公开(公告)号：US08338714B2

公开(公告)日：2012-12-25

申请号：US12852323

申请日：2010-08-06

Applicant: Jung Eun Kang ,  Hye Sook Shin ,  Ki Ho Seo

Inventor： Jung Eun Kang ,  Hye Sook Shin ,  Ki Ho Seo

IPC: H05K1/00

CPC classification number: H05K3/445 ,  H01L2924/0002 ,  H05K3/4608 ,  H05K3/465 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/1147 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.

Abstract translation: 本文公开了一种散热基板。 散热基板包括：金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层，具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层，其被嵌入在所述第一绝缘层中，填充在所述多孔层的第二孔中，并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。 此外，在本实施方式的散热基板中，第一电路层部分地填充在第二孔中，第二绝缘层填充在第二孔中，以使第一绝缘层成为平面。 此外，公开了制造散热基板的方法。

公开(公告)号：US08304661B2

公开(公告)日：2012-11-06

申请号：US12787415

申请日：2010-05-26

Applicant: Masato Nomiya

Inventor： Masato Nomiya

IPC: H05K1/00 ,  H01K3/22

CPC classification number: H05K3/4688 ,  B32B3/08 ,  B32B9/005 ,  B32B9/04 ,  B32B9/045 ,  B32B18/00 ,  B32B2250/40 ,  B32B2260/02 ,  B32B2260/046 ,  C04B35/111 ,  C04B2235/365 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5472 ,  C04B2235/6025 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/704 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0116 ,  H05K2203/1147 ,  Y10T29/49163 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/249994 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer and a second ceramic layer that is disposed so as to contact the first ceramic layer and suppresses firing shrinkage in the plane direction of the first ceramic layer. The laminate includes a resin/ceramic composite layer in which porous ceramic is impregnated with a resin formed on at least one principal surface of the laminate.

Abstract translation: 具有优异的平坦度和少量剩余孔的高可靠性陶瓷复合多层基板可以以低成本制造，同时简化制造工艺，并且可以消除层与母板的分离或分离。 陶瓷复合多层基板包括含有第一陶瓷层和第二陶瓷层的层压体，第一陶瓷层和第二陶瓷层被设置成与第一陶瓷层接触并抑制第一陶瓷层的平面方向的烧成收缩。 层压体包括树脂/陶瓷复合层，其中多孔陶瓷浸渍有形成在层压体的至少一个主表面上的树脂。

公开(公告)号：US08299613B2

公开(公告)日：2012-10-30

申请号：US12742176

申请日：2008-11-14

Applicant: Hermann Oppermann

Inventor： Hermann Oppermann

IPC: H01L29/40

CPC classification number: H05K3/24 ,  B22F2003/244 ,  B81C3/001 ,  B81C2203/032 ,  C22C1/08 ,  H01L24/10 ,  H01L24/28 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0781 ,  H01L2924/19043 ,  H05K3/321 ,  H05K3/325 ,  H05K3/383 ,  H05K2201/0116 ,  H05K2201/209 ,  H05K2203/0307 ,  H05K2203/0361

Abstract: The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.

Abstract translation: 本发明涉及一种用于连接两个接合表面的方法，特别是在半导体领域中，其中至少一个接合表面通过将包含20至40％的金和80至60％的银的层沉积到衬底上而产生，并选择性地除去 银，以便产生作为接合表面的纳米多孔金层。 具有纳米多孔金层的接合表面和另外的接合表面一个放置在另一个上并压在一起。

公开(公告)号：US08197055B2

公开(公告)日：2012-06-12

申请号：US11934935

申请日：2007-11-05

Applicant: Naoyuki Toyoda ,  Hirotsuna Miura

Inventor： Naoyuki Toyoda ,  Hirotsuna Miura

IPC: B41J2/01

CPC classification number: B41J11/002 ,  B41J3/28 ,  B41J3/407 ,  H01L51/0005 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/1283 ,  H05K2201/0116 ,  H05K2203/013 ,  H05K2203/1105 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for producing a pattern on a substrate includes discharging a droplet on a top surface of a breathable substrate being heated, the droplet being formed with a functional fluid containing a functional material, so as to produce the pattern on the top surface of the breathable substrate.

Abstract translation: 一种用于在基板上制造图案的方法包括：在被加热的透气基板的顶表面上排放液滴，所述液滴由含有功能材料的功能流体形成，从而在透气性的顶面上产生图案 基质。

公开(公告)号：US20120024581A1

公开(公告)日：2012-02-02

申请号：US13094941

申请日：2011-04-27

Applicant: Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Shinichi INOUE ,  Hiroyuki HANAZONO

Inventor： Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Shinichi INOUE ,  Hiroyuki HANAZONO

IPC: H05K1/00 ,  H05K3/10

CPC classification number: H05K1/034 ,  H01B3/445 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/108 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/015

Abstract: A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 μm and not more than 1.0 μm.

Abstract translation: 在由多孔ePTFE制成的多孔基底绝缘层上形成多个导体迹线。 每个导体迹线具有种子层和导体层的层叠结构。 覆盖绝缘层形成在基底绝缘层上以覆盖每个导体迹线。 用作多孔基底绝缘层的ePTFE具有连续的孔。 ePTFE的平均孔径不小于0.05μm且不大于1.0μm。

公开(公告)号：US20120024574A1

公开(公告)日：2012-02-02

申请号：US13187830

申请日：2011-07-21

Applicant: Shinichi INOUE ,  Hiroyuki HANAZONO ,  Mineyoshi HASEGAWA

Inventor： Shinichi INOUE ,  Hiroyuki HANAZONO ,  Mineyoshi HASEGAWA

IPC: H05K1/00 ,  H05K3/10

CPC classification number: H05K3/108 ,  H05K1/0274 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/2054

Abstract: A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.

Abstract translation: 印刷电路板包括由多孔膜形成的基底绝缘层。 在由多孔膜形成的基底绝缘层上形成导体迹线。 在绝缘绝缘层上形成覆盖导体迹线的覆盖绝缘层。 用作基底绝缘层的多孔膜对于在400nm至800nm的波长区域中的至少一部分波长的光具有不小于50％的反射率。

公开(公告)号：US20110304997A1

公开(公告)日：2011-12-15

申请号：US13156718

申请日：2011-06-09

Applicant: Yasuji Hiramatsu ,  Yuki Terada ,  Tetsuya Muraki

Inventor： Yasuji Hiramatsu ,  Yuki Terada ,  Tetsuya Muraki

IPC: H05K7/00 ,  H01H69/02 ,  H05K1/00

CPC classification number: H05K1/0293 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/10181

Abstract: A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.

Abstract translation: 印刷电路板包括具有孔单元的绝缘树脂基板，第一端子单元和由导体构成并形成在树脂基板的顶部上的第二端子单元，以及熔接单元，其将第一端子单元和第二端子单元电连接 终端单元相互连接。 保险丝单元的至少一部分设置在孔单元上方，并且另外由具有绝缘性质的多孔无机覆盖材料覆盖。

公开(公告)号：US20110198115A1

公开(公告)日：2011-08-18

申请号：US13025658

申请日：2011-02-11

Applicant: Yukihiro AZUMA ,  Seiichi TAJIMA ,  Shigeru ASAMI ,  Hiroki HARA ,  Shuichi TAKIZAWA ,  Kenichi KAWABATA

Inventor： Yukihiro AZUMA ,  Seiichi TAJIMA ,  Shigeru ASAMI ,  Hiroki HARA ,  Shuichi TAKIZAWA ,  Kenichi KAWABATA

IPC: H05K1/16 ,  H05K3/34

CPC classification number: H05K3/284 ,  H01L23/3135 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0209 ,  H05K3/3431 ,  H05K2201/0116 ,  H05K2201/0715 ,  H05K2201/09872 ,  Y10T29/49144

Abstract: An electronic component built-in module includes an electronic component, a substrate on which the electronic component is mounted, a first resin covering the electronic component and the substrate, and a second resin covering the surface of the first resin. The first resin is formed of a resin including pores. The first resin is formed so that the thickness of the first resin on an area where the electronic component is not mounted is larger than that on an area where the electronic component is mounted on the surface of the substrate. A porosity of the second resin is smaller than that of the first resin.

Abstract translation: 电子部件内置模块包括电子部件，安装有电子部件的基板，覆盖电子部件和基板的第一树脂和覆盖第一树脂的表面的第二树脂。 第一树脂由包括孔的树脂形成。 第一树脂形成为使得未安装电子部件的区域上的第一树脂的厚度大于在电子部件安装在基板的表面上的区域的厚度。 第二树脂的孔隙率小于第一树脂的孔隙率。

公开(公告)号：US07989076B2

公开(公告)日：2011-08-02

申请号：US11986313

申请日：2007-11-20

Applicant: Hong Li ,  Robert A. Montague ,  Cheryl A. Richards ,  Nikita Sergeevitch Shelekhov ,  Natalia Aleksandrovna Kazachenok

Inventor： Hong Li ,  Robert A. Montague ,  Cheryl A. Richards ,  Nikita Sergeevitch Shelekhov ,  Natalia Aleksandrovna Kazachenok

IPC: C08K3/22 ,  C08K5/057 ,  C08K9/04 ,  C09C3/08

CPC classification number: C09C3/10 ,  C01P2002/82 ,  C01P2002/88 ,  C01P2004/04 ,  C01P2006/10 ,  C01P2006/40 ,  C08K9/04 ,  C08K9/08 ,  C09C3/12 ,  H05K1/0306 ,  H05K1/0373 ,  H05K2201/0116 ,  H05K2203/121 ,  Y10T428/31678 ,  Y10T428/31692

Abstract: The present invention relates to materials comprising organic-inorganic polymeric networks. In some embodiments, the present invention provides an organic-inorganic composite material comprising an inorganic metal oxide matrix interpenetrating with a polymeric phase. Additionally, the present invention provides methods of producing organic-inorganic composite materials.

Abstract translation: 本发明涉及包含有机 - 无机聚合物网络的材料。 在一些实施方案中，本发明提供了包含与聚合物相互渗透的无机金属氧化物基质的有机 - 无机复合材料。 另外，本发明提供了生产有机 - 无机复合材料的方法。

公开(公告)号：US07930974B2

公开(公告)日：2011-04-26

申请号：US11920411

申请日：2006-06-27

Applicant: Mitsunori Nakatani ,  Toshihiko Fujihara ,  Yuichiro Hosokawa

Inventor： Mitsunori Nakatani ,  Toshihiko Fujihara ,  Yuichiro Hosokawa

IPC: B41L13/00

CPC classification number: H05K3/1216 ,  B41F15/20 ,  H01L31/022425 ,  H01L31/18 ,  H05K2201/0116 ,  H05K2203/0165 ,  H05K2203/082 ,  Y02E10/50

Abstract: A printing stage includes a stage surface having a plurality of suction holes, and fixes an object to be printed on the stage surface by vacuum contact. A printing mask is employed for forming a predetermined electrode pattern on the object to be printed fixed to the printing stage. A squeegee applies a predetermined amount of pressure to a metal paste spread on the printing mask, to print the electrode pattern on the object to be printed. A porous body is provided between the object to be printed and the printing stage.

Abstract translation: 印刷台包括具有多个吸孔的台面，通过真空接触将要印刷的物体固定在台面上。 采用印刷掩模在待印刷对象上固定到印刷台上形成预定的电极图案。 刮刀对涂布在印刷掩模上的金属浆施加预定量的压力，以将印刷电极图案印刷在被印刷物上。 在被打印物和印刷台之间设置有多孔体。