公开(公告)号：US20100144924A1

公开(公告)日：2010-06-10

申请号：US12521502

申请日：2007-12-27

Applicant: Akihiko Yoshiwara ,  Junji Kodemura

Inventor： Akihiko Yoshiwara ,  Junji Kodemura

IPC: B05D5/12 ,  C08J9/32

CPC classification number: C08L65/00 ,  C08G61/08 ,  C08G2261/418 ,  C08J5/24 ,  C08J2365/00 ,  C08K3/36 ,  C08K7/26 ,  H01B3/448 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0254

Abstract: A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.

Abstract translation: 通过将包含亚苄基（1,3-二甲基-4-咪唑烷-2-亚基）（三环己基膦）二氯化钌，易环烯烃单体如2-降冰片烯或四环[6.2.1.13,6.02 ，7]十二碳-4-烯，链转移剂如甲基丙烯酸烯丙酯和中空颗粒如白砂糖气球。 通过将可聚合组合物涂布或浸渍到载体介质上或浸渍到载体介质中并进行可聚合组合物的本体聚合来获得可交联树脂复合材料。 通过使交联性树脂复合体交联而得到交联树脂复合体。

公开(公告)号：US20100129676A1

公开(公告)日：2010-05-27

申请号：US12596165

申请日：2008-04-25

Applicant: Daisuke Fujimoto ,  Yasuyuki Mizuno ,  Kazutoshi Danjoubara ,  Hikari Murai

Inventor： Daisuke Fujimoto ,  Yasuyuki Mizuno ,  Kazutoshi Danjoubara ,  Hikari Murai

IPC: B32B15/08 ,  C08L71/12 ,  C08K3/26 ,  C08K3/34 ,  C08K3/38 ,  C08K3/22 ,  C08K3/36

CPC classification number: H05K1/0353 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2274/00 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/726 ,  B32B2457/08 ,  C08J3/246 ,  C08J5/24 ,  C08J2387/00 ,  C08K3/013 ,  C08L9/00 ,  C08L15/00 ,  C08L21/00 ,  C08L47/00 ,  C08L71/00 ,  C08L71/12 ,  H05K1/024 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/31696 ,  C08L2666/14

Abstract: Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength.A process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process comprises the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer, a resin varnish, a prepreg, and a metal-clad laminate provided using the same.

Abstract translation: 本发明提供一种热固性树脂清漆的制造方法，由此能够制造印刷电路板，其中印刷电路板在高频带中具有优异的介电性能并且可以显着降低传输损耗，并且在吸湿后表现出优异的耐热性， 优异的热膨胀性能，并且满足金属箔剥离强度。 一种制备含有未固化的半IPN复合材料，无机填料和饱和热塑性弹性体的热固性树脂组合物的热固性树脂清漆的方法，其中该方法包括以下步骤：（i）预先反应（B） 在其分子中含有其侧链中具有1,2-乙烯基的1,2-丁二烯单元的40％以上且未经化学改性且（C）交联剂的丁二烯聚合物，在 存在（A）聚苯醚，得到未固化的半IPN复合材料的聚苯醚改性丁二烯预聚物; （ii）将（D）无机填料和（E）饱和热塑性弹性体混合在一起得到混合物; 和（iii）将得到的混合物和聚苯醚改性的丁二烯预聚物，树脂清漆，预浸渍体和使用其的覆金属层压板混合在一起。

公开(公告)号：US20100065316A1

公开(公告)日：2010-03-18

申请号：US12447653

申请日：2007-11-07

Applicant: Akira Sato ,  Akira Fujinoki ,  Hiroyuku Nishimura ,  Tsukasa Sakaguchi

Inventor： Akira Sato ,  Akira Fujinoki ,  Hiroyuku Nishimura ,  Tsukasa Sakaguchi

IPC: H05K1/02 ,  D03D15/00 ,  B32B5/00

CPC classification number: H05K1/0366 ,  D02G3/04 ,  D02G3/18 ,  D03D1/0082 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/0011 ,  D03D15/0016 ,  D03D15/0027 ,  D10B2101/06 ,  D10B2201/00 ,  D10B2321/02 ,  D10B2321/021 ,  D10B2321/022 ,  D10B2321/121 ,  H05K1/024 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10T442/30 ,  Y10T442/313 ,  Y10T442/3138 ,  Y10T442/3976

Abstract: Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.

Abstract translation: 公开了实现高速，高频半导体器件所需的印刷线路板的目的的印刷线路板，即具有低介电常数，低介电损耗角正切和低线膨胀系数的印刷线路板。 还公开了适合用作这种印刷线路板的基材的复合机织织物。 具体公开了含有石英玻璃纤维和聚烯烃纤维的复合机织织物，其中石英玻璃纤维与复合机织织物的比率设定在10体积％以上且90体积％以下。 优选石英玻璃纤维的长丝直径为3μm以上且16μm以下，复合织物的厚度为200μm以下。

公开(公告)号：US20100038023A1

公开(公告)日：2010-02-18

申请号：US12225435

申请日：2007-03-22

Applicant: Dong-Han Kho ,  Sang-Ki Chun ,  Se-Ra Kim ,  Suk-Ky Chang

Inventor： Dong-Han Kho ,  Sang-Ki Chun ,  Se-Ra Kim ,  Suk-Ky Chang

IPC: C08L83/04 ,  C08K3/28 ,  B32B33/00 ,  B32B37/00

CPC classification number: B32B27/36 ,  B32B7/06 ,  B32B15/08 ,  B32B17/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/283 ,  B32B2307/306 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/20 ,  C08K5/0075 ,  C08L83/00 ,  C09J183/04 ,  H05K3/007 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  Y10T428/1476

Abstract: Disclosed herein is an adhesive composition for transporting a flexible substrate, which is used to manufacture a flexible display device using a flexible substrate such as a plastic substrate by using a conventional line for manufacturing a liquid crystal display device comprising a glass substrate. The present invention provides an adhesive composition for transporting a flexible substrate, which includes 100 parts by weight of an adhesive for transporting a flexible substrate and 0.001 to 5 parts by weight of an antistatic agent, an adhesive sheet containing the composition, and a method of transporting a flexible substrate using the same.

Abstract translation: 本文公开了一种用于输送柔性基板的粘合剂组合物，其用于通过使用用于制造包括玻璃基板的液晶显示装置的传统线来制造使用诸如塑料基板的柔性基板的柔性显示装置。 本发明提供了一种用于输送柔性基材的粘合剂组合物，其包括100重量份的用于输送柔性基材的粘合剂和0.001至5重量份的抗静电剂，含有该组合物的粘合片，以及 使用其移动柔性基板。

公开(公告)号：US07504719B2

公开(公告)日：2009-03-17

申请号：US11188886

申请日：2005-07-26

Applicant: Honchin En ,  Masayuki Hayashi ,  Dongdong Wang ,  Kenichi Shimada ,  Motoo Asai ,  Koji Sekine ,  Tohru Nakai ,  Shinichiro Ichikawa ,  Yukihiko Toyoda

Inventor： Honchin En ,  Masayuki Hayashi ,  Dongdong Wang ,  Kenichi Shimada ,  Motoo Asai ,  Koji Sekine ,  Tohru Nakai ,  Shinichiro Ichikawa ,  Yukihiko Toyoda

IPC: H01L23/12 ,  H01L21/4763

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract translation: 本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。 本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。

公开(公告)号：US20080289864A1

公开(公告)日：2008-11-27

申请号：US12146105

申请日：2008-06-25

Applicant: Honchin EN ,  Masayuki Hayashi ,  Dongdong Wang ,  Kenichi Shimada ,  Motoo Asai ,  Koji Sekine ,  Tohru Nakai ,  Shinichiro Ichikawa ,  Yukihiko Toyoda

Inventor： Honchin EN ,  Masayuki Hayashi ,  Dongdong Wang ,  Kenichi Shimada ,  Motoo Asai ,  Koji Sekine ,  Tohru Nakai ,  Shinichiro Ichikawa ,  Yukihiko Toyoda

IPC: H05K1/09

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

公开(公告)号：US20080289176A1

公开(公告)日：2008-11-27

申请号：US12146204

申请日：2008-06-25

Applicant: Honchin EN ,  Masayuki Hayashi ,  Dongdong Wang ,  Kenichi Shimada ,  Motoo Asai ,  Koji Sekine ,  Tohru Nakai ,  Shinichiro Ichikawa ,  Yukihiko Toyoda

Inventor： Honchin EN ,  Masayuki Hayashi ,  Dongdong Wang ,  Kenichi Shimada ,  Motoo Asai ,  Koji Sekine ,  Tohru Nakai ,  Shinichiro Ichikawa ,  Yukihiko Toyoda

IPC: H05K3/00

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract translation: 本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。 本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。

公开(公告)号：US07364672B2

公开(公告)日：2008-04-29

申请号：US11006211

申请日：2004-12-06

Applicant: Thomas Allan Koes ,  Ousama Najjar

Inventor： Thomas Allan Koes ,  Ousama Najjar

IPC: H01B1/12 ,  C08L23/08

CPC classification number: H05K1/0326 ,  C08J5/24 ,  H05K1/0353 ,  H05K2201/0158

Abstract: In accordance with the present invention, we have developed compositions useful for the preparation of prepregs, laminates, and the like having excellent performance properties. Invention compositions comprise a combination of a first component (i.e., a low loss, low dielectric constant, hydrocarbyl thermoplastic resin), a second component (i.e., a component which is capable of crosslinking to produce a thermoset in the presence of the first component), a free radical source, and optionally, one or more additives and/or diluents. Invention compositions can be prepared from widely available and inexpensive starting materials. As a result, invention compositions not only provide fabricated articles having outstanding performance properties, in addition, the cost of producing the resulting articles compares quite favorably with the cost of making competitive materials which require the use of more expensive, less readily available starting materials. Also provided in accordance with the present invention are prepregs prepared from invention compositions, laminated sheets prepared from the above-described prepregs, printed wiring boards, methods of making each of the above, and the like.

Abstract translation: 根据本发明，我们开发了可用于制备具有优异性能的预浸料，层压板等的组合物。 本发明组合物包括第一组分（即，低损失，低介电常数，烃基热塑性树脂），第二组分（即，在第一组分存在下能够交联以产生热固性的组分）的组合， ，自由基源和任选的一种或多种添加剂和/或稀释剂。 本发明组合物可以由广泛可得的和廉价的原料制备。 结果，本发明组合物不仅提供具有突出性能的制品，此外，生产所得制品的成本与制造需要使用更昂贵，不太容易获得的起始材料的竞争性材料的成本相当有利。 根据本发明还提供了由本发明组合物制备的预浸料，由上述预浸料制备的层压片，印刷线路板，制备上述各种方法等。

公开(公告)号：US07335608B2

公开(公告)日：2008-02-26

申请号：US10948386

申请日：2004-09-22

Applicant: Ravindra V. Tanikella

Inventor： Ravindra V. Tanikella

IPC: H01L21/31 ,  H01L21/302

CPC classification number: H01L23/49894 ,  C08F283/04 ,  C08G73/121 ,  C08K3/36 ,  C08K9/10 ,  C08K2201/011 ,  C08L79/08 ,  C08L2666/66 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/15787 ,  H01L2924/15791 ,  H01L2924/18161 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/28 ,  H05K3/421 ,  H05K3/422 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/1163 ,  H05K2203/121 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening.

公开(公告)号：US20070148467A1

公开(公告)日：2007-06-28

申请号：US11614505

申请日：2006-12-21

Applicant: Michael St. Lawrence ,  Murali Sethumadhavan ,  Ani Shere

Inventor： Michael St. Lawrence ,  Murali Sethumadhavan ,  Ani Shere

IPC: B32B9/04

CPC classification number: H05K1/0373 ,  B82Y10/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10T428/31504 ,  H01L2924/00

Abstract: A thermal management circuit material comprises an electrically conductive layer; a dielectric layer comprising a polymer matrix and a thermally conductive, electrically non-conductive particulate filler, wherein the dielectric layer is disposed on and in at least partial contact with the electrically conductive layer, and wherein the circuit material has a thermal conductivity of greater than or equal to about 1 watt per meter-degree Kelvin.

Abstract translation: 热管理电路材料包括导电层; 介电层，其包含聚合物基质和导热的不导电的颗粒填料，其中所述电介质层设置在所述导电层上并至少部分地与所述导电层接触，并且其中所述电路材料具有大于 或等于约1瓦/米开尔文。