Method of treating semiconductor substrate

    公开(公告)号:US11127583B2

    公开(公告)日:2021-09-21

    申请号:US16542036

    申请日:2019-08-15

    Abstract: A method of treating a semiconductor substrate includes converting a first main side of the semiconductor substrate having a first coefficient of static friction relative to a surface of a wafer table to a second coefficient of static friction relative to the surface of the wafer table, wherein the second coefficient of static friction is less than the first coefficient of static friction. A photoresist layer is applied over a second main side of the semiconductor substrate having the first coefficient of static friction. The second main side opposes the first main side. The semiconductor substrate is placed on the wafer table so that the first main side of the semiconductor substrate faces the wafer table.

    Method for preparing ratiometric electrochemical miR3123 aptasensor based on metal-organic framework composite

    公开(公告)号:US11099150B1

    公开(公告)日:2021-08-24

    申请号:US17051781

    申请日:2019-08-30

    Abstract: A method for preparing a ratiometric electrochemical miR3123 aptasensor based on a copper-based metal-organic framework (Cu-MOF) composite doped with black phosphorus nanosheets (BPNSs) and thionine (TH) is provided. TH/Cu-MOF is prepared by reacting TH with Cu-MOF precursor, and BPNSs/TH/Cu-MOF is prepared by drop coating the BPNSs and drop coated onto an electrode. A ferrocene (Fc)-labeled single-stranded DNA aptamer is adsorbed on the BPNSs to prepare aptamer-BPNSs/TH/Cu-MOF. Target molecule miR3123 is bonded with the single-stranded DNA aptamer Fc-DNA, Fc-DNA is forced to escape from the BPNSs. Electrochemical signals of Fc are, therefore, weakened while TH signals are slightly affected. The ratiometric electrochemical miR3123 aptasensor is constructed by fitting a linear relationship between peak current intensity ratios IFc/ITH and concentrations of the miR3123.

    METHOD FOR MANUFACTURING TARGET OBJECT COATED WITH COATING SUBSTANCE

    公开(公告)号:US20210245194A1

    公开(公告)日:2021-08-12

    申请号:US17269249

    申请日:2019-08-19

    Abstract: A method for manufacturing a target object coated with a coating substance, whose edge face portions and flat face portion can be covered with the coating substance with a predetermined thickness, is provided. The target object T includes a flat face portion Tf and an edge face portion Te continuous from the portion Tf which includes a coating flat surface Tsp formed thereon which has a flat face. The portion Te includes a coating edge surface Tsc which includes at least one of a curved surface or a flat surface that is not parallel to the surface Tsp. The method includes a coating substance supply step of supplying the substance R along at least the surface Tsp, and an edge face portion coating substance adjustment step of adjusting the substance R supplied to the surface Tsc or moved from the surface Tsp to cover the surface Tsc at a predetermined thickness.

    Laminate composite structural components and methods for the same

    公开(公告)号:US11085111B2

    公开(公告)日:2021-08-10

    申请号:US16157886

    申请日:2018-10-11

    Abstract: A method for fabricating a structural part is disclosed. The method can include forming a plurality of layers on a base of a system having one or more application heads. Forming the plurality of layers can include forming alternating layers of a first material and a second material. Forming the alternating layers can include forming a first layer from the first material, and forming a second layer adjacent the first layer from the second material. The plurality of layers can form the structural part, and one or more dimensions of the structural part can be greater than or equal to about 0.05 cm.

    Electronic component manufacturing method and apparatus

    公开(公告)号:US11052422B2

    公开(公告)日:2021-07-06

    申请号:US16503288

    申请日:2019-07-03

    Abstract: An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

    Film-forming apparatus and film-forming method

    公开(公告)号:US11035041B2

    公开(公告)日:2021-06-15

    申请号:US16378799

    申请日:2019-04-09

    Inventor: Yoji Iizuka

    Abstract: There is provided a film-forming apparatus and a film-forming method. The film-forming apparatus, in a first period, sets the second heater to a temperature T1 at which no film is formed on a substrate disposed on the mounting stand without supplying a precursor gas into the process container, in a second period, sets the second heater to a temperature T2 at which no film is formed on the substrate and supplies a precursor gas into the process container from the precursor gas supply pipe, in a third period, sets the second heater to a film-forming temperature T3, and in the first to third periods, sets the first heater to a temperature T4 at which no film is formed on a periphery of a gas supply port of the precursor gas supply pipe.

Patent Agency Ranking