公开(公告)号：US08563992B2

公开(公告)日：2013-10-22

申请号：US13218677

申请日：2011-08-26

Applicant: Hideaki Kato ,  Yasutaka Higuchi

Inventor： Hideaki Kato ,  Yasutaka Higuchi

IPC: H01L27/15

CPC classification number: H05K3/0052 ,  F21V5/007 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K2201/0909 ,  H05K2201/10106

Abstract: A light emitting apparatus includes a belt-like substrate, a light emitting element mounted on the substrate, and a luminous flux control member mounted on the substrate. The substrate has a pair of fracture surfaces formed at predetermined intervals along a lengthwise direction and formed at both ends in a widthwise direction between luminous flux control members neighboring each other along the lengthwise direction, wherein dimensions W1 and W2 in the widthwise direction between the pair of fracture surfaces are less than a dimension in the widthwise direction of the luminous flux control member, and the dimension W2 in the widthwise direction of a part overlapping the luminous flux control member in a plan view is less than the dimension W1 in the widthwise direction between the pair of fracture surfaces.

Abstract translation: 发光装置包括带状基板，安装在基板上的发光元件和安装在基板上的光束控制构件。 基板具有沿着长度方向以规定间隔形成的一对断面，沿着长度方向彼此相邻的光束控制部件之间的宽度方向的两端形成，其中，宽度方向上的尺寸W1和W2 断裂面的尺寸小于光束控制部件的宽度方向的尺寸，并且在平面图中与光束控制部件重叠的部分的宽度方向的尺寸W2小于宽度方向的尺寸W1 在一对断裂面之间。

公开(公告)号：US08487189B2

公开(公告)日：2013-07-16

申请号：US12929902

申请日：2011-02-23

Applicant: Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

Inventor： Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

IPC: H05K1/00

CPC classification number: H05K1/0269 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/0969 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53022 ,  Y10T29/53026 ,  Y10T29/5303 ,  Y10T29/53035 ,  Y10T29/53039 ,  Y10T29/53043

Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.

公开(公告)号：US20130163249A1

公开(公告)日：2013-06-27

申请号：US13821542

申请日：2011-08-23

Applicant: Kenji Miura

Inventor： Kenji Miura

IPC: F21V21/00 ,  B26D1/24

CPC classification number: H05K3/0052 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0287 ,  H05K2201/0909 ,  H05K2201/093 ,  H05K2201/10106 ,  H05K2203/0228 ,  H05K2203/175 ,  Y10T83/0581

Abstract: It is an object of the present invention to permit division of an LED wiring board into various sizes to permit its use before and after the division, and also simplify operation of this division and simplify circuit design. More specifically, in the present invention, wiring patterns and for energizing LEDs are formed in a planar direction of the LED wiring board. Division grooves for dividing the LED wiring board into a plurality of sub-boards are formed on the front surface of the LED wiring board in a perpendicular direction and are provided in a manner such as to cross the wiring patterns in the planar direction. Use with the entire board before the division by the division grooves is possible, and use with division elements divided along any of the division grooves is also possible.

Abstract translation: 本发明的目的是允许将LED布线板划分成各种尺寸以允许其在划分之前和之后的使用，并且还简化该划分的操作并简化电路设计。 更具体地，在本发明中，在LED布线板的平面方向上形成布线图案和用于激励LED的布线图案。 在LED布线板的正面垂直方向上形成用于将LED布线板分割为多个子板的分割槽，并且以与平面方向交叉的方式设置。 在通过分割槽进行分割之前可以使用整个板，并且可以沿着任何分割槽划分的分割元件使用。

公开(公告)号：US20120261477A1

公开(公告)日：2012-10-18

申请号：US13449237

申请日：2012-04-17

Applicant: Paul Elizondo ,  John Azevedo

Inventor： Paul Elizondo ,  John Azevedo

IPC: G06K19/077

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

Abstract translation: 分离的RFID标签被配置为使得其包括印刷电路板组件（PCB）的一部分。 因此，分离的RFID标签可以用于在通过制造过程迁移时跟踪PCB。 在一个实施例中，RFID标签可以首先组装，然后用于跟踪PCB，因为它被填充有部件并且被安装到更大的组件中并且最终进入终端设备。 一旦PCB被安装到更大的组件或终端设备中，分离的RFID标签被配置成使得它可以被分解并且附接到较大组件或终端设备的外部。

公开(公告)号：US20120247811A1

公开(公告)日：2012-10-04

申请号：US13420780

申请日：2012-03-15

Applicant: GWUN-JIN LIN ,  KUO-FU SU ,  CHIH-HENG CHUO

Inventor： GWUN-JIN LIN ,  KUO-FU SU ,  CHIH-HENG CHUO

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K3/4635 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A composite circuit board with fracturable structure includes a first flat cable and first signal transmission lines formed on the first flat cable. A second flat cable is stacked on and bonded to the first circuit flat cable. The second flat cable includes second signal transmission lines and forms an overlapping segment and a selective breakable segment between which a fracturable structure is formed. The selective breakable segment covers the connection segment of the first flat cable or may be broken off for separation of the flat cables. Some of the second signal transmission lines of the second flat cable are connected through a hole in the first circuit flat cable to the first signal transmission lines of the first flat cable or connected through the hole to the conductive terminals of the connection segment of the first flat cable.

Abstract translation: 具有可断裂结构的复合电路板包括形成在第一扁平电缆上的第一扁平电缆和第一信号传输线。 第二扁平电缆堆叠在第一电路扁平电缆上并结合到第一电路扁平电缆上。 第二扁平电缆包括第二信号传输线并且形成重叠段和选择性可断裂段，在其之间形成可破裂结构。 所述选择性可破坏部分覆盖所述第一扁平电缆的连接部分，或者可以断开以分离扁平电缆。 第二扁平电缆的第二信号传输线中的一些通过第一电路扁平电缆中的一个孔连接到第一扁平电缆的第一信号传输线或者通过该孔连接到第一扁平电缆的连接段的导电端子 扁平电缆。

公开(公告)号：US08278563B1

公开(公告)日：2012-10-02

申请号：US12059739

申请日：2008-03-31

Applicant: Chender Chen

Inventor： Chender Chen

IPC: H05K1/11

CPC classification number: H05K3/242 ,  H05K3/0097 ,  H05K2201/0909

Abstract: Method and apparatuses directed to printed circuit boards (PCB) including plated through-holes for interconnecting to plating busses are described herein. A PCB strip may include an inner circuitry layer comprising a plurality of trace lines, and a top circuitry layer formed over the inner circuitry layer, the top circuitry layer including a plating bus, and at least one plated through-hole interconnecting the plating bus to one or more trace lines of the inner circuitry layer. The plating bus of the top circuitry layer and the plated through-holes may be located within at least one saw street of the PCB strip.

Abstract translation: 本文描述了针对包括用于互连到电镀总线的电镀通孔的印刷电路板（PCB）的方法和装置。 PCB条可以包括包含多个迹线的内部电路层，以及形成在所述内部电路层上的顶部电路层，所述顶部电路层包括电镀母线，以及至少一个电镀通孔将所述电镀母线互连到 内部电路层的一个或多个迹线。 顶部电路层和电镀通孔的电镀母线可以位于PCB板的至少一个锯条中。

公开(公告)号：US20120235703A1

公开(公告)日：2012-09-20

申请号：US13413742

申请日：2012-03-07

Applicant: Yuichiro Ueda ,  Noriaki Orikasa ,  Takashi Nishizawa ,  Shugo Okamura

Inventor： Yuichiro Ueda ,  Noriaki Orikasa ,  Takashi Nishizawa ,  Shugo Okamura

IPC: G01R31/28 ,  G06F1/16

CPC classification number: H05K1/0268 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/175

Abstract: A circuit board includes a main part on which a processor is mounted, a cut part to be cut off from the main part at a cut section before the board is reused, and a conductor pattern wired through the cut part via the cut section and to be cut off into a plurality of patterns at the cut section as the cut part is cut off. The processor detects a difference in signal level between a level of a signal output from the conductor pattern before the cut part is cut off, and a level of the signal output from the conductor pattern after the cut part is cut off, to determine a number of times the board is reused.

Abstract translation: 电路板包括其上安装有处理器的主要部分，在板被重新使用之前在切割部分处从主要部分切断的切割部分以及经由切割部分穿过切割部分的导体图案，以及 当切割部分被切断时，在切割部分切割成多个图案。 处理器检测在切割部分被切断之前从导体图案输出的信号的电平与在切割部分被切断之后从导体图案输出的信号的电平之间的信号电平差，以确定数字 的时间，董事会被重用。

公开(公告)号：US20120222895A1

公开(公告)日：2012-09-06

申请号：US13393447

申请日：2010-12-24

Applicant: Kazuhito Imamura ,  Yousuke Moriyama

Inventor： Kazuhito Imamura ,  Yousuke Moriyama

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K3/0052 ,  H01L21/481 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/96 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/0008 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09918 ,  H05K2203/1572 ,  H01L2924/00

Abstract: In a many-up wiring substrate including a base substrate having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions, the plurality of wiring substrate regions being arranged in a matrix, when seen in a transparent plan view, dividing grooves of the main surface and dividing grooves of an opposite main surface are formed to be deviated in one direction of transverse direction or longitudinal direction, and a distance between bottoms of the dividing grooves of one main surface and bottoms of the dividing grooves of the opposite main surface is smaller than a distance between the bottoms of the dividing grooves of the one main surface and the opposite main surface and a distance between the bottoms of the dividing grooves of the opposite main surface and the one main surface.

Abstract translation: 在具有形成为主要部分的分隔槽的基底基板的多个布线基板中，沿着多个布线基板区域的边界，当以透明的方案看时，将多个布线基板区域布置成矩阵状 如图所示，主表面的分割槽和相对的主表面的分隔槽形成为在横向或纵向的一个方向上偏离，并且分隔槽的一个主表面和底部的分隔槽的底部之间的距离 相对的主表面的分隔槽的底部与相对的主表面的分隔槽的底部之间的距离以及相对的主表面和一个主表面的分隔槽的底部之间的距离小于相对主表面的距离。

公开(公告)号：US08259467B2

公开(公告)日：2012-09-04

申请号：US12537586

申请日：2009-08-07

Applicant: Yasushi Hasegawa

Inventor： Yasushi Hasegawa

IPC: H05K7/02

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K3/30 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/161 ,  Y10T29/49126

Abstract: A method of fabricating a multi-piece board includes: adhering a first frame element connected to multiple piece portions to a second frame element, the first frame element forming a board main portion of a multi-piece board, the first frame element and the second frame element forming a frame portion of the multi-piece portion, thereby yielding the multi-piece board; mounting multiple electronic components on the piece portions, respectively; separating the piece portions from the frame portion; separating, from the first frame element, the second frame element adhered thereto; and adhering the second frame element to a first frame element of another board main portion.

Abstract translation: 一种制造多片板的方法包括：将连接到多片部分的第一框架元件粘附到第二框架元件，第一框架元件形成多片板的板主体部分，第一框架元件和第二框架元件 框架元件形成多片部分的框架部分，从而产生多片板; 分别在零件上安装多个电子部件; 将所述片部分与所述框架部分分离; 从第一框架元件分离粘附到其上的第二框架元件; 以及将所述第二框架元件粘合到另一个板主体部分的第一框架元件。

公开(公告)号：US08179265B2

公开(公告)日：2012-05-15

申请号：US11766737

申请日：2007-06-21

Applicant: Paul Elizondo ,  John Azevedo

Inventor： Paul Elizondo ,  John Azevedo

IPC: G08B13/14

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

Abstract translation: 分离的RFID标签被配置为使得其包括印刷电路板组件（PCB）的一部分。 因此，分离的RFID标签可以用于在通过制造过程迁移时跟踪PCB。 在一个实施例中，RFID标签可以首先组装，然后用于跟踪PCB，因为它被填充有部件并且被安装到更大的组件中并且最终进入终端设备。 一旦PCB被安装到更大的组件或终端设备中，分离的RFID标签被配置成使得它可以被分解并且附接到较大组件或终端设备的外部。