公开(公告)号：US20070210420A1

公开(公告)日：2007-09-13

申请号：US11372555

申请日：2006-03-11

Applicant: Curt Nelson ,  Ronald Hellekson ,  Peter Nyholm ,  Michael French

Inventor： Curt Nelson ,  Ronald Hellekson ,  Peter Nyholm ,  Michael French

IPC: H01L29/40 ,  H01L21/465

CPC classification number: H05K3/027 ,  B23K26/40 ,  B23K2103/172 ,  H05K3/048 ,  H05K2201/0317 ,  H05K2203/107

Abstract: A plastic substrate is provided, on which is disposed a sacrificial polymer layer and a thin metal film over the sacrificial polymer layer. The thin metal film is laser-delamination patterned. The sacrificial polymer layer is at least partially removed via laser delamination where the thin metal film has been removed via laser delamination.

Abstract translation: 提供塑料基板，在其上在牺牲聚合物层上设置牺牲聚合物层和薄金属膜。 薄金属膜是激光分层图案。 牺牲聚合物层通过激光分层至少部分去除，其中薄金属膜已经通过激光分层去除。

公开(公告)号：US07261920B2

公开(公告)日：2007-08-28

申请号：US10666912

申请日：2003-09-19

Applicant: Jeanne E. Haubrich ,  Yi-Shung Chaug ,  Zarng-Arh George Wu ,  Rong-Chang Liang

Inventor： Jeanne E. Haubrich ,  Yi-Shung Chaug ,  Zarng-Arh George Wu ,  Rong-Chang Liang

IPC: B05D1/32 ,  B05D3/10 ,  B05D5/12 ,  H01L21/31 ,  H01L21/36 ,  B32B31/10 ,  B32B43/00

CPC classification number: G02F1/13439 ,  H05K3/04 ,  H05K3/048 ,  H05K3/146 ,  H05K3/16 ,  H05K3/184 ,  H05K3/386 ,  H05K2201/0317 ,  H05K2203/0257 ,  H05K2203/0264 ,  H05K2203/0522 ,  H05K2203/0746 ,  Y10S156/922 ,  Y10T156/11

Abstract: A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.

Abstract translation: 公开了一种在衬底上形成图案化薄膜结构的工艺。 在衬底上印有诸如掩模涂层或油墨的材料的图案，该图案使得在一个实施例中，将在不存在印刷材料的区域中形成所需的薄膜结构， 即，印刷要形成的薄膜结构的负像。 在另一个实施例中，图案印刷有难以从衬底剥离的材料，并且所需的薄膜结构将形成在存在印刷材料的区域中，即，薄膜结构的正像是 印刷。 薄膜材料沉积在图案化的衬底上，并且不期望的区域被剥离，留下图案化的薄膜结构。

公开(公告)号：US20070090546A1

公开(公告)日：2007-04-26

申请号：US11338857

申请日：2006-01-25

Applicant: Takeshi Shioga ,  Yoshikatsu Ishizuki ,  Kanae Nakagawa ,  Taiji Sakai ,  Masataka Mizukoshi ,  John Baniecki ,  Kazuaki Kurihara

Inventor： Takeshi Shioga ,  Yoshikatsu Ishizuki ,  Kanae Nakagawa ,  Taiji Sakai ,  Masataka Mizukoshi ,  John Baniecki ,  Kazuaki Kurihara

IPC: H01L23/29

CPC classification number: H01L23/50 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0023 ,  H05K3/0044 ,  H05K3/20 ,  H05K3/4614 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09763 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0733 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/05599

Abstract: The interposer comprises a base 8 formed of a plurality of resin layers 68, 20, 32, 48; thin-film capacitors 18a, 18b buried between a first resin layer 68 of said plurality of resin layers and a second resin layer 20 of said plurality of resin layers, which include first capacitor electrodes 12a, 12b, second capacitor electrodes 16 opposed to the first capacitor electrode 12a, 12b and the second capacitor electrode 16, and a capacitor dielectric film 14 of a relative dielectric constant of 200 or above formed between the first capacitor electrode 12a, 12b and the second capacitor electrode 16; a first through-electrode 77a formed through the base 8 and electrically connected to the first capacitor electrode 12a, 12b; and a second through-electrode 77b formed through the base 8 and electrically connected to the second capacitor electrode 16.

Abstract translation: 插入件包括由多个树脂层68,20,32,48形成的基座8; 掩埋在所述多个树脂层的第一树脂层68和所述多个树脂层的第二树脂层20之间的薄膜电容器18a，18b，其包括第一电容器电极12a，12b，第二电容器电极16 与第一电容器电极12a，12b和第二电容器电极16相对，以及形成在第一电容器电极12a，12b和第二电容器电极16之间的相对介电常数为200或更大的电容器电介质膜14 ; 通过基座8形成并电连接到第一电容器电极12a，12b的第一贯通电极77a; 以及通过基底8形成并电连接到第二电容器电极16的第二贯通电极77b。

公开(公告)号：US07199457B2

公开(公告)日：2007-04-03

申请号：US10432005

申请日：2002-09-19

Applicant: Tsuyoshi Ogawa

Inventor： Tsuyoshi Ogawa

IPC: H01L23/06 ,  H01L29/00

CPC classification number: H01L23/49894 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/498 ,  H01L23/49822 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/162 ,  H05K1/167 ,  H05K3/062 ,  H05K3/067 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/09509 ,  H05K2203/0315 ,  H05K2203/0361 ,  H05K2203/1453 ,  Y10S438/957 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a thin film circuit board device having passive elements in wiring layers. The thin film circuit board device includes a base board (2) and a circuit part (3) including insulating layers (11) and (16) and pattern wiring (14) and (17) formed on a build-up forming surface (2a). On the first insulating layer (11), a receiving electrode part (21) is formed and the passive elements electrically connected to the receiving electrode part (21) are formed. In the circuit part (3), a substrate titanium film and a substrate film are laminated so as to cover the receiving electrode part (21) and the passive elements respectively. The substrate film and the substrate titanium film in areas in which a metallic film is not formed are etched through the metallic film serving as the first pattern wiring (14) formed on the substrate film as a mask. Thus, a substrate layer (23) and a substrate titanium layer (22) are formed. Consequently, the substrate titanium film serving as the substrate titanium layer (22) prevents the corrosion of the receiving electrode part and the respective passive elements due to etching liquid to form the passive elements with high performance.

Abstract translation: 本发明涉及一种在布线层中具有无源元件的薄膜电路板器件。 薄膜电路板装置包括基板（2）和包括绝缘层（11）和（16）的电路部分（3）和形成在积层形成表面（2）上的图案布线（14）和（17） 一个）。 在第一绝缘层（11）上，形成接收电极部（21），并且形成与接收电极部（21）电连接的无源元件。 在电路部分（3）中，层叠基板钛膜和基板膜以覆盖接收电极部分（21）和无源元件。 通过作为形成在基板膜上的第一图案布线（14）的金属膜作为掩模，蚀刻在未形成金属膜的区域中的基板膜和基板钛膜。 因此，形成基板层（23）和基板钛层（22）。 因此，用作基板钛层（22）的基板钛膜防止由于蚀刻液体而导致的接收电极部分和各个无源元件的腐蚀，从而形成具有高性能的无源元件。

公开(公告)号：US07158383B2

公开(公告)日：2007-01-02

申请号：US10716143

申请日：2003-11-18

Applicant: Kevin M. Durocher ,  Richard J. Saia ,  Vikram B. Krishnamurthy

Inventor： Kevin M. Durocher ,  Richard J. Saia ,  Vikram B. Krishnamurthy

IPC: H05K1/16

CPC classification number: H01C17/12 ,  B29C59/14 ,  H01C7/006 ,  H05K1/0346 ,  H05K1/167 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/095 ,  H05K2203/1136

Abstract: A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is disposed over the activated portion of the substrate, thereby resulting in the formation of a highly resistive metal-carbide region. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal carbide region. The metal-carbide region is patterned to form a resistor between the terminals. Alternatively, only a selected area of the polyimide substrate is activated. The selected area forms the area in which the metal-carbide region is formed. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal-carbide region.

Abstract translation: 一种在柔性基板上制造电阻器的技术。 具体地，通过暴露于离子溅射蚀刻技术来活化聚酰亚胺基底的至少一部分。 金属层设置在基板的激活部分上，从而形成高电阻金属碳化物区域。 互连层设置在金属碳化物区域上并被图案化以在金属碳化物区域的相对端形成端子。 将金属碳化物区域图案化以在端子之间形成电阻器。 或者，仅激活聚酰亚胺基板的选定区域。 所选择的区域形成形成金属碳化物区域的区域。 互连层设置在金属碳化物区域上并被图案化以在金属碳化物区域的相对端形成端子。

公开(公告)号：US20060202349A1

公开(公告)日：2006-09-14

申请号：US11429062

申请日：2006-05-08

Applicant: Takaaki Higashida ,  Takafumi Okuma ,  Daisuke Suetsugu ,  Seiji Nakashima ,  Kenichi Yamamoto ,  Munekazu Nishihara ,  Kenichi Sato

Inventor： Takaaki Higashida ,  Takafumi Okuma ,  Daisuke Suetsugu ,  Seiji Nakashima ,  Kenichi Yamamoto ,  Munekazu Nishihara ,  Kenichi Sato

IPC: H01L23/52

CPC classification number: H05K1/186 ,  H01L23/5387 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/19106 ,  H04R17/00 ,  H05K1/056 ,  H05K1/16 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0317 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2201/10037 ,  H05K2201/10083 ,  H01L2924/00

Abstract: A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.

公开(公告)号：US07026716B2

公开(公告)日：2006-04-11

申请号：US10741981

申请日：2003-12-19

Applicant: Ganapathiraman Ramanath ,  Pethuraja Gopal Ganesan ,  Kunjukrishna Pillai Vijayamohanan

Inventor： Ganapathiraman Ramanath ,  Pethuraja Gopal Ganesan ,  Kunjukrishna Pillai Vijayamohanan

IPC: H01L23/532 ,  H01L21/47

CPC classification number: H05K3/389 ,  B82Y10/00 ,  H01L51/0075 ,  H01L51/0595 ,  H05K2201/0317

Abstract: An electrical device is disclosed. The electrical device includes a substrate, and a self-assembled molecular layer on the substrate. The self-assembled molecular layer comprises a plurality of molecules, each molecule comprising a first end proximate to the substrate and a second end comprising sulfur distal to the substrate. A copper layer is on the self-assembled molecular layer.

Abstract translation: 公开了一种电气设备。 电气装置包括衬底和衬底上的自组装分子层。 自组装分子层包含多个分子，每个分子包括靠近基底的第一端和包含远离基底的硫的第二端。 铜层位于自组装分子层上。

公开(公告)号：US20060055023A1

公开(公告)日：2006-03-16

申请号：US11022244

申请日：2004-12-23

Applicant: Kwun-Yao Ho ,  Moriss Kung

Inventor： Kwun-Yao Ho ,  Moriss Kung

IPC: H01L23/52

CPC classification number: H01L23/498 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/0317 ,  H05K2203/049 ,  H05K2203/072 ,  H05K2203/073 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip carrier comprising a laminated layer and an oxidation protection layer is provided. The oxidation protection layer is a non-electrolytic metallic coating or an organic oxidation protection film on the surface of bonding finger pads or other contacts formed by deploying a simple, fast film-coating technique. Therefore, there is no need to plate a Ni/Au layer on the bonding pads or contacts using expensive electroplating equipment for preventing oxidation and there is no need to fabricate plating lines on the chip carrier or reserve space for laying out the plating lines. Thus, the cost for fabricating the chip carrier is reduced, the effective area of the chip carrier is increased and the electrical performance of the chip carrier is improved.

Abstract translation: 提供了包括层叠层和氧化保护层的芯片载体。 氧化保护层是通过展开简单，快速的膜涂覆技术形成的接合指垫或其他接触物的表面上的非电解金属涂层或有机氧化保护膜。 因此，不需要使用昂贵的电镀设备在接合焊盘或触点上镀Ni / Au层，以防止氧化，并且不需要在芯片载体或储备空间上制造电镀线来布置电镀线。 因此，制造芯片载体的成本降低，芯片载体的有效面积增加，芯片载体的电气性能提高。

公开(公告)号：US20060017133A1

公开(公告)日：2006-01-26

申请号：US11188723

申请日：2005-07-26

Applicant: Kiyoshi Oi ,  Yasuyoshi Horikawa ,  Akihito Takano

Inventor： Kiyoshi Oi ,  Yasuyoshi Horikawa ,  Akihito Takano

IPC: H01L29/00

CPC classification number: H05K1/185 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/82 ,  H01L2224/18 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/141 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4602 ,  H05K2201/0317 ,  H05K2201/10045 ,  H05K2203/016

Abstract: An electronic part-containing element used by being incorporated in an electronic device, in which the electronic part-containing element comprises an insulating support member which does not take part in the constitution of the electronic device but is removed in the process of producing the electronic device, and a circuit module supported by the support member, and the circuit module contains one or more electronic parts, each in the form of a thin film, therein and has connection terminals for the electronic part at least on the surface thereof that comes into contact with the support member.

Abstract translation: 一种电子部件容纳元件，其通过结合在电子装置中而被使用，其中所述电子部件容纳元件包括绝缘支撑构件，所述绝缘支撑构件不参与所述电子装置的构造，但在制造所述电子装置的过程中被去除 装置和由支撑构件支撑的电路模块，并且电路模块包含一个或多个薄膜形式的电子部件，其中至少在其表面上具有用于电子部件的连接端子 与支撑构件接触。

公开(公告)号：US20050224977A1

公开(公告)日：2005-10-13

申请号：US11044716

申请日：2005-01-28

Applicant: Yusuke Yoshimura ,  Toshikazu Fujimoto ,  Toshiaki Arai

Inventor： Yusuke Yoshimura ,  Toshikazu Fujimoto ,  Toshiaki Arai

IPC: H01L21/44 ,  H01L21/768 ,  H01L29/40 ,  H05K1/03 ,  H05K3/24 ,  H05K3/38

CPC classification number: H01L21/7685 ,  H01L21/76838 ,  H01L21/76852 ,  H05K1/0306 ,  H05K3/244 ,  H05K3/388 ,  H05K2201/0317

Abstract: The present invention provides a wiring substrate. The wiring substrate includes a substrate, a copper wiring layer, and a diffusing barrier layer. The copper wiring layer is formed above the substrate and is made of copper or a material containing copper as a principal component. The diffusing barrier layer is formed on the copper wiring layer and is made of metal containing nitrogen. Meanwhile a method for manufacturing the wiring substrate is provided.

Abstract translation: 本发明提供一种布线基板。 布线基板包括基板，铜布线层和扩散阻挡层。 铜布线层形成在基板的上方，由铜或以铜为主要成分的材料制成。 扩散阻挡层形成在铜布线层上，由含有氮的金属制成。 同时提供一种制造布线基板的方法。