公开(公告)号：US20040124961A1

公开(公告)日：2004-07-01

申请号：US10737633

申请日：2003-12-15

Applicant: Alps Electric Co., Ltd.

Inventor： Toru Aoyagi

IPC: H01F005/00

CPC classification number: H01F5/00 ,  H01F17/0033 ,  H05K1/0272 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09163

Abstract: There is disclosed a printed inductor 1 having a spiral coil formed outside a cavity 2 by providing an insulating substrate 3 with the cavity 2 extending in a direction orthogonal to that of the thickness of the insulating substrate 3, forming a plurality of mutually independent printed wiring lines 4 on both the top and bottom faces of the insulating substrate 3 facing each other through the cavity 2, and sequentially and continuously connecting terminals of the printed wiring lines 4 on both the top and bottom faces to each other through a plurality of through holes 5.

Abstract translation: 公开了一种印刷电感器1，其具有通过提供绝缘基板3而形成在空腔2外部的螺旋线圈，空腔2沿垂直于绝缘基板3的厚度的方向延伸，形成多个相互独立的印刷布线 通过空腔2彼此面对的绝缘基板3的顶面和底面上的线4，并且通过多个通孔依次连续地连接印刷布线4的两个顶面和底面之间的端子 5。

公开(公告)号：US5320541A

公开(公告)日：1994-06-14

申请号：US7935

申请日：1993-01-25

Applicant: Iosif Korsunsky ,  Dimitry G. Grabbe

Inventor： Iosif Korsunsky ,  Dimitry G. Grabbe

IPC: H01R12/50 ,  H01R12/57 ,  H01R12/58 ,  H01R12/71 ,  H01R12/73 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H01R23/70

CPC classification number: H05K3/3405 ,  H01R12/716 ,  H01R12/737 ,  H01R23/6873 ,  H01R12/57 ,  H01R12/585 ,  H05K1/117 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/1034 ,  H05K2201/10401 ,  H05K2201/10659 ,  H05K2201/10916 ,  H05K3/429 ,  Y10T29/49149

Abstract: An electrical connector has first terminals which are surface mounted to respective sides of a substrate and second terminals which extend through an edge surface of the substrate to make electrical connection to an opening provided in the substrate. As the connector is mated to the edge of the substrate, the connector occupies a minimal space on the substrate.

Abstract translation: 电连接器具有表面安装到基板的相对侧的第一端子和延伸穿过基板的边缘表面的第二端子，以与设置在基板中的开口电连接。 当连接器配合到基板的边缘时，连接器占据基板上的最小空间。

公开(公告)号：US5199885A

公开(公告)日：1993-04-06

申请号：US873526

申请日：1992-04-21

Applicant: Iosif Korsunsky ,  Dimitry G. Grabbe

Inventor： Iosif Korsunsky ,  Dimitry G. Grabbe

IPC: H01R12/50 ,  H01R12/57 ,  H01R12/58 ,  H01R12/71 ,  H01R12/73 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/3405 ,  H01R12/716 ,  H01R12/737 ,  H01R23/6873 ,  H01R12/57 ,  H01R12/585 ,  H05K1/117 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/1034 ,  H05K2201/10401 ,  H05K2201/10659 ,  H05K2201/10916 ,  H05K3/429 ,  Y10T29/49149

Abstract: An electrical connector has first terminals which are surface mounted to respective sides of a substrate and second terminals which extend through an edge surface of the substrate to make electrical connection to an opening provided in the substrate. As the connector is mated to the edge of the substrate, the connector occupies a minimal space on the substrate.

Abstract translation: 电连接器具有表面安装到基板的相对侧的第一端子和延伸穿过基板的边缘表面的第二端子，以与设置在基板中的开口电连接。 当连接器配合到基板的边缘时，连接器占据基板上的最小空间。

公开(公告)号：US4187529A

公开(公告)日：1980-02-05

申请号：US828788

申请日：1977-08-29

Applicant: John E. Bartley ,  Orville R. Penrod ,  Lawrence D. Radosevich

Inventor： John E. Bartley ,  Orville R. Penrod ,  Lawrence D. Radosevich

IPC: H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K1/14 ,  H05K1/16 ,  H05K3/34 ,  H05K3/40 ,  H05K1/04

CPC classification number: H05K1/167 ,  H01L21/4867 ,  H01L23/49811 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/141 ,  H05K1/162 ,  H05K2201/09163 ,  H05K2201/10045 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K3/403

Abstract: An electrical circuit device having a substrate including circuit components on at least one side thereof and a plurality of through openings in the substrate. Terminal leads are positioned in the openings each with a deformation intermediate the ends of the leads and spaced internally of the opening from a soldered area at the juncture of the exposed portion of the leads and the termination edge of the substrate. Two methods of assembly of leads to the substrate are also disclosed.

Abstract translation: 一种电路装置，其具有在至少一个侧面上包括电路元件的基板和该基板中的多个通孔。 端子引线定位在开口中，每个开口具有在引线的端部之间的中心的变形，并且在引线的暴露部分和基板的终端边缘的接合处的焊接区域处与开口的内部隔开。 还公开了将引线组装到衬底的两种方法。

公开(公告)号：US4044201A

公开(公告)日：1977-08-23

申请号：US619971

申请日：1975-10-06

Applicant: Charles W. Wallick

Inventor： Charles W. Wallick

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H05K3/34 ,  H05K1/04

CPC classification number: H01L23/495 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/49541 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K2201/09163 ,  H05K2201/1034 ,  H05K2201/10924 ,  Y10T428/12188 ,  Y10T428/12201 ,  Y10T428/12361

Abstract: A lead frame assembly of indefinite length having a pair of spaced parallel carrier strips, collapsible rungs extending between the strips at regular intervals along the length of the assembly and a number of leads extending inwardly from the opposed edges of the strip between the rungs. The rungs are collapsed inwardly to seat the ends of the leads against the sides of circuit modules previously positioned between the ends of the leads. The lead ends are seated in recesses in the circuit modules and are subsequently soldered to metalized surfaces on the modules. Following the bending of the leads, the carrier strips and rungs are cut away.

Abstract translation: 具有不定长度的引线框架组件具有一对间隔开的平行载体条，沿着组件的长度以规则间隔在条之间延伸的可折叠梯级，以及从梯级的条带的相对边缘向内延伸的多个引线。 梯级向内折叠以将引线的端部抵靠预先定位在引线端部之间的电路模块的侧面。 引线端位于电路模块的凹槽中，随后焊接到模块上的金属化表面。 在引线弯曲之后，载体带和梯级被切除。

公开(公告)号：US20240349428A1

公开(公告)日：2024-10-17

申请号：US18626514

申请日：2024-04-04

Applicant: u-blox AG

Inventor： Anthony Gergis ,  Timo Saarnimo

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/117 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/09163

Abstract: A printed circuit board (100), PCB, comprises a top surface (101), a bottom surface (107), a series of M castellated orifices (102) on at least one of the edges of the PCB, and a series of N conductive pads (103) on the top surface (101) connecting to the M orifices (102) at respective connection edges (104), wherein M and N are integers greater than 1. Each of the pads (103) on the top surface (101) is partially covered by a respective spacer (105) such that an area between the connection edge (104) and a border (106) of a remaining pad area (103′) is completely covered by the spacer (105), and the connection edge (104) and the border (106) of the remaining pad area (103′) have a minimum distance of D, wherein D is a positive number. A solder leaking is prevented between the pads (103) on the top surface (101) and the castellated orifices (102) by the spacers (105).

公开(公告)号：US12114436B2

公开(公告)日：2024-10-08

申请号：US18054157

申请日：2022-11-10

Applicant: SHENNAN CIRCUITS CO., LTD.

Inventor： Zhicheng Yang ,  Xianyou Deng ,  Jinfeng Liu ,  Hegen Zhang ,  Tao Luo ,  Zhishen Wang

IPC: H05K3/36 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K3/361 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/09163 ,  H05K2203/061

Abstract: A composite circuit board includes a flexible board, rigid boards, adhesive layers, and protection glue; the adhesive layers are sandwiched between the rigid boards and the flexible board and used for bonding the rigid boards and the flexible board; the rigid boards are provided with step slots passing through the rigid boards; the adhesive layers are provided with through slots passing through the adhesive layers; the step slots and the through slots are communicated with each other to form a thinning recess; the thinning recess exposes the flexible board; and the protection glue covers steps of the thinning recess and at least a portion of the exposed area of the flexible board.

公开(公告)号：US20240107669A1

公开(公告)日：2024-03-28

申请号：US17952859

申请日：2022-09-26

Applicant: Infineon Technologies Austria AG

Inventor： Darryl Galipeau ,  Danny Clavette ,  Darryl TSCHIRHART

IPC: H05K1/14 ,  H02M3/00 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/14 ,  H02M3/003 ,  H05K1/141 ,  H05K1/145 ,  H05K1/18 ,  H05K3/366 ,  H02M3/1584 ,  H05K2201/047 ,  H05K2201/09163 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: A circuit board assembly may include a first circuit board including a first slot. The circuit board assembly may include a second circuit board. The first circuit board may be interlocked with the second circuit board via interlocking provided by the second circuit board into the first slot.

公开(公告)号：US11937382B2

公开(公告)日：2024-03-19

申请号：US18152918

申请日：2023-01-11

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Woo Ryou

IPC: H05K3/46 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/02 ,  H05K1/0281 ,  H05K1/14 ,  H05K1/147 ,  H05K1/144 ,  H05K3/365 ,  H05K2201/056 ,  H05K2201/09163 ,  H05K2201/10121

Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

公开(公告)号：US11881646B2

公开(公告)日：2024-01-23

申请号：US17413245

申请日：2018-12-14

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： Marco Assale ,  Claudio D'Incà ,  Sergio Lanzone ,  Mara Cosentino ,  Angelo Rivara ,  Sergio Mosti

IPC: H01R12/72 ,  H01R12/73 ,  H05K3/40

CPC classification number: H01R12/721 ,  H01R12/727 ,  H01R12/732 ,  H05K3/403 ,  H01R2201/06 ,  H05K2201/09163 ,  H05K2201/09172

Abstract: An electronic circuit board including a plurality of electronic components mounted on the electronic circuit board and a plurality of electricity conductive paths for connecting the electronic components. The electronic circuit board further includes a plurality of electric connectors arranged in a bank along an edge of the electronic circuit board, wherein each one of the plurality of electric connectors is formed from the material of the board as a finger projecting outside the electronic circuit board. In line with either edge of each one of the electric connectors the electronic circuit board has a cut forming a gap and projecting into the board.