面接合构件包括施加在片材两侧的防水片和防水粘合剂，双面接合构件将电接触彼此分离以防止认可 由于水滴导致相邻电触点之间的导通。

公开(公告)号：US12035029B2

公开(公告)日：2024-07-09

申请号：US17833025

申请日：2022-06-06

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Zhenyu Chen ,  Nan Guo ,  Takehiko Tanaka

IPC: H04N5/335 ,  G02B7/00 ,  G02B7/02 ,  G03B13/36 ,  H01L27/146 ,  H04N23/45 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H04N23/90 ,  H05K1/18 ,  G02B5/20 ,  G02B7/08 ,  G02B7/09 ,  H02K41/035 ,  H02N2/02 ,  H05K1/02 ,  H05K3/28

CPC classification number: H04N23/55 ,  G02B7/006 ,  G02B7/02 ,  G03B13/36 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14645 ,  H04N23/45 ,  H04N23/54 ,  H04N23/57 ,  H04N23/90 ,  H05K1/182 ,  G02B5/208 ,  G02B7/021 ,  G02B7/08 ,  G02B7/09 ,  H01L27/14636 ,  H01L2224/48091 ,  H02K41/0354 ,  H02N2/026 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10083 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2018 ,  H05K2203/1316 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

公开(公告)号：US20240080983A1

公开(公告)日：2024-03-07

申请号：US18507708

申请日：2023-11-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Kwang Sung KIM ,  Ji Hwan PARK ,  Yong Tae PARK ,  Beom Seok YU

IPC: H05K1/14 ,  G02B7/02 ,  G03B11/04 ,  G03B17/08 ,  G03B17/56 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/144 ,  G02B7/02 ,  G03B11/04 ,  G03B17/08 ,  G03B17/56 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H05K1/0254 ,  H05K1/028 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/2018

Abstract: A device for fixing a camera module, includes



a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

公开(公告)号：US11849538B2

公开(公告)日：2023-12-19

申请号：US17445738

申请日：2021-08-24

Applicant: NGK Electronics Devices, Inc. ,  NGK Insulators, Ltd. ,  Fujitsu Optical Components Limited

Inventor： Noboru Kubo ,  Masato Ishizaki ,  Kento Takahashi

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  G02B6/42 ,  H05K1/18

CPC classification number: H05K1/0245 ,  G02B6/4281 ,  H05K1/118 ,  H05K1/148 ,  H05K1/18 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09672 ,  H05K2201/2018

Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

公开(公告)号：US11825604B2

公开(公告)日：2023-11-21

申请号：US17529410

申请日：2021-11-18

Applicant: Unimicron Technology Corporation

Inventor： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Kuei-Sheng Wu

IPC: H05K1/14 ,  H05K1/02 ,  H01R12/79

CPC classification number: H05K1/144 ,  H01R12/79 ,  H05K1/028 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/2018

Abstract: A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.